(kicad_pcb (version 20211014) (generator pcbnew)

  (general
    (thickness 4.69)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal)
    (2 "In2.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "prepreg") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "GND")
  (net 2 "+3V3")
  (net 3 "/CHANNEL_1")
  (net 4 "/CHANNEL_2")
  (net 5 "/CHANNEL_3")
  (net 6 "/CHANNEL_4")
  (net 7 "/GPIO1")
  (net 8 "/GPIO2")
  (net 9 "/GPIO3")
  (net 10 "/EXT_3V3")
  (net 11 "unconnected-(J103-Pad2)")
  (net 12 "/REFCLK")
  (net 13 "/LVDS_~{PWR}")
  (net 14 "/LVDS_DEN")
  (net 15 "/LVDS_SYNC")
  (net 16 "/PMOD_3V3")
  (net 17 "/ADC_~{EN}")
  (net 18 "/PMOD Headers/LVDS1+")
  (net 19 "/PMOD Headers/LVDS1-")
  (net 20 "/PMOD Headers/LVDS2+")
  (net 21 "/PMOD Headers/LVDS2-")
  (net 22 "/PMOD Headers/LVDS3+")
  (net 23 "/PMOD Headers/LVDS3-")
  (net 24 "/PMOD Headers/LVDS4+")
  (net 25 "/PMOD Headers/LVDS4-")
  (net 26 "Net-(R701-Pad1)")
  (net 27 "Net-(R1301-Pad1)")
  (net 28 "unconnected-(U701-Pad20)")
  (net 29 "unconnected-(U1301-Pad20)")
  (net 30 "/samplers/ADC 1/REFBTM")
  (net 31 "/samplers/ADC 1/REFTOP")
  (net 32 "/samplers/GND")
  (net 33 "/samplers/ADC 1/VREF")
  (net 34 "/samplers/ADC 1/+3V3")
  (net 35 "/samplers/ADC 1/+3V3_A")
  (net 36 "/samplers/LVDS Serializer 1/+3V3_A")
  (net 37 "/samplers/ADC 2/REFBTM")
  (net 38 "/samplers/ADC 2/REFTOP")
  (net 39 "/samplers/ADC 2/VREF")
  (net 40 "/samplers/ADC 2/+3V3_A")
  (net 41 "/samplers/LVDS Serializer 2/+3V3_A")
  (net 42 "/samplers/ADC 3/REFBTM")
  (net 43 "/samplers/ADC 3/REFTOP")
  (net 44 "/samplers/ADC 3/VREF")
  (net 45 "/samplers/ADC 3/+3V3_A")
  (net 46 "/samplers/LVDS Serializer 3/+3V3_A")
  (net 47 "/samplers/ADC 4/REFBTM")
  (net 48 "/samplers/ADC 4/REFTOP")
  (net 49 "/samplers/ADC 4/VREF")
  (net 50 "/samplers/ADC 4/+3V3_A")
  (net 51 "/samplers/LVDS Serializer 4/+3V3_A")
  (net 52 "Net-(R301-Pad1)")
  (net 53 "Net-(R501-Pad1)")
  (net 54 "/samplers/ADC 1/D0")
  (net 55 "/samplers/ADC 1/D1")
  (net 56 "/samplers/ADC 1/D2")
  (net 57 "/samplers/ADC 1/D3")
  (net 58 "/samplers/ADC 1/D4")
  (net 59 "/samplers/ADC 1/D5")
  (net 60 "/samplers/ADC 1/D6")
  (net 61 "/samplers/ADC 1/D7")
  (net 62 "/samplers/ADC 1/D8")
  (net 63 "/samplers/ADC 1/D9")
  (net 64 "/samplers/ADC 1/OUT_OF_RANGE")
  (net 65 "unconnected-(U301-Pad20)")
  (net 66 "/samplers/ADC 2/D0")
  (net 67 "/samplers/ADC 2/D1")
  (net 68 "/samplers/ADC 2/D2")
  (net 69 "/samplers/ADC 2/D3")
  (net 70 "/samplers/ADC 2/D4")
  (net 71 "/samplers/ADC 2/D5")
  (net 72 "/samplers/ADC 2/D6")
  (net 73 "/samplers/ADC 2/D7")
  (net 74 "/samplers/ADC 2/D8")
  (net 75 "/samplers/ADC 2/D9")
  (net 76 "/samplers/ADC 2/OUT_OF_RANGE")
  (net 77 "unconnected-(U501-Pad20)")
  (net 78 "/samplers/ADC 3/D0")
  (net 79 "/samplers/ADC 3/D1")
  (net 80 "/samplers/ADC 3/D2")
  (net 81 "/samplers/ADC 3/D3")
  (net 82 "/samplers/ADC 3/D4")
  (net 83 "/samplers/ADC 3/D5")
  (net 84 "/samplers/ADC 3/D6")
  (net 85 "/samplers/ADC 3/D7")
  (net 86 "/samplers/ADC 3/D8")
  (net 87 "/samplers/ADC 3/D9")
  (net 88 "/samplers/ADC 3/OUT_OF_RANGE")
  (net 89 "/samplers/ADC 4/D0")
  (net 90 "/samplers/ADC 4/D1")
  (net 91 "/samplers/ADC 4/D2")
  (net 92 "/samplers/ADC 4/D3")
  (net 93 "/samplers/ADC 4/D4")
  (net 94 "/samplers/ADC 4/D5")
  (net 95 "/samplers/ADC 4/D6")
  (net 96 "/samplers/ADC 4/D7")
  (net 97 "/samplers/ADC 4/D8")
  (net 98 "/samplers/ADC 4/D9")
  (net 99 "/samplers/ADC 4/OUT_OF_RANGE")

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 027f53ab-c0c9-4312-954c-f3febd8f6b33)
    (at 198.8625 47.8 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/4722b69c-6fc4-4eaf-8289-f4781627513c")
    (attr smd)
    (fp_text reference "C420" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6666cdec-b95b-420a-a0c6-a29c57428eb8)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp aeb5638a-b1b3-41f9-847b-11ccab5db10d)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp ae68fb17-f581-4467-9b9f-45c764411776)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 4e29f439-cf12-439e-9fb5-6acbbed109c2))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp c9a9de3d-a02c-4168-bb1c-cd5078ca3ae2))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 18b11a81-1647-43d2-9854-4b99ef8ad7ba))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7cfc6798-b2b4-4520-a294-16ced8da61ec))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 80eb878d-05be-43a2-baec-057829e7c3ad))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b31d3764-b365-406c-9e03-871c338b8bc4))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 541ee4c3-5b87-4d1d-89ea-e6106f60da26))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 86be72b9-5358-481d-b564-b80cec1f7340))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9ebe709c-f936-4a19-87eb-f62ba92fb205))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c8ec393c-c92f-4ec5-92ed-a0dcb4295aa0))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp 0992cde2-cae6-434f-bc41-bb0a186b9ad7))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 1e4e5de8-2b55-4434-987c-d6d488d00318))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 04f7df42-e62a-4835-9926-78858c66bbbc)
    (at 189.7 112.9 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/6046fca1-d4b2-42d7-b803-7c47602c8ac4")
    (attr smd)
    (fp_text reference "C1403" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1a2ce40a-4e48-4cb7-a600-e3bc1ad8301a)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7d700a0f-5d39-40b9-b7ac-e6cea2cc161e)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 809d51e8-6eb4-40ea-9601-aafd2179296e)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 29fc9379-94ea-4a5e-b3dc-ed3964364f3f))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp cd2a9af0-330a-44c4-91a4-45859bed95f6))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 276a3405-a152-4e23-8f4f-7d0c95153f4c))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 47d33548-1070-49cd-a1c1-333b89c732c2))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 55917b88-c451-48aa-9293-73abd5d62216))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d4faed96-a067-48d2-8740-452b3d5c2109))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 263f1aac-b840-405e-8d02-dd34808b5bde))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 555a395b-e458-41c4-ab67-1a043f593cc8))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 61e0991c-f4f8-4f23-a609-ec5cf316ccb8))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp e2b7e94c-716b-48e7-ba8a-3223c72dedfe))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 7d9f1850-be16-441f-bf7a-3c39e94aca55))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 3a867337-0797-4189-942d-8ec69acb9820))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 05c9dfc0-a374-42b6-98af-6d79bc72156b)
    (at 186.1 112.6 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/181df231-b3b5-464f-9673-3f2af95e7740")
    (attr smd)
    (fp_text reference "C1310" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c3b9d490-f112-4ff0-9cec-ef4fae206d28)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 21590b4e-8ba3-43a4-88e5-509515c91f6b)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 51ac12a0-f8ae-4da8-8518-05add0f9740c)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 74dd9ff2-4567-478e-b80a-4383fbe33b4c))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp df15a7a8-4e29-4bcb-b629-680e7e3c6cae))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 028fd69a-763c-4c75-b2c3-432d1508beff))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 554c367b-5edb-40ef-bdda-8986933c9683))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 60bf6784-b5bb-49f3-90e7-1a6f8576230e))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp eb966dd7-4072-4b74-9e7e-72ff93138d5f))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 037469db-ffc6-4b1d-8db9-27bb6582a7eb))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 818a4680-dc21-4a53-9954-ab94b0ec7408))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 86efdd0b-8458-4e95-a973-b0e96eb65e4b))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 98c9b180-7971-417e-840e-6a6fbd15b075))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 4f5dcc9b-d016-4c2e-afad-79d62290a8fd))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 50 "/samplers/ADC 4/+3V3_A") (pintype "passive") (tstamp fee06cf3-f1af-4b70-917d-c06da6f73810))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 077864be-740f-4d3c-99a7-4e6a0fe2efc5)
    (at 178.7625 50.9 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/16a9bd5f-0bfa-4f42-8382-27d5a088e9b7")
    (attr smd)
    (fp_text reference "FB301" (at 3 2 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 79942d63-1aa7-41f3-92f2-ab8dbe9cb0f6)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5ebdd6b5-0fef-4475-b8f5-db1e190286ce)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 9e0e016b-12f3-447d-a169-a51d68d226b4)
    )
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp 9b298a81-faa8-4757-9e8b-dd70edb1b656))
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp a3dd76e7-4ea0-499c-82e8-ab41506b3a15))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 11963aa8-7ede-41df-a4df-e46b0dff5ef8))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 16310fc9-c8c8-48fa-8261-9c90a2463326))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 429288aa-a5cc-4159-95f8-9e6ce8387992))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b14493e3-893f-4bca-96b8-95e5e21784d0))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 1189f86a-c8c0-4608-8803-9214cbce1f08))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 32e50896-ebda-4fbe-b8e2-bdf0de6bb853))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 6de38396-4be0-4991-952c-59bddfa5c421))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp d4d7e5bf-4ae4-4755-a1d1-7f48c829ab5e))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 6a110b89-447e-4e44-9087-726ef7161062))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 35 "/samplers/ADC 1/+3V3_A") (pintype "passive") (tstamp 9ebe4fdc-50b6-49a5-97d3-4a6e3851d279))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 0ac25265-af34-4f9f-95de-e81c43d0a19a)
    (at 171.4 86.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/d21d427f-890e-427f-b79e-77f66923f259")
    (attr smd)
    (fp_text reference "C706" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c103c3a3-b015-401c-9aca-be142a93861e)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1165037d-4920-4b2b-aba2-acc9e16c505e)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp aedf1837-29d2-4216-8250-7ed509097302)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp c3d21486-f024-4aaa-a384-e74f6f1321c7))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp c9530f42-8186-43c0-ab9c-1c0eb3efa2bb))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 60eebdd1-6e4b-473b-8abe-f2cefa7b3632))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8202ce45-2eb5-4c80-9ce9-5f5c4b4d5094))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9241a282-b461-4d78-b5d4-0ceb01d9fcb5))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c2fc7d41-9b9e-4713-af45-2869c0cedf5f))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp b54efa8e-b646-4b13-9f33-5799a9118438))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c446b5d4-7ae0-4bad-8e70-5acad82686ca))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c5f7e6fd-cdd2-4d61-a24e-db81d3c17f0a))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp eca5a69d-1eb0-4e06-bc7b-6d2cdfc2b1bb))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 7cc8bc55-087a-48d6-a782-1c018f2c2390))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 42 "/samplers/ADC 3/REFBTM") (pintype "passive") (tstamp 6add4e68-f507-463f-a03c-8e596d261b08))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:SSOP-28_5.3x10.2mm_P0.65mm" (layer "F.Cu")
    (tedit 5A02F25C) (tstamp 0df90ba1-a88c-43d2-a753-05e57ce06ae3)
    (at 194.4 85.4)
    (descr "28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (property "DPN" "296-21243-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "SN65LV1023A")
    (property "Manufacturer" "Texas Instruments")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/2ad0fe99-7922-4fbc-bd4d-010a935ab389")
    (attr smd)
    (fp_text reference "U801" (at 5.5 -3 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp af7c8b00-f9d3-4034-9ef8-ff7aa1543ed9)
    )
    (fp_text value "SN65LV1023A-EP" (at 0 6.25) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0774c1b9-9adf-44ce-a433-3f90ba20c336)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15)))
      (tstamp b8a598e8-da81-4d91-9c8b-51f918bdcadc)
    )
    (fp_line (start -2.875 -4.75) (end -4.475 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 47e2e135-c3bf-44ec-ae25-43a070a22d78))
    (fp_line (start 2.875 -5.325) (end 2.875 -4.675) (layer "F.SilkS") (width 0.15) (tstamp 60d32afa-c112-42f4-8d15-63cd694c4214))
    (fp_line (start -2.875 -5.325) (end -2.875 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 645c0e3f-3a75-44c7-bf6c-44b62fca59eb))
    (fp_line (start -2.875 5.325) (end 2.875 5.325) (layer "F.SilkS") (width 0.15) (tstamp 948bd018-00cd-4526-b576-cbb8223b0c06))
    (fp_line (start -2.875 -5.325) (end 2.875 -5.325) (layer "F.SilkS") (width 0.15) (tstamp 9d8f4c03-edc6-48cf-a95c-e628b89820c3))
    (fp_line (start -2.875 5.325) (end -2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp ab16a61d-5421-466b-ba14-615f456b70e0))
    (fp_line (start 2.875 5.325) (end 2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp c0dd6bd7-5cf5-4c8b-b37f-cb0560f2fac6))
    (fp_line (start -4.75 -5.5) (end -4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 6114bda0-0558-4609-b536-da6ec574047f))
    (fp_line (start 4.75 -5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 9bbcd561-e207-4444-860b-52b0d881694f))
    (fp_line (start -4.75 5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp d4558ee1-4863-416b-afa0-4531fa8ee85f))
    (fp_line (start -4.75 -5.5) (end 4.75 -5.5) (layer "F.CrtYd") (width 0.05) (tstamp e3884922-719c-4e44-abc2-1ea27a773f8a))
    (fp_line (start -2.65 -4.1) (end -1.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp 25acbc68-cf6d-48fd-95bf-ba0082cf87c3))
    (fp_line (start 2.65 -5.1) (end 2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp 3abc5ba8-0754-40c9-be51-e504e64cbe37))
    (fp_line (start 2.65 5.1) (end -2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp 72bbb41e-bf18-4a13-a61b-ef6e693d3855))
    (fp_line (start -2.65 5.1) (end -2.65 -4.1) (layer "F.Fab") (width 0.15) (tstamp 77872ca2-39de-4957-b3b5-194a7cf8c624))
    (fp_line (start -1.65 -5.1) (end 2.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp c0e28525-9247-4590-a770-439a0dc13d54))
    (pad "1" smd rect (at -3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC1") (pintype "input") (tstamp 3a2cbba2-0fad-4e9a-b9db-bba5176e8abe))
    (pad "2" smd rect (at -3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC2") (pintype "input") (tstamp 5c51eef1-5362-47e6-b9dc-76faa2246d28))
    (pad "3" smd rect (at -3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 87 "/samplers/ADC 3/D9") (pinfunction "DIN0") (pintype "input") (tstamp 7cef7d56-e34e-4feb-83c8-770574f0d839))
    (pad "4" smd rect (at -3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 86 "/samplers/ADC 3/D8") (pinfunction "DIN1") (pintype "input") (tstamp 40a15fcb-4966-4849-a250-ec31a06d9695))
    (pad "5" smd rect (at -3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 85 "/samplers/ADC 3/D7") (pinfunction "DIN2") (pintype "input") (tstamp 654774c4-b24d-4e2b-ae2b-1c99cabe15cb))
    (pad "6" smd rect (at -3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 84 "/samplers/ADC 3/D6") (pinfunction "DIN3") (pintype "input") (tstamp 1606f95a-e2ea-4aa7-ba9a-d2c49e4a915f))
    (pad "7" smd rect (at -3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 83 "/samplers/ADC 3/D5") (pinfunction "DIN4") (pintype "input") (tstamp 89d50a85-3098-42e7-91b3-82c6a04a04a0))
    (pad "8" smd rect (at -3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 82 "/samplers/ADC 3/D4") (pinfunction "DIN5") (pintype "input") (tstamp c37a9a91-864b-4bed-b78b-5406f0128baf))
    (pad "9" smd rect (at -3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 81 "/samplers/ADC 3/D3") (pinfunction "DIN6") (pintype "input") (tstamp bde7a8b7-a076-4dd9-b1de-2a4df45ee753))
    (pad "10" smd rect (at -3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 80 "/samplers/ADC 3/D2") (pinfunction "DIN7") (pintype "input") (tstamp 660b38ac-e248-48fa-b0f8-e765929fed02))
    (pad "11" smd rect (at -3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 79 "/samplers/ADC 3/D1") (pinfunction "DIN8") (pintype "input") (tstamp 8613698b-340b-4144-aa9e-b6422e85ad31))
    (pad "12" smd rect (at -3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 78 "/samplers/ADC 3/D0") (pinfunction "DIN9") (pintype "input") (tstamp e6596bbb-4621-4f54-a4d8-1c15013152fa))
    (pad "13" smd rect (at -3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "TCLK_R/~{F}") (pintype "input") (tstamp c1eacf20-a451-4288-b1a9-88658b13e442))
    (pad "14" smd rect (at -3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "/REFCLK") (pinfunction "TCLK") (pintype "input") (tstamp 978d7bfa-e056-47e4-967a-46ccf68f91a0))
    (pad "15" smd rect (at 3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp 7dfa59ab-2aa8-4270-986f-56ddecc6e4b2))
    (pad "16" smd rect (at 3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp 151c62ca-28c9-46b7-9d66-94fb08ea5fdd))
    (pad "17" smd rect (at 3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp cfd84e7e-ef34-4ef5-9cb8-f9bd0a6d9c14))
    (pad "18" smd rect (at 3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp c0b8ca54-fb96-416c-9095-0541b58b926d))
    (pad "19" smd rect (at 3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "/LVDS_DEN") (pinfunction "DEN") (pintype "input") (tstamp d8979218-1cc5-4e02-b668-1c3ff5f4c9ea))
    (pad "20" smd rect (at 3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 87b22df4-bc84-4fb4-b704-abe8e6b6905c))
    (pad "21" smd rect (at 3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "/PMOD Headers/LVDS3-") (pinfunction "D_{O}-") (pintype "output") (tstamp feebc787-71b3-4394-8170-6b7c86ac99f6))
    (pad "22" smd rect (at 3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "/PMOD Headers/LVDS3+") (pinfunction "D_{O}+") (pintype "output") (tstamp 619137ea-8127-434a-ae02-5c9e7d7380c6))
    (pad "23" smd rect (at 3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp db9c60a1-29f1-4fde-ae4e-3f71965e7606))
    (pad "24" smd rect (at 3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "/LVDS_~{PWR}") (pinfunction "~{PWRDN}") (pintype "input") (tstamp 9dbe14c5-cd1c-44bc-8ebe-567848a54d81))
    (pad "25" smd rect (at 3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp a1158acd-3010-4972-a9f2-6a232196f481))
    (pad "26" smd rect (at 3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp 799f96a2-6f72-4ede-ba7c-7b54b178f67e))
    (pad "27" smd rect (at 3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 75360e58-7868-4e51-96dd-21b7dd2f27f5))
    (pad "28" smd rect (at 3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 0c60a9ba-a1c2-47af-92c2-97a6035ffd26))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SSOP-28_5.3x10.2mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 103b966b-4b4c-4672-a5b3-b7e8e99e7445)
    (at 170.7625 45.2)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/d21d427f-890e-427f-b79e-77f66923f259")
    (attr smd)
    (fp_text reference "C306" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c39e9c42-41e6-49c4-a1d8-4f95c6606eb2)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 06670c61-47da-4ae1-a26a-14361545d682)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 69772f63-7245-49a4-b993-d856184bf6da)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 1d994bca-4e36-468e-b43c-ed46fe84bcdf))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp b6b2e93e-578d-454d-b50c-4b3d387fc09e))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 48a17653-b840-42b2-a687-46ec942f8bd2))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6664ebda-c204-47aa-aa9d-59294297e680))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8258b579-0c2d-47b0-92fc-eb39227652df))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d93d79aa-8d7f-420f-8e61-d8dfe0e5d314))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 22d35a4d-cf5a-44c7-b631-a6c0bfce6f4c))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 2c57aad3-d563-4876-bb59-8bc4e26b7410))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 97e96cdc-ebad-406a-be8c-1ce71bdd5af6))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp bb6c9896-2f9d-4f86-a48f-a044a1e614a8))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 3cbfcdd8-4c49-458b-aba0-72b14b8dd692))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 30 "/samplers/ADC 1/REFBTM") (pintype "passive") (tstamp 3bb6352a-7ccf-4a71-8d42-82a0f0a39d99))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 19011dd4-1198-4b61-b241-997830f02df6)
    (at 192.1 92.7 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/24a80803-e577-410d-8e7a-d233a60ea115")
    (attr smd)
    (fp_text reference "C810" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 502101cc-7459-4be7-b1c2-8d61bd7229bb)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3362c29c-1784-4be2-9f95-580f6a969424)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp d79facf4-a82c-4b01-8431-1fcfba94ef48)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 6452bb81-fb92-4c0f-9440-f28c531e4951))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp fc1766e5-c8b3-47c1-8d90-2ab1956d1d7e))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5f5827d9-8239-4ad7-a23d-e63e1bb2b12d))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a968344c-ccd5-4689-8381-1bce44f4491f))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp af454244-71cf-425a-8fb1-f2a4fe233cbc))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp bcd8f34c-d171-4a37-864b-c59a7cecd18d))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9bdf8a98-c45e-4d13-8187-9dc031b80a13))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c97feb4f-e88c-4f34-9540-10f8703a69ca))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp d2c331f3-634d-4610-bc99-bf48f1e3a80c))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f5678840-df70-4479-9167-3f245a69ee02))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 3f4e19ee-96ee-4a77-87fc-e92fb1ebddac))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 1e4a14ed-920a-4e93-9fdb-1abba89aed70))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 19fd3949-f706-4e0a-b7d5-1b4ce9bdb00f)
    (at 197.5625 50.4 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/a41a4a91-9b32-4e57-84de-62d74310a1e3")
    (attr smd)
    (fp_text reference "C413" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 687ab3de-36ba-4191-9142-e1978abe59a0)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 023ddb20-dee0-4cb2-9891-e2062d0bb88f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp f2b9a0ab-b837-46ec-a147-efe3aa31abc3)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 56428770-0685-4824-a551-68b01718e9e4))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp bfcb3b97-ec83-4e17-925b-3ebd33912571))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1b7c3127-b30a-45ff-957c-0e670c9bda76))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 52a55fd6-38dd-470e-8d5e-6972c3663ee9))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7c0a9fd8-ffa4-436a-8d82-3da1f5df47e9))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b271795c-1e35-4d2c-9f5d-0d94545d9b4c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1cf352a9-8b53-42aa-bca6-5fe268b31634))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 7f76ea5d-2f4b-4726-b45e-5045c9b92de8))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9445e6b6-8625-4532-adec-9db6ee920b07))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f997eec1-5518-4300-9d5c-bda2f687e8ad))
    (pad "1" smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 3b2b6473-b37e-4b0a-8794-1566f4fe3e7c))
    (pad "2" smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp 30ebd9ff-f5ef-4604-b4fb-dde02daf43a5))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 1a856b01-26d7-4d47-a087-faf682c8ce4f)
    (at 175.1 102 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/4c3e582c-dee4-4ebb-a1e9-7c647c777882")
    (attr smd)
    (fp_text reference "C1305" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8cf9c424-12da-4559-9507-a322cf21bc4a)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b8f26176-ad8a-4ce7-a2eb-fb29d171a5e8)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp c68a6b3d-ed50-4799-8893-2332c46111d6)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 31266aff-1f11-4a66-93de-e3c897421741))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 919f54d6-ceb8-4dd5-ad37-f45276d7541e))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6f40999b-575a-4a61-a13c-b223c719627f))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 961316a7-e18d-42ca-9eea-6698410cc4cf))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp e9d28ca2-efeb-46a6-88bc-dadd0c357a18))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f52586e8-4db0-45fa-8a8c-e023efbddebc))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 0df9581a-5f92-4ad4-95cf-cdf01f092253))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 16e1fbcf-54a8-4a13-811e-9d8a7924f78c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 2dc654f3-9fb1-44c0-b5bf-92ca9728baa4))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp da9d6efa-8da7-4114-8f14-c2466763c60e))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 823286bd-a105-4809-bf6f-e79279f348a6))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 48 "/samplers/ADC 4/REFTOP") (pintype "passive") (tstamp 86235dd2-cdc5-46d2-adf9-083b7c389b6c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:SSOP-28_5.3x10.2mm_P0.65mm" (layer "F.Cu")
    (tedit 5A02F25C) (tstamp 1b7badc6-30ab-46b9-99e7-28c468093c85)
    (at 193.6 105.6)
    (descr "28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (property "DPN" "296-21243-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "SN65LV1023A")
    (property "Manufacturer" "Texas Instruments")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/2ad0fe99-7922-4fbc-bd4d-010a935ab389")
    (attr smd)
    (fp_text reference "U1401" (at 5.5 -3 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp bf64e899-aec0-401b-a96a-ee7df547956d)
    )
    (fp_text value "SN65LV1023A-EP" (at 0 6.25) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp dec3e1f8-4ef8-4c98-a7f8-daded48d7052)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15)))
      (tstamp af9da14a-b6a4-4941-adc1-b1bcfe44a1bc)
    )
    (fp_line (start -2.875 5.325) (end -2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp 1ee8dbcb-3f73-472d-aed2-b66e57685746))
    (fp_line (start 2.875 5.325) (end 2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp 2322a0f1-417a-42ac-845f-b39fe766fffb))
    (fp_line (start 2.875 -5.325) (end 2.875 -4.675) (layer "F.SilkS") (width 0.15) (tstamp 43ca5146-a8a3-402b-89db-eb3f46972a94))
    (fp_line (start -2.875 -5.325) (end 2.875 -5.325) (layer "F.SilkS") (width 0.15) (tstamp 6482b585-efdc-43ec-9318-9bd64876828f))
    (fp_line (start -2.875 -5.325) (end -2.875 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 9e7923b8-61b6-4835-bf4e-e4463819a095))
    (fp_line (start -2.875 -4.75) (end -4.475 -4.75) (layer "F.SilkS") (width 0.15) (tstamp c6097ca6-620a-4c33-8900-db3e7b1af13d))
    (fp_line (start -2.875 5.325) (end 2.875 5.325) (layer "F.SilkS") (width 0.15) (tstamp f98319aa-d0d1-4e02-8b1b-b9c834a976f7))
    (fp_line (start -4.75 -5.5) (end -4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 22c4f356-14f9-454a-9a17-7fa429b7979e))
    (fp_line (start -4.75 -5.5) (end 4.75 -5.5) (layer "F.CrtYd") (width 0.05) (tstamp cb5e196d-7a55-40d3-8180-031dcabc69a9))
    (fp_line (start -4.75 5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp cd54bc2f-4fdc-4d01-9c0d-d37e0e2812da))
    (fp_line (start 4.75 -5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp ddf046c9-6609-454c-9a62-327a89bbd29b))
    (fp_line (start -2.65 5.1) (end -2.65 -4.1) (layer "F.Fab") (width 0.15) (tstamp 58c58279-3545-4f0a-a960-673a338e0e5e))
    (fp_line (start -2.65 -4.1) (end -1.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp 8e231c99-329d-4630-982f-5dd1ddbdfe5f))
    (fp_line (start -1.65 -5.1) (end 2.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp b170d373-c1cd-4feb-8c4f-81d5c9024c83))
    (fp_line (start 2.65 -5.1) (end 2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp b8107622-69a4-4440-82c5-d8ec3fff0897))
    (fp_line (start 2.65 5.1) (end -2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp d93a6f61-3c36-4005-a03a-0fd2c1b35bc1))
    (pad "1" smd rect (at -3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC1") (pintype "input") (tstamp 9a03c201-4ced-4086-86e0-a822553b27fe))
    (pad "2" smd rect (at -3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC2") (pintype "input") (tstamp 13af91a1-cd0a-4ab9-884e-de2b34e0f50c))
    (pad "3" smd rect (at -3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 98 "/samplers/ADC 4/D9") (pinfunction "DIN0") (pintype "input") (tstamp 1cf82eac-5061-4e14-9ff5-077ba683e987))
    (pad "4" smd rect (at -3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 97 "/samplers/ADC 4/D8") (pinfunction "DIN1") (pintype "input") (tstamp e3a9b641-78e4-4f3e-8476-e60ddbee178c))
    (pad "5" smd rect (at -3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 96 "/samplers/ADC 4/D7") (pinfunction "DIN2") (pintype "input") (tstamp f61669d5-c38c-4334-a2ee-be3ca62a35c2))
    (pad "6" smd rect (at -3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 95 "/samplers/ADC 4/D6") (pinfunction "DIN3") (pintype "input") (tstamp b08493bb-b647-4892-a618-ecf40e7b4e3d))
    (pad "7" smd rect (at -3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 94 "/samplers/ADC 4/D5") (pinfunction "DIN4") (pintype "input") (tstamp da6ad378-1950-4655-8f7e-6eec66ec80e3))
    (pad "8" smd rect (at -3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 93 "/samplers/ADC 4/D4") (pinfunction "DIN5") (pintype "input") (tstamp 767e8167-b1a0-4ad2-aeaf-f81e5fc8394b))
    (pad "9" smd rect (at -3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 92 "/samplers/ADC 4/D3") (pinfunction "DIN6") (pintype "input") (tstamp 911aa32a-64b2-4bd4-8724-41c33145b20c))
    (pad "10" smd rect (at -3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 91 "/samplers/ADC 4/D2") (pinfunction "DIN7") (pintype "input") (tstamp fee9776b-a502-4e47-9075-73275d0b77a6))
    (pad "11" smd rect (at -3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 90 "/samplers/ADC 4/D1") (pinfunction "DIN8") (pintype "input") (tstamp 128a5d13-97a6-4fc7-a969-67bc6a2cddbf))
    (pad "12" smd rect (at -3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 89 "/samplers/ADC 4/D0") (pinfunction "DIN9") (pintype "input") (tstamp 57da8296-7855-4f6c-b59e-08e0d132b94d))
    (pad "13" smd rect (at -3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "TCLK_R/~{F}") (pintype "input") (tstamp 91c8b152-ff37-42db-aaae-6b7f68a3f06f))
    (pad "14" smd rect (at -3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "/REFCLK") (pinfunction "TCLK") (pintype "input") (tstamp 5d48279c-8c86-4eba-803c-e2dfe97ae239))
    (pad "15" smd rect (at 3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp f919172a-5a32-45de-a598-5c92df492da9))
    (pad "16" smd rect (at 3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp 94c4a831-3604-4992-afae-69a9d8d83e47))
    (pad "17" smd rect (at 3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp 17273662-17e7-4be5-8701-adf644737c29))
    (pad "18" smd rect (at 3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp faf0e7ee-cc3e-479d-98cf-8c63c3a473e0))
    (pad "19" smd rect (at 3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "/LVDS_DEN") (pinfunction "DEN") (pintype "input") (tstamp 42ea50eb-0e40-4ec7-a5e4-a96a4e543836))
    (pad "20" smd rect (at 3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 5ddabb67-31b0-49db-9af2-665b39388f6b))
    (pad "21" smd rect (at 3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "/PMOD Headers/LVDS1-") (pinfunction "D_{O}-") (pintype "output") (tstamp c7e7aa81-8ad9-49cb-9236-806a3d6bb17c))
    (pad "22" smd rect (at 3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "/PMOD Headers/LVDS1+") (pinfunction "D_{O}+") (pintype "output") (tstamp 1a4a36e5-f992-4f5e-bb2a-676626effa07))
    (pad "23" smd rect (at 3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp e24d1e02-46bb-4fc4-842c-f93a45c033d6))
    (pad "24" smd rect (at 3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "/LVDS_~{PWR}") (pinfunction "~{PWRDN}") (pintype "input") (tstamp 26c06cff-933e-4375-839c-abc71a1b67eb))
    (pad "25" smd rect (at 3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 84609d92-5e3f-4a9a-afb4-042f2edba740))
    (pad "26" smd rect (at 3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp f3e189f9-8259-4034-af35-f67ad4ace406))
    (pad "27" smd rect (at 3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 846fd885-0a36-4ed6-86de-7222840637bb))
    (pad "28" smd rect (at 3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 7d716839-a2a5-4bc5-b7f0-2d1426f6a53e))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SSOP-28_5.3x10.2mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 2202d502-47da-4c51-9676-555861ed6233)
    (at 189 71.9 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/6046fca1-d4b2-42d7-b803-7c47602c8ac4")
    (attr smd)
    (fp_text reference "C603" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5c1c2952-8e30-4ff6-bc27-003759980cc2)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 24f93003-e66f-4540-9f28-a9f22a57d720)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 3fe5b875-762d-4712-91e0-a984a402972b)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 22cd0ee1-9ad9-44b6-93cf-86267bf5748b))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp bc992567-ad64-4298-8591-3ff6d5539042))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2240ff2b-ac48-467d-9adc-a94a4856b2bf))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3998ebdb-ffa4-48b0-999f-7d38eea0b8a5))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 93f6cf84-56fc-48a5-8e09-fe3de77ef2fb))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp eda35d4c-28e0-4e15-ba42-cd01f4053d34))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9740cfa2-eb17-425c-8524-48439cf252e6))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a29697d1-9b98-4598-830f-8228b32eeccd))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f2c5b4b3-eac5-42cb-8a3f-0cf88bd023d5))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp fb2c8a94-3d65-48d3-88fe-7c3fb600117c))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp f415735d-0730-4fae-979a-18eeefffea0d))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 3d44d154-88ad-4d4a-9234-6635221db60b))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 25ae13ca-ce11-488b-82ea-758d47f011d5)
    (at 190.6 71.9 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/24a80803-e577-410d-8e7a-d233a60ea115")
    (attr smd)
    (fp_text reference "C610" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6b132d20-a529-4bd3-b9ee-cab67f96dafc)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp dd9febbf-eeff-4fb7-bf95-662b955e3a1c)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 13dca180-c54f-4a43-a97a-00c44744d883)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 2c10ac1c-c4b5-4ce8-830e-5d4169a6bc48))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 940dc2ad-a876-4586-ac4c-048633cd2588))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1214fbcb-8384-4d3d-91f3-f725d44adf76))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2ed2d19e-8196-47d9-9f5c-230bc0213db7))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 39e8e5f6-9777-43a8-b4db-1068e9c84f05))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp c5ffb2eb-3514-436c-a228-b6aa6c973835))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 14f10b6a-1c53-4784-be4f-54c89150a7d7))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 63608eff-82aa-4ad3-befb-0476ce1ac615))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp ac4f0cfc-b05f-47b7-9171-b1d6b9218189))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f20e1ddf-3ce6-4661-9e84-bddf82fa04c0))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 8bcef1ef-1e87-40af-ae73-798af4d5bf65))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 4bcd1112-c4c8-445d-b08e-912b60b1d381))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 2631f384-ee07-4b2e-96a4-182db54a0653)
    (at 182.1 112.6 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "311-2595-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "RT0603DRE07499KL")
    (property "Manufacturer" "YAGEO")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/048d1ca6-5643-4c50-acf7-be4ef6123b63")
    (attr smd)
    (fp_text reference "R1301" (at 2.9 -1.7 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 60b96a79-a7f3-47da-8c09-561a05814883)
    )
    (fp_text value "500k" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 410cf992-aed1-4f0e-b90b-c6be74c63e1e)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 074e21e8-7d75-4acd-9537-bc03ce5efd09)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 1ec90f22-54c2-4db0-9994-6353a4099a4a))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp b20370c4-c703-4859-bd4a-31cff681bc85))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1b108b23-ae39-40fd-b6b7-545d7a34ba77))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5789d14d-8f15-4fa4-8be5-063e20096ce1))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 984015a8-3d40-4c04-9c94-1d611de19073))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e5a6edf1-9802-4882-8c81-e83bc9d57ec6))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 07cc7152-3d9f-45a3-8e7b-cfde2e7756ea))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 404d1272-eadd-49f0-8a26-519a9537d8a2))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp c00556e1-e7cf-49d7-b523-ef14dc24b619))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp d89b541f-06cd-4860-8d71-047dd9c1c73b))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 27 "Net-(R1301-Pad1)") (pintype "passive") (tstamp bd0265f1-a5fc-4d1a-979e-c8759778ac5c))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 18e1aa4f-247d-4f99-a2f3-ef25c219264b))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 270f6924-39a5-4c6f-836f-2df73ce8687f)
    (at 171.7 63.3 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/a6a7d54b-0b0f-494c-857b-7a8e7f66dd80")
    (attr smd)
    (fp_text reference "C504" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d03fd9b5-6ee4-4afb-b8d6-6694fe5e81e9)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 29b4b4e9-5a77-4ea6-872c-8bd32828bbd8)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 1ee100da-bf86-42dc-8f1b-6f602a309a4a)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 1f8071bb-5cd6-4dae-9c13-00519adecf2e))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 71465b9f-a713-488b-9dd3-937093207466))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 558c020a-8644-4fd3-844b-8d7cb316de94))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6e26a7e0-e9d4-40a6-9482-aaf57d5a07f6))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 97a2d1a6-6a40-484e-9fec-ff7e122e3d65))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b31b1559-7141-49f1-aa3e-778b43405941))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 909e2a5a-e0fe-4284-9d5c-74986a82e4d7))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp c97ff23f-d63b-4349-b9e8-e42438d29e3a))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp ea23a404-b75f-407d-a10e-89c14eb078d7))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp fe7b0a22-ace3-47ed-834b-09ebb38a9589))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 38 "/samplers/ADC 2/REFTOP") (pintype "passive") (tstamp 039d44e0-9cb0-4f17-80b8-ccbfa30b7c23))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 37 "/samplers/ADC 2/REFBTM") (pintype "passive") (tstamp ab66060b-d93c-4a00-a88e-d5c32b3cc88a))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 2b76c4e0-080d-491e-bfc2-8d666eb11f05)
    (at 169.7625 42.4 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/c10ee28a-e11f-437a-b965-ac764d416b6f")
    (attr smd)
    (fp_text reference "C301" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 55776d38-9d9c-4c8e-85ba-2299703919f9)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1a7caa6c-acae-4284-80d3-e9e41bdbeb99)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 78e049f7-8efd-41e3-bcc7-8f0ec467bbb4)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 1a8e2b11-6d30-4a7d-beb1-23c6f4758d8e))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 3a1db72a-24f6-40ec-8255-61793e3e3f69))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 02446f81-1126-433e-96bf-b15fa3ad0843))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 51f0f5a3-fe1c-4097-a255-469fbe7849f9))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 80bb0e94-6fad-46e0-8ecf-f25a2e087022))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp c0d27f56-3585-4161-baa8-1fe86fbba10b))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 21f9225e-ff25-4e73-a65e-d3f15d7709f0))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 7af65a1c-8a98-4b50-87f4-a374bb387dfd))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 89bbcf3d-a453-4cd6-8896-85bf69cee913))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp ec2ee903-3abc-4c19-b4ee-ebb51cab0808))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 30 "/samplers/ADC 1/REFBTM") (pintype "passive") (tstamp b7cbb040-f063-4d6c-81b7-789555fb0136))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 31 "/samplers/ADC 1/REFTOP") (pintype "passive") (tstamp 2e5ccfef-c117-414f-a7a9-32ace6878467))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 2ba3c8f8-bcbe-4102-a5bf-8928c529832b)
    (at 201.8 89.3 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/10b59b44-25f0-4aaf-a2da-c29e1b1eb698")
    (attr smd)
    (fp_text reference "C814" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2df1cc27-c859-4055-9747-746d81b4e4ab)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 70bcfc2f-7c55-46b6-b1d1-7f56bf078061)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 2a82384b-dd19-494e-b91f-de59f7c134df)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 22a6456b-1ba8-4bc6-ab6f-14d19fcf9655))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 4e5dc189-dc48-4e42-bb24-b1d1c73327d2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 640f1bac-b5d9-44ab-9812-a4cf495070ce))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp be6d6195-fbd2-461e-a9b4-c6c90083a1c1))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp db214baf-7a5f-49fa-96fa-2683db68fb1b))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp eea8cbd7-7f30-4d21-9456-355a0108843e))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 079df68e-bb78-4df3-8400-52ca661d5371))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 3cce8406-5dbc-4d4f-a563-f049922e173b))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4bbf6b1e-e525-4135-a191-8e31b1e8c9b7))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp bce9cb2d-f1e9-48ee-a156-21d7bb6df4e2))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 452e5615-aa21-4ccc-b9c0-5049b5c07fbc))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp d2600c28-3e03-4edf-af50-ab6e5c1246f9))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 2bc8e8da-11fb-4ced-917b-2755fdce1f23)
    (at 198.6 68.5 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/4722b69c-6fc4-4eaf-8289-f4781627513c")
    (attr smd)
    (fp_text reference "C620" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4f05f655-afaa-473d-ac68-7f7eb1240fc6)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ea3bbb10-47fa-42a2-8f18-e197be326b17)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 51dc8107-f233-4e5b-a673-9018ae28f442)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 68097fc6-91ce-48c7-a809-7f04d1427245))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp a1103490-f214-49a4-9877-b59c18c5c291))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 86e5fba2-51ed-4396-afc3-88c6419a8748))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d65dcbda-b05a-4d37-9b59-dbf22a17bbfa))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp d6e13950-4d68-4167-b353-038d208887e7))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp e84f6132-688c-4d55-bd4d-b9ce3edb5575))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 53a5d99d-ff09-49be-86dc-b3b31cd17d7f))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 54d26ed4-8696-44b7-857a-b2d7dde93139))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp af13c2f9-c6e5-4b70-83f2-ce201fb17d40))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp ee801d55-ff0c-43e6-b10b-6bd4504aff36))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp d318955c-40b7-4030-8d14-2cac65f7918b))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 6deb8714-94de-45a5-aa5c-b803c3b02569))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 2d6d4c37-d991-430f-a0a7-a3dccff7329f)
    (at 176.8625 50.9 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/cc8d276b-090a-453c-85c5-9e95f587b7e7")
    (attr smd)
    (fp_text reference "C303" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c7a96968-6469-465c-85ec-2eb50fbf181a)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6d31f711-5f1f-47c2-8479-9c6714d16444)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp ac393f2f-d728-48f6-a24a-45242b32cce7)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 89e9a57d-29a1-4498-8e3b-4486ad83babf))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp a4362dbf-8380-455b-b4ce-2d3125cf7d00))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1a4d19db-82d8-4b02-bec2-8879ecaa87af))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 442a215d-17de-4de1-abd4-013a8793abfa))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 4ba531cd-3745-44f1-9857-578fb78aa7e2))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e29b76c4-05ba-42ee-a716-7da60e50cfe3))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0f732cf6-861d-45f2-94d6-9b0ad8aca1a3))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 33e755ac-3c40-460b-bb41-cf1750e613a8))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp db92895a-7774-4f55-86ca-2e7b54511f22))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp fb5d10b9-98b4-4f9d-be03-2a70e6c1eb52))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 377e0718-5b66-420f-a816-c8502c7867c0))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 33 "/samplers/ADC 1/VREF") (pintype "passive") (tstamp f5aa4693-64fe-456a-a348-26f8826a2ab2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 2da89ceb-993f-4c19-aea2-5cc2d2db4302)
    (at 196.9 57.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/527e65c7-d8ea-4621-b262-27c54a4daaf9")
    (attr smd)
    (fp_text reference "C605" (at 2.4 0.2 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5e86e28b-15f2-4fe3-9993-67de2da1cd9d)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 28b2536c-4bd9-4de7-a125-19f3cc75e098)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp bb9496af-d59e-4aad-8b5e-b01ea1e882c1)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 215fcc84-67e2-4ad4-ada6-e674753f981d))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 9d864cdb-c9b0-4135-ab54-3d299cb1f852))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1799a32e-6d98-47be-bbaa-9c66725ca50f))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 27c568a9-2d23-466e-9f1d-e7420de8b722))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d8d5c02e-fd9e-43ba-9937-44e1608c0f39))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp edc9f3d5-66fa-431c-8f8a-658e01db11fd))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 2c28aeb1-6ca3-4051-930b-b55985263f31))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9f436498-93f2-402a-b344-d02c8c173b2f))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp c19388a9-f1cf-48a7-a705-8be992517974))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp e8ba7fc3-a84f-41ee-9c87-c71af4bf3ce6))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 46a25333-4386-4287-aa6f-4c490009fc26))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp ff25c58d-f549-49e3-bcd8-d12202c5f111))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 353b9e9e-d650-40f0-a32f-e80924ebabe3)
    (at 190.2 57.2 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/71d155fd-ad28-40c9-908e-51e07e9fd843")
    (attr smd)
    (fp_text reference "C618" (at -4.9 0.2 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ba47c3f1-276d-44e3-a99f-8baeee0c8b2a)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 590f1095-d3e0-4354-b647-c688d286faf1)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp aa8d123f-6f3c-44fd-b98a-0f14178de996)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 88e20537-0b49-4ba8-a6a2-a10b19f9d684))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp e8c20ec8-ae0b-41c4-8be4-a89a0a28aa47))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 52738362-e1a6-4491-9040-9471e123e1bf))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9b3b1064-face-4436-b2a8-21d31a62ea90))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a2ed5937-76dd-4b8e-8055-12fed5dc1730))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f008ca59-1ad4-4129-bed6-6110e5b5b3da))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 3104e670-960e-4dca-9ecd-c3811258f92c))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6e55c72a-c424-4121-8f1c-56a802bfd64f))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 828bfebd-580d-45b9-944e-0868ff3ac4ad))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9cd88663-e03c-4299-b35b-411a5de7166d))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 3b46e3c9-7cdd-40bb-a0c5-63b252a215fb))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp 379ff65b-6582-4b89-a096-bbc5e34fc816))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 3a2b8aaa-ffc9-47b4-9126-ec4883996fd3)
    (at 200.5625 47.8 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/10b59b44-25f0-4aaf-a2da-c29e1b1eb698")
    (attr smd)
    (fp_text reference "C414" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 47208203-96a4-480c-a47f-fc79081a42cf)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 479e6c89-87a5-4562-8a9b-d91a05465684)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 82be0d1e-6cb3-4a6b-b038-848f3ac3dfec)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp bdae2a0d-93db-4f0f-ad7b-85eab36dfa44))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp fb451ba0-9004-4ef8-bb17-7997b15fa2ba))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 05a4f62f-6069-4920-bdaf-37a6ef215909))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 13d8b25f-f619-4dc5-bbad-ec79420bf6b3))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 983c96fe-4165-42fb-9c8a-33f480cedfa4))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp fe19588d-61c8-4cc0-a064-2de919b2ff37))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 117766f8-30a3-45c5-b1fd-102723a5a967))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 1645babd-5e18-46ea-a02a-c186732060de))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp b446d7c9-b5bb-4090-a9da-f530e8e86a29))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp fba8ce70-c127-4f19-b170-5cba620bbc62))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp a606a77d-3bd0-4b73-8d9f-8074a1589058))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp de02555b-09b9-41a8-9475-3570a7c56a53))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:TSSOP-28_4.4x9.7mm_P0.65mm" (layer "F.Cu")
    (tedit 5E476F32) (tstamp 42ab6bad-6278-486b-bc22-1af1652ab1a2)
    (at 180.5 85.4 180)
    (descr "TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (property "DPN" "AD9203ARUZRL7CT-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "AD9203")
    (property "Manufacturer" "Analog Devices")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/957aae89-eaad-4355-91ec-b14040eabe5f")
    (attr smd)
    (fp_text reference "U701" (at 4.7 -2.6 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c20e304e-8192-482d-8375-d8f3a5d625f4)
    )
    (fp_text value "AD9203" (at 0 5.8) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d185da03-17c2-4280-aec5-356af5979400)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3fe9a6bd-d71f-494c-8e13-e3910f9221d3)
    )
    (fp_line (start 0 4.96) (end 2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 19ff49d2-8336-4a80-ad8b-f012e016b75c))
    (fp_line (start 0 4.96) (end -2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 5ea14262-5465-4410-a8d4-1056d977767a))
    (fp_line (start -2.31 4.96) (end -2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp 641ca857-0aed-4438-bf1b-cc0a047ab396))
    (fp_line (start -2.31 -4.685) (end -3.6 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 96efb383-3cbb-40e8-8dad-3b3f6a1e4a6a))
    (fp_line (start 0 -4.96) (end -2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp 9e29dddf-accf-4892-973f-a6e28e3e2df8))
    (fp_line (start -2.31 -4.96) (end -2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 9f4c2fbd-fa7a-486c-91d4-5d07218e49e6))
    (fp_line (start 0 -4.96) (end 2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp cdb7b363-37ff-4740-b224-5ca73db74796))
    (fp_line (start 2.31 -4.96) (end 2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp e334f2a5-1b01-487e-9958-88107c88eed8))
    (fp_line (start 2.31 4.96) (end 2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp fcb6ade7-d428-40c1-a7ee-9a183261a32b))
    (fp_line (start -3.85 5.1) (end 3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp 252e6e3d-ef19-45db-ad58-edeec92527bc))
    (fp_line (start -3.85 -5.1) (end -3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp 2a0b1848-d437-4170-8fb3-95c529aeaa04))
    (fp_line (start 3.85 -5.1) (end -3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp a492cc72-8326-4c2f-a395-51cb05cb9b6a))
    (fp_line (start 3.85 5.1) (end 3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp d688ec37-f1d3-4554-bce1-05ecdf31f227))
    (fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp 238fdb20-32f8-4ea9-8684-278fbfa06840))
    (fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp 5442f20a-544c-49ab-a037-a5ee7ddebb55))
    (fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp a872a2a9-30ed-4561-ad96-690ba2ba1225))
    (fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer "F.Fab") (width 0.1) (tstamp ec6a44bd-4260-4466-b852-809592bc2e2c))
    (fp_line (start 2.2 4.85) (end -2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp eec4608f-e741-4ed0-ab82-4e1e359a5c72))
    (pad "1" smd roundrect (at -2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "DRVSS") (pintype "power_in") (tstamp 3953c8f9-40c6-48bf-9297-486d356b44c0))
    (pad "2" smd roundrect (at -2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 45 "/samplers/ADC 3/+3V3_A") (pinfunction "DRVDD") (pintype "power_in") (tstamp 364fa594-9200-46c7-9a93-0d4505afbcd9))
    (pad "3" smd roundrect (at -2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 78 "/samplers/ADC 3/D0") (pinfunction "D0") (pintype "output") (tstamp 1b7e9ef1-3f66-421a-937b-a10df571034b))
    (pad "4" smd roundrect (at -2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 79 "/samplers/ADC 3/D1") (pinfunction "D1") (pintype "output") (tstamp 7588e596-c132-4eab-ab27-f14ae484b05c))
    (pad "5" smd roundrect (at -2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 80 "/samplers/ADC 3/D2") (pinfunction "D2") (pintype "output") (tstamp db1e98ad-5d51-429b-afe4-9f1cea0ff058))
    (pad "6" smd roundrect (at -2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 81 "/samplers/ADC 3/D3") (pinfunction "D3") (pintype "output") (tstamp a142f467-699c-436f-90e7-7ea3c862b673))
    (pad "7" smd roundrect (at -2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 82 "/samplers/ADC 3/D4") (pinfunction "D4") (pintype "output") (tstamp 6d4cf9e0-1f61-48fa-bbfe-f24ba4f55109))
    (pad "8" smd roundrect (at -2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 83 "/samplers/ADC 3/D5") (pinfunction "D5") (pintype "output") (tstamp 17877ac5-f206-4698-a294-1da2127156d3))
    (pad "9" smd roundrect (at -2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 84 "/samplers/ADC 3/D6") (pinfunction "D6") (pintype "output") (tstamp ca09ff67-eec7-4b88-b4d6-5780ac8df6c3))
    (pad "10" smd roundrect (at -2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 85 "/samplers/ADC 3/D7") (pinfunction "D7") (pintype "output") (tstamp 5f45a69a-4117-481a-bff7-8444e7670b11))
    (pad "11" smd roundrect (at -2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 86 "/samplers/ADC 3/D8") (pinfunction "D8") (pintype "output") (tstamp 08f334fe-8ba7-452a-9594-7b44ff17d83c))
    (pad "12" smd roundrect (at -2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 87 "/samplers/ADC 3/D9") (pinfunction "D9") (pintype "output") (tstamp 459aad0c-0beb-40f4-8c2d-20a520be91e2))
    (pad "13" smd roundrect (at -2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 88 "/samplers/ADC 3/OUT_OF_RANGE") (pinfunction "OTR") (pintype "output") (tstamp b016b615-f782-4510-aa4e-55e1ca0862e0))
    (pad "14" smd roundrect (at -2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DFS") (pintype "input") (tstamp 88ea9a84-70a9-4106-9f7d-a5a874432f1a))
    (pad "15" smd roundrect (at 2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "/REFCLK") (pinfunction "CLK") (pintype "input") (tstamp af1ace0c-5516-4978-8df9-40bd68e6f064))
    (pad "16" smd roundrect (at 2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "3-STATE") (pintype "input") (tstamp 1238c74a-7a18-4a8d-9660-183ee8e309a7))
    (pad "17" smd roundrect (at 2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "/ADC_~{EN}") (pinfunction "STBY") (pintype "input") (tstamp 899f003f-78fa-405c-aa20-649d434392d3))
    (pad "18" smd roundrect (at 2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "REFSENSE") (pintype "input") (tstamp b582f582-6125-4ed5-bce0-1a61294e2291))
    (pad "19" smd roundrect (at 2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "CLAMP") (pintype "input") (tstamp 90663cfb-a0ad-4a64-8518-4a0376a07396))
    (pad "20" smd roundrect (at 2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 28 "unconnected-(U701-Pad20)") (pinfunction "CLAMPIN") (pintype "input+no_connect") (tstamp 09b990f9-41c3-429a-a486-e4ac57ebb775))
    (pad "21" smd roundrect (at 2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 26 "Net-(R701-Pad1)") (pinfunction "PWRCON") (pintype "input") (tstamp f34b238e-8ba9-42e6-9f98-34fa88fc4dea))
    (pad "22" smd roundrect (at 2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 43 "/samplers/ADC 3/REFTOP") (pinfunction "REFTF") (pintype "passive") (tstamp 91973990-62c0-4d03-a96b-680179c2b7a7))
    (pad "23" smd roundrect (at 2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 44 "/samplers/ADC 3/VREF") (pinfunction "VREF") (pintype "input") (tstamp 1150f880-7702-401f-8071-a0044d25e7ad))
    (pad "24" smd roundrect (at 2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 42 "/samplers/ADC 3/REFBTM") (pinfunction "REFBF") (pintype "passive") (tstamp 74a85980-1b2a-40e5-b8c6-a3cc43004fe1))
    (pad "25" smd roundrect (at 2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "/CHANNEL_3") (pinfunction "AINP") (pintype "input") (tstamp 67a928f7-a3fe-47b4-82f6-3bcacec49250))
    (pad "26" smd roundrect (at 2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 44 "/samplers/ADC 3/VREF") (pinfunction "AINN") (pintype "input") (tstamp 5325db71-b3d6-4daf-8591-b4b9c58d0452))
    (pad "27" smd roundrect (at 2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "AVSS") (pintype "power_in") (tstamp fc54ad03-19bf-46b0-89f1-20508dacd856))
    (pad "28" smd roundrect (at 2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "AVDD") (pintype "power_in") (tstamp fd7cf292-b9dc-46b6-9d56-854a3e297daf))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 4589f10c-cd2d-45a5-95bc-98e4444bf87e)
    (at 199.3 109.5 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/4722b69c-6fc4-4eaf-8289-f4781627513c")
    (attr smd)
    (fp_text reference "C1420" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6f5976cb-b7d6-4859-8465-2014b2bbd787)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b20ca0c7-616c-4094-b0f1-36a0299ef79d)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 915b526e-1066-40b6-a4b1-ec9a35f25397)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 371a0ab7-34e5-4f93-b883-d7a11bde483e))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp fd3e5dd7-ccd4-481e-942a-9fb6476c66ef))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1d36ab8b-7666-4d92-aa85-8a9d56a1fc20))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 21e3637b-9005-4f38-973e-0d109fa347fb))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 88ef18eb-1c17-4d7f-8394-1e194fe1af1b))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp f0e0c8e9-402a-4feb-a76a-d680e655dc27))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0178c1c4-2fa4-474b-b2b6-4f47bbfaaaa3))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 03dbc0e5-5865-4343-9e58-1d44f7b90106))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 75ba6f23-95b1-4fd5-af25-4965065d280d))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp a782127c-39c9-407d-8877-40034d342dcb))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp abe35085-914c-4dea-81bb-866c3e5bd811))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 926f13cc-a9cf-48f4-9283-e13186090e6c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 47f07ea2-8339-42c8-ad3b-3e4e7d664fe6)
    (at 190.5 92.7 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/6046fca1-d4b2-42d7-b803-7c47602c8ac4")
    (attr smd)
    (fp_text reference "C803" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5f57d832-a24e-461e-b8cf-964986eea5ef)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7b63ee84-32bd-4d60-84ff-d289d3f26765)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp b54cae38-f8bf-484e-a915-4f4a4be379ae)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp c77acbd9-33c2-45e3-857b-f82c543b8a22))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp f5d2fc99-6bc0-481f-96e8-43e6b0fb09e0))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1b3a8825-1b83-4d0e-bdfb-31061de35423))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6afdab25-816c-4d59-83b4-978a2bb81d95))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8206ab2d-3880-4c5f-8189-a39f946a85f2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp abbd9158-e205-4fe4-be59-d4c42bad2002))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 4576b623-727d-492a-94aa-2e872305a34d))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4bf35d8d-f2f5-4a53-8aa5-bd741ba900ae))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 52c30a74-9ae8-4cea-aae9-a10d41f6875c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp e8fd8879-9242-45eb-8a68-0628ebea13a7))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp c4c97515-86fc-4f94-a548-b4516caf1b04))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp a61a2f2c-3966-4043-90e7-555cc15854ad))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:SSOP-28_5.3x10.2mm_P0.65mm" (layer "F.Cu")
    (tedit 5A02F25C) (tstamp 49fe80db-3400-40ec-9c2f-e63d78c053b6)
    (at 192.9 64.6)
    (descr "28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (property "DPN" "296-21243-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "SN65LV1023A")
    (property "Manufacturer" "Texas Instruments")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/2ad0fe99-7922-4fbc-bd4d-010a935ab389")
    (attr smd)
    (fp_text reference "U601" (at 5.5 -3 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b2b0ff36-8d70-4441-ac20-a0f9c965d530)
    )
    (fp_text value "SN65LV1023A-EP" (at 0 6.25) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 97251db8-c390-4f21-86cc-758ef81337ba)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15)))
      (tstamp eb1c8d00-7909-4cfe-b162-9ac3f4824079)
    )
    (fp_line (start -2.875 -5.325) (end 2.875 -5.325) (layer "F.SilkS") (width 0.15) (tstamp 0f258e20-1ba8-4a69-b069-df7ad3bdd032))
    (fp_line (start 2.875 5.325) (end 2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp 2ad81782-3ade-4288-a75a-737c7a5a7535))
    (fp_line (start -2.875 5.325) (end 2.875 5.325) (layer "F.SilkS") (width 0.15) (tstamp 35871798-aab8-4092-8149-1cc2aad667c1))
    (fp_line (start 2.875 -5.325) (end 2.875 -4.675) (layer "F.SilkS") (width 0.15) (tstamp 38a9bd57-d9c3-496f-be58-d3b452073f0c))
    (fp_line (start -2.875 -5.325) (end -2.875 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 71e5bc2b-78da-4249-a9fa-0da4aee7f494))
    (fp_line (start -2.875 -4.75) (end -4.475 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 8d570bdf-df4f-446f-899c-be08876fbd0c))
    (fp_line (start -2.875 5.325) (end -2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp cc5419a8-2746-4d57-8e45-086bb83f4270))
    (fp_line (start -4.75 -5.5) (end -4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 22e6b1ac-1121-4130-ae3c-e398a89176f2))
    (fp_line (start -4.75 5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 363b96cd-1546-4e47-b2d4-90b53c9b31b8))
    (fp_line (start 4.75 -5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 5904daa1-2e30-422f-bd2d-5c0417ab2d2a))
    (fp_line (start -4.75 -5.5) (end 4.75 -5.5) (layer "F.CrtYd") (width 0.05) (tstamp 77efe19b-ec52-4420-bb1a-54aa632769d0))
    (fp_line (start 2.65 -5.1) (end 2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp 20e5e532-9101-46a2-b2de-12e3afe40bd8))
    (fp_line (start -1.65 -5.1) (end 2.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp 2e19e33e-60c3-4e84-990b-4e08d3a6d27c))
    (fp_line (start -2.65 5.1) (end -2.65 -4.1) (layer "F.Fab") (width 0.15) (tstamp 4894a1f0-0b5e-4830-a26f-0b0647fbb5fa))
    (fp_line (start 2.65 5.1) (end -2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp a06b7703-ada0-4b80-b209-65ac5fe7fb55))
    (fp_line (start -2.65 -4.1) (end -1.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp a5d7f1b8-8906-4f44-957d-0832e4e73016))
    (pad "1" smd rect (at -3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC1") (pintype "input") (tstamp 6c3a8d0e-73fa-4a03-9dd5-217d977bc112))
    (pad "2" smd rect (at -3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC2") (pintype "input") (tstamp c21619d1-cd17-4d47-8290-45e70ec85a7c))
    (pad "3" smd rect (at -3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 75 "/samplers/ADC 2/D9") (pinfunction "DIN0") (pintype "input") (tstamp b05781ce-a71f-49ae-9d04-1228de2f41ae))
    (pad "4" smd rect (at -3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 74 "/samplers/ADC 2/D8") (pinfunction "DIN1") (pintype "input") (tstamp 79506d36-b13c-4a5c-8e97-5fd70ff6923c))
    (pad "5" smd rect (at -3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 73 "/samplers/ADC 2/D7") (pinfunction "DIN2") (pintype "input") (tstamp f71bd57a-8b6e-4b0b-8059-2f0929525cb4))
    (pad "6" smd rect (at -3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 72 "/samplers/ADC 2/D6") (pinfunction "DIN3") (pintype "input") (tstamp aefcaffb-ef7a-4cc6-a8ae-935b59b4d666))
    (pad "7" smd rect (at -3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 71 "/samplers/ADC 2/D5") (pinfunction "DIN4") (pintype "input") (tstamp e9e5d397-850e-439e-a231-5439ff6d00b0))
    (pad "8" smd rect (at -3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 70 "/samplers/ADC 2/D4") (pinfunction "DIN5") (pintype "input") (tstamp 35e3d11d-ce5b-41d4-ae34-a04e7650570c))
    (pad "9" smd rect (at -3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 69 "/samplers/ADC 2/D3") (pinfunction "DIN6") (pintype "input") (tstamp 17dabba7-e671-45ef-bcb6-9027e6291bfc))
    (pad "10" smd rect (at -3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 68 "/samplers/ADC 2/D2") (pinfunction "DIN7") (pintype "input") (tstamp c8a200dd-3624-4008-8a73-23ac1493c241))
    (pad "11" smd rect (at -3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 67 "/samplers/ADC 2/D1") (pinfunction "DIN8") (pintype "input") (tstamp f44d966f-5469-484b-8197-558d0112f456))
    (pad "12" smd rect (at -3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 66 "/samplers/ADC 2/D0") (pinfunction "DIN9") (pintype "input") (tstamp 97e27d39-0592-4ebc-a165-8836427790a5))
    (pad "13" smd rect (at -3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "TCLK_R/~{F}") (pintype "input") (tstamp 520b59d0-c78e-4dd4-bf8e-aea2019bf5c9))
    (pad "14" smd rect (at -3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "/REFCLK") (pinfunction "TCLK") (pintype "input") (tstamp 4ca5f1f9-a575-4c1c-b792-fd2f0718c5f9))
    (pad "15" smd rect (at 3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp 85faf990-312a-4569-b986-c0dd5c8bccd9))
    (pad "16" smd rect (at 3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp 3b168e4d-c055-4395-bd5f-aed3acd19d07))
    (pad "17" smd rect (at 3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp 1de2b4a9-bef3-4e78-baad-765668ced51f))
    (pad "18" smd rect (at 3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 166437ad-dbf0-48cf-8742-a07096768782))
    (pad "19" smd rect (at 3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "/LVDS_DEN") (pinfunction "DEN") (pintype "input") (tstamp 15af73c8-443d-4eb8-b705-e4272a09ef01))
    (pad "20" smd rect (at 3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 77d12548-3e23-4045-bd4b-e376c632d905))
    (pad "21" smd rect (at 3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "/PMOD Headers/LVDS2-") (pinfunction "D_{O}-") (pintype "output") (tstamp da7e064b-db38-436d-8956-d60bbce8c315))
    (pad "22" smd rect (at 3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "/PMOD Headers/LVDS2+") (pinfunction "D_{O}+") (pintype "output") (tstamp 643570f4-382c-4400-9e43-870ff2eadad6))
    (pad "23" smd rect (at 3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 96618bb7-57d1-4a11-8e7a-b88e07a8107a))
    (pad "24" smd rect (at 3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "/LVDS_~{PWR}") (pinfunction "~{PWRDN}") (pintype "input") (tstamp f6f4d7ae-e6a9-47f8-9525-7b993bb9f17e))
    (pad "25" smd rect (at 3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp f96032f7-48ff-4410-88c1-249fad185cbe))
    (pad "26" smd rect (at 3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp 26e57f22-85bb-4989-833e-98f297855709))
    (pad "27" smd rect (at 3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 27960ae9-d71f-4bf0-af4e-63a77d89fe70))
    (pad "28" smd rect (at 3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 163086ad-2fc8-4e6f-b2e3-d69d55ce11b3))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SSOP-28_5.3x10.2mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Jumper:SolderJumper-3_P1.3mm_Bridged2Bar12_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5C7452C1) (tstamp 4aeb85e0-d31c-4cba-83f1-16cb2f020b48)
    (at 106.51 80.65)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip")
    (tags "net tie solder jumper bridged")
    (property "Sheetfile" "pmod.kicad_sch")
    (property "Sheetname" "")
    (path "/3c2d4d75-fb86-4cac-998b-f750a751d1b2")
    (attr exclude_from_pos_files)
    (fp_text reference "JP101" (at 0 -1.8) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 61bae9ab-16bf-4203-b5da-25309f086bf1)
    )
    (fp_text value "Jumper_3_Bridged12" (at 0 1.9) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9206026b-64f5-4abb-a3c4-5207461902db)
    )
    (fp_poly (pts
        (xy -0.9 0.2)
        (xy -0.4 0.2)
        (xy -0.4 0.6)
        (xy -0.9 0.6)
      ) (layer "F.Cu") (width 0) (fill solid) (tstamp 1b61e09c-b466-44d9-a102-d149c8acae40))
    (fp_poly (pts
        (xy -0.9 -0.6)
        (xy -0.4 -0.6)
        (xy -0.4 -0.2)
        (xy -0.9 -0.2)
      ) (layer "F.Cu") (width 0) (fill solid) (tstamp aadbd2d0-ee23-4085-9141-1bfb0145e640))
    (fp_line (start -1.2 1.2) (end -1.5 1.5) (layer "F.SilkS") (width 0.12) (tstamp 0b479544-e6a9-45a7-91cb-2ee4e88e2950))
    (fp_line (start 2.05 -0.3) (end 2.05 0.3) (layer "F.SilkS") (width 0.12) (tstamp 1803fdff-7f0d-472c-affe-eb877bb7c598))
    (fp_line (start -1.4 -1) (end 1.4 -1) (layer "F.SilkS") (width 0.12) (tstamp 1f7be425-9e01-490b-84c9-ee6b9991b4d9))
    (fp_line (start -2.05 0.3) (end -2.05 -0.3) (layer "F.SilkS") (width 0.12) (tstamp 8267d9c8-41ba-448e-8501-7f06d3415724))
    (fp_line (start -1.5 1.5) (end -0.9 1.5) (layer "F.SilkS") (width 0.12) (tstamp ba31662c-4e49-4a89-80e5-9e2921dc79a3))
    (fp_line (start 1.4 1) (end -1.4 1) (layer "F.SilkS") (width 0.12) (tstamp c6f73a0b-25c6-4966-808c-136e543f07e4))
    (fp_line (start -1.2 1.2) (end -0.9 1.5) (layer "F.SilkS") (width 0.12) (tstamp d9d03de1-c10a-4bbd-811d-b2e6ed644633))
    (fp_arc (start -2.05 -0.3) (mid -1.844975 -0.794975) (end -1.35 -1) (layer "F.SilkS") (width 0.12) (tstamp 25b59498-1307-4159-b005-8a1bf86f3288))
    (fp_arc (start -1.35 1) (mid -1.844975 0.794975) (end -2.05 0.3) (layer "F.SilkS") (width 0.12) (tstamp 285acc58-ef45-4d6b-b60b-6acb8c06c620))
    (fp_arc (start 2.05 0.3) (mid 1.844975 0.794975) (end 1.35 1) (layer "F.SilkS") (width 0.12) (tstamp c0c2cb85-2597-4157-873d-d8ef014d2e19))
    (fp_arc (start 1.35 -1) (mid 1.844975 -0.794975) (end 2.05 -0.3) (layer "F.SilkS") (width 0.12) (tstamp d019e09d-b5ea-4e2d-b91a-8a234a7bf516))
    (fp_line (start -2.3 -1.25) (end 2.3 -1.25) (layer "F.CrtYd") (width 0.05) (tstamp 35d6e9a8-bdfe-4cf2-b88a-d0dace48c32c))
    (fp_line (start -2.3 -1.25) (end -2.3 1.25) (layer "F.CrtYd") (width 0.05) (tstamp 68721d8e-655c-410b-b65b-7c2020caff8f))
    (fp_line (start 2.3 1.25) (end 2.3 -1.25) (layer "F.CrtYd") (width 0.05) (tstamp 75ffb879-4c47-41e6-b7e9-0b8ce546dbc9))
    (fp_line (start 2.3 1.25) (end -2.3 1.25) (layer "F.CrtYd") (width 0.05) (tstamp 78a7d1ef-e649-4d8b-93d9-7465ee0a6269))
    (pad "1" smd custom (at -1.3 0) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 16 "/PMOD_3V3") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.55 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.55 -0.75)
          ) (width 0) (fill yes))
      ) (tstamp 3adfd6a4-a5e8-45ea-9b8c-9a1d7e0e55d8))
    (pad "2" smd rect (at 0 0) (size 1 1.5) (layers "F.Cu" "F.Mask")
      (net 2 "+3V3") (pinfunction "C") (pintype "passive") (tstamp 9f01a20b-feb3-4e3e-a782-0053065439e9))
    (pad "3" smd custom (at 1.3 0) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 10 "/EXT_3V3") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 0.75)
            (xy -0.55 0.75)
            (xy -0.55 -0.75)
            (xy 0 -0.75)
          ) (width 0) (fill yes))
      ) (tstamp aa33a8dc-0050-4381-9cfb-b3c5336f5182))
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 4d866be6-4518-4c49-b91b-9cac9ff829f1)
    (at 172.4 84.1 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/a6a7d54b-0b0f-494c-857b-7a8e7f66dd80")
    (attr smd)
    (fp_text reference "C704" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp df158d69-6732-4218-a4ea-808d2d4686e9)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4bc9f574-fc16-4aa3-bc9c-6bba4a3f0cec)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 4771f082-1836-41c5-b674-b73746d2038c)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 53a2f6d6-2d72-4f6c-b8dc-ae167fbfc858))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 83393eac-f856-444f-8764-76ddb002cd70))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 02bed0ba-e0d1-4a99-b424-a186d773bd0e))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 16654c51-58c3-4f13-bdcd-f1a8c4a22538))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 4dc6b119-108d-43f4-b87d-7acabbb9a05c))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ca96df1f-daa7-4ca5-9b6a-051330c75597))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0f7f50aa-d6c1-49be-9b47-1b1dfdd2c52e))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 4ffdde06-615a-4c40-977c-18787f121595))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 5ededd1f-7caf-4f28-b466-c73ccc768eef))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 8629d680-5e83-454c-8fde-e33896d9d93c))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 43 "/samplers/ADC 3/REFTOP") (pintype "passive") (tstamp 27bc27a9-a597-4db4-b28a-04c72b4638ea))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 42 "/samplers/ADC 3/REFBTM") (pintype "passive") (tstamp 28ab1b39-86f1-4a30-9cdf-885e55b29cca))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 4ee9a6eb-c962-40b3-8756-bd159097a040)
    (at 185.3 92.4 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/181df231-b3b5-464f-9673-3f2af95e7740")
    (attr smd)
    (fp_text reference "C710" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 08f26b08-4c1c-48f6-8bed-8a04320eb0be)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp bda5db02-987c-4047-b88a-42fde82c5cae)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 3c02b7ee-d678-4e68-80ed-133aa8866bbe)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 414ed832-37f8-44f2-b92d-42ee44fd40a9))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp e6e410dd-367e-4b39-88c5-388879c6d1c1))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3dc206d0-13d6-4dd6-9a26-1794a79d4a45))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6a6abdf4-3005-4ea8-b40b-b0fb98b9ba85))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 89b5ed3b-410c-42b1-b1d4-d1bc02226b2d))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp f3e27589-b9cd-43f9-beb6-ad9953e3e083))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 66bc79cd-bd0c-426a-8729-e06f2bac3e37))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 77f23868-0d87-49a3-9f19-ce0034774c9c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 8a4cf2f4-f5fa-4957-ac76-bb0539341be2))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp deee2c49-752e-4cd0-9455-18a62532acb3))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 6c23b821-1365-41c2-831e-ff262a29a7c8))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 45 "/samplers/ADC 3/+3V3_A") (pintype "passive") (tstamp 0d76fb5e-468c-4666-9bf0-2dcd85eacada))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 50354a37-57de-467c-8e72-1831e8956c34)
    (at 196.7 78 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/940fe02b-e726-41d7-806f-7da0064a837b")
    (attr smd)
    (fp_text reference "C804" (at 4.7 -0.6 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 036686c4-f3ff-4185-a846-558babbebeee)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 39cabbbe-7e19-46cf-bfc2-84396f920c23)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 00e1f7e0-c23d-4b7e-a382-f71775c2cd86)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 05e616ea-36ef-4fb5-9895-e15178ad4366))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp c9b8fcdb-2008-4ff7-90a5-7178b8328ff7))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3995fa7c-377f-497c-bc21-2d3d9546e608))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 4f01600a-fc54-4a44-b93d-a8143e655db1))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8b40a896-9370-4f0c-a3dc-16cc1dd7ca4f))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp a3785fdc-7c6e-47e7-95a8-c138c41765b4))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 0dcf6fb8-44a4-4ac1-9210-dfa9b1af6b4f))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4488a05d-7dbe-416a-8934-24db70f6b722))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp b1bee1b8-e3d1-423a-8179-b5138d3a4a46))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c4cf25bc-e5e1-4fe5-b5b0-c20595532aed))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp f1d8bcc0-a8ce-4841-8c7e-659cca6ee86f))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 3f3cbdc6-138c-4bae-aac7-609224d7bc70))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 57f642c6-00dc-45e3-b75d-b96d165f1758)
    (at 179.2 99.3)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/0f30aa3a-8eff-4a94-a2fb-965fa1562b8c")
    (attr smd)
    (fp_text reference "C1307" (at 0 -1.68) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp bc69a238-a22a-4bcb-aff8-6c8a7f1019f2)
    )
    (fp_text value "10u" (at 0 1.68) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d0108d14-c975-42ac-ba83-cb5777cb946f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 74476253-28af-4e14-ab7b-c4a844a155f6)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 8d8e0ffb-c236-4fee-96b1-85b404afd053))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 8f6cd520-7f72-453e-bd5f-ae6c03c4b079))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 15e67bb1-7565-40fc-b334-9990f53e6cf4))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 301ca295-b3ac-4ded-8dc2-f629480b6ca4))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 38758829-e823-413b-856a-6470f1506762))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp e61f9885-f99c-4545-8308-15d48d66e5c6))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 08fbcbbd-120d-4913-96c4-61ac0cc62252))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 0dda91ff-b82b-4b72-b9bc-5dd06c8158a6))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 62d4f327-f2e2-4892-b273-ad3d0e9e9b31))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp b3d30f0b-3f9e-42a8-8efc-fe5fb0431d8d))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp fc97cee2-8e53-49cb-ae1f-7d69bfb21962))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 7cede79d-2d37-49f0-9e37-d143b06e6e3d))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 5b566f85-60c5-4d2b-91a4-3502dc98fd10)
    (at 200.1 78 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/d87f9207-6f8e-4d87-9db3-a8cd0e987887")
    (attr smd)
    (fp_text reference "C808" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 65ebb8d4-56de-436e-8607-0229b724c921)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9d6defb2-8453-4ace-b002-1917de8565b7)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 410f6f42-b794-4938-87fd-e1a8b1836400)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp b846b857-ac48-4a5e-ba2b-f20dee902fdb))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp d7804b0d-529d-4c38-b1f8-472bf9c602de))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 48a4eabf-38c0-4d81-9fb2-0ba55b2a3778))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp bc56f2a6-076a-4079-8a6d-84acbc82c37f))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp bf9acd6f-de1d-4f52-8ea1-555a8c5cad01))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fa04f9de-54b9-4620-b8f4-1d97949dda3c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 03c266ca-c48f-4745-9834-cd7aea685f82))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 5d61d6bb-5d16-4bf8-a882-3174c9ecbd8e))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 69eb96df-3b82-44e5-8887-2138fecc41d1))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f2fbe5c4-6923-4158-9fcd-fcbdd49acd9f))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 0f6028d8-e2e7-41ea-ae50-c73fd2d0387e))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp f216df8d-2cde-4821-84b1-a35b36a4384c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 5bf423eb-8a43-4605-8a6d-b5e472d930c3)
    (at 193.5 57.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/5343f4f0-e100-4eba-b86a-1121786f9ca6")
    (attr smd)
    (fp_text reference "C615" (at 4.7 -0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0b309cb3-fdf3-422d-8de1-d4fe77f68f03)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 97ab41f6-75a4-435c-b0a3-2bc19b8f8113)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 3d4fd458-a02c-44bc-9ba0-9908acd57834)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 0b2f7403-7d6b-40de-b5a3-135187b73782))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 86af125f-cfce-4256-bdea-041fbe8f7354))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3b3cc9d6-f8d8-483b-a1f1-378e2b0becf1))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5adc9cdd-2ff3-471b-b723-a9279093d390))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7e7cb240-ca05-4e13-ae6a-0f7b16b89213))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8fa8716e-47cc-4a96-9895-12e6deeb1ef2))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 134e3b02-14cd-4be5-be6f-636b85db8486))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 650d922f-4706-4359-bcfd-0dea0eb8a7fc))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 7536b359-a659-4742-9147-6fc6c9162fba))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f926f015-7c50-4bd4-afc8-e4064db43f4b))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp 96e1de51-db7e-4094-91a4-3e87b311ecf5))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 44879e64-0efc-48f3-96d4-15d427023c7e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 5c168e51-57ba-44ce-9efe-992e0e28081d)
    (at 174.8825 51.14 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/a39dd3a1-8969-4ab5-95e8-86f67f16762a")
    (attr smd)
    (fp_text reference "C302" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 29d970a6-07fd-40c8-a78b-8d73eff61e94)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9de27527-f5d2-4ab3-8594-1f0246dc5b47)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp f96f25d1-93e5-4220-8310-c17fde4ad18b)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 9236b53b-d6ac-4106-ac4c-943e2f25c255))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp b76c2ddd-2c5a-4615-af53-c6a78d5902a0))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 39cef11d-882a-4638-a42e-37cc470ca5a5))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 76b18d79-db9f-4724-b837-c5baa1a957ac))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp d15fc9d7-f94a-47dc-a7ec-8face89cabf8))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp e1a86cf4-2b31-4fa0-a9f9-3b8deab53186))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 0734fb9b-c602-4674-aa90-16de42986abd))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp a006849d-9c15-4c9c-af75-a187c4c3b6a7))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp f06046a1-1902-420f-a2f8-098914fa8257))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp f996d219-853e-4f1e-8ffb-8950aa33a5f2))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 4d24ca01-4576-46cd-9ff1-7924e3ad965f))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 33 "/samplers/ADC 1/VREF") (pintype "passive") (tstamp 677a77fb-11d9-44ad-9e9a-ef3d03ef30eb))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 5d47ca5f-cea2-4122-8156-9baa03cd8793)
    (at 178.3 112.6 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/cc8d276b-090a-453c-85c5-9e95f587b7e7")
    (attr smd)
    (fp_text reference "C1303" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8542cd7a-4fc6-4417-8836-eb8d645804da)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b4569585-a57f-4695-963e-8681b0c4c81b)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp e2d19418-ea28-41b2-bc23-a98993eca8e4)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 141f82a8-a57b-42bc-942f-723ac0a83c67))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp e191ade1-1ceb-40e8-bbbd-9e80ecc797c2))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 65e2ede4-8347-4c66-8d7d-2c0222709252))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9afc52a9-ee1c-4afc-8526-deecf107cc89))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d8803826-1e72-46cd-a924-1ad532fc2d69))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f38180af-c1cc-4855-8daf-39b5432d885f))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 209ebc3a-8cee-4d23-82d4-03100e519974))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6414384f-5578-44dc-bba4-d5fe5af1e0e0))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 69c426ef-f8b8-4136-b56f-82f162392e1b))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp de49685b-8f58-4abc-953f-3d8244e23dfa))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 62a344be-2fbd-4160-b5e4-2f7b13011a55))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 49 "/samplers/ADC 4/VREF") (pintype "passive") (tstamp 0d5cace6-8f4f-43e7-a2ee-d04d8bbd322f))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 5e4a022a-cd2b-4cad-80bb-d6efe8e60767)
    (at 193.3 78 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/28e1bdc8-d711-48ba-9299-b83344471ae8")
    (attr smd)
    (fp_text reference "C819" (at 4.7 -0.5 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4b235413-0b6a-4e2f-a23e-42c785f44fc9)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8792070a-4022-4754-945d-7a7366b4bb79)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 5d5a9e5a-ce18-4849-9d1e-76d34a32d2c4)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 2c356c9b-a6bb-491f-8f24-bc6f0e9bfd9d))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp d09aab51-d034-4d2c-90f9-e5faf13ce20d))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1dd5b93c-0813-40cc-9915-d506184151f0))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 33e4735b-6275-4b8c-813f-529b8e06bbc7))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9e26cc49-0e16-4def-a4e0-44e8e8f2803e))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp a4d80f26-e4d7-436a-9360-1ff813d73a56))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 131e3584-1360-4f19-8936-fb502be5bde0))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 38c721cc-93f6-44e3-a167-b9b08b65a700))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 7bd43db6-1f9a-49ca-a500-a86f26f1b861))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp ea56650e-d70b-4a15-8bdd-e92dcd0736f5))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 63f5709b-d50d-4564-9a33-4cfde00d1d52))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 68b799fa-1cb7-4aca-94c0-546378cc9ff3))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 5fb603ea-e3ae-49db-aa54-e75775ae1759)
    (at 192.5 98.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/28e1bdc8-d711-48ba-9299-b83344471ae8")
    (attr smd)
    (fp_text reference "C1419" (at 4.7 -0.5 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9bb64e97-20dd-4284-b9ca-c04def18bc84)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a5dec4bc-bca1-40db-895f-210cd23997fa)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp f4405222-4fb9-4a31-88e5-30fdeaf65395)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 381abf3c-8782-4f56-afb7-d1e90c61a80e))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp f629338d-e3fb-400b-b48e-97203f48318e))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 72a27f52-0a5a-49cf-b2d1-7298605bc926))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b41b315f-d225-479b-953f-5beb1af4c9a8))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b80461c3-0cb3-47a3-8df1-c229501ffcda))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp ea1b0549-8e78-4d9f-b02e-5fb5e7303317))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0cd1a639-23c5-4a5d-9849-8590960e3a61))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 3aab1ff0-7908-4d95-b12b-46a2195fd4a5))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp b779511e-3cd1-4f47-a59a-e02db22dfab5))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp ce9a71a4-0569-434e-986b-cd90d9aa8ef1))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 0dbb86f4-25bc-428a-ac32-f0c6cf62dc7e))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 34c63618-967f-413f-97c0-11ce45de5ce2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 60355739-f69e-4591-99d2-9464802166a7)
    (at 180.6625 50.9 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "311-2595-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "RT0603DRE07499KL")
    (property "Manufacturer" "YAGEO")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/048d1ca6-5643-4c50-acf7-be4ef6123b63")
    (attr smd)
    (fp_text reference "R301" (at 2.9 -1.7 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp dd4f6f57-f5e1-484b-9578-c2ff3c94c137)
    )
    (fp_text value "500k" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3c24a1bb-5dc5-4856-be1b-53bc4515e618)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp baf13553-5077-45a9-83ad-11ae1bfc2043)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp c79e4f0f-482a-43a1-b185-89ba7e423ca9))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp e10466f3-2df2-43cd-a872-1cec0833ee5f))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 0150ecbd-a492-4cb3-95fc-5d432a781af2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 965f02bc-27a2-49d8-ab59-ff9a01284962))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9e082a8f-15ff-4caf-9c59-6ba90f7c0c27))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f4d7670e-e000-4852-85c1-1dfe69a5140b))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 0de5ecdb-aa04-4ca5-8823-0d6bbd293666))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 51cd72d0-393a-4b2e-91c7-db703cc59f11))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 7d9e2d9a-7d41-4348-8df3-2b45030e6395))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 920414b1-2b8b-4827-a8a4-b3e8e033075c))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 52 "Net-(R301-Pad1)") (pintype "passive") (tstamp b6256dee-e41d-448d-b10b-e6005ab48ba3))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 6d88af74-07fd-4356-b568-bcb4529c1f27))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 61cf58a3-d3df-4964-aa99-872fc7701914)
    (at 182.6 71.8 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/6d03a26e-0dcd-4a97-9fd1-42e476158f17")
    (attr smd)
    (fp_text reference "C509" (at 0 -1.68 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp f7e65534-b43b-49e3-ad5b-59596000918c)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ec332f0e-1327-4178-a4db-1fd75bad2c2e)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp d14581db-78ec-47fa-a728-5dd1be3a79ce)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 669f81f0-8270-45a9-b928-b74f18ee92b0))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp f00fe576-5d8b-4a61-9965-5813bc8c069b))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 0d1fd364-91dc-45ce-b9ed-4f427c0efce3))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 582ff49f-2184-413f-a1de-9e1ca3c5b6b8))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 63cf34af-c861-49db-af0e-922a2897e789))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp f766ce2f-7066-464e-a4f5-119ad11d3072))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 81b30f2a-752f-46be-9f13-356228b8b654))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 9210fc01-bd38-4ca4-a456-42a00d055a38))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp c08dbf12-8e22-450d-b17b-77a392883d6c))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp f9faaa2f-cd7d-4b32-87cd-87493150e513))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 869df20d-2163-42d9-8d37-0ce1c54f0b8f))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 40 "/samplers/ADC 2/+3V3_A") (pintype "passive") (tstamp 79fef6b9-20b3-4fee-b007-4c4abf92c9b4))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 62d78d2d-4ae1-4c9c-b7e5-7feaff91a821)
    (at 187.5 99)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/c0df7e68-f1ba-4776-90af-9f67007d48a5")
    (attr smd)
    (fp_text reference "FB1401" (at -1 -1.6) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1ea52583-9ed4-40f6-9277-7a010a7e7d53)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 81ee0bea-e028-4659-9731-e9745d934a4d)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp ba3c84e7-0291-40b9-926b-d8e3c4a70e73)
    )
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp 40f7f4e1-ff3e-4f9f-bf49-aa02bca7c287))
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp aac82b2f-74ef-436e-8e09-2068a58de292))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 0ae9f5f1-c8dc-4308-b3a7-60df11dcae55))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 129cb431-1bc8-416c-a6e9-a3d8e6936d23))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 867f27c8-6598-441b-9d4a-0897ca8d2d0c))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b985ed8b-887c-423d-ab5a-a815a7b7b53e))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 36507b87-ee80-4ae8-898d-6073245e6fff))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 765faa24-3aa4-4f1d-855c-1c90eb45bdd1))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 800a0d78-537a-4eb3-ac1e-d3a910883ac0))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp d92f3980-c541-4656-a90d-8847899b9188))
    (pad "1" smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp a52838df-6dcc-4c9b-b8fa-71b6cbd65958))
    (pad "2" smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp a93da7a1-a736-4abf-a3ab-b5da268b9987))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 633c7e46-26c1-4a88-8007-11069dc17bb6)
    (at 176.8 71.6 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/cc8d276b-090a-453c-85c5-9e95f587b7e7")
    (attr smd)
    (fp_text reference "C503" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0c55092c-e124-4288-82b2-3946a438e9c2)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3a551e33-b21c-46e4-8cfc-f69c66913d63)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp eab94021-0ca9-4d31-aa5b-cae9b9396a17)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp ecb059a2-bd48-4fe0-89e5-688249c6fecc))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp fbb5c323-c5a9-46d1-a375-5cd3cb5a7bda))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 53709487-292f-4bdf-91bd-2a328810dce5))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5cbe891f-47ec-4aa8-8dc5-7798fe70d3a0))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ec840279-eae5-4122-ac1d-67a9b1845f4f))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp fa475ac7-7cd7-4c25-990a-04bbaef81075))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 18a588c1-4cc5-467b-a9bf-3a89572c0de9))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4f68123f-277d-443b-ba37-43e73543ec2c))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9f9a2996-faec-443c-9d27-4654c4cad8c2))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp b98d7be0-c9d2-4621-a415-970a4480624a))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 0241f5a6-f788-44bc-b450-6f830f8b4b32))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 39 "/samplers/ADC 2/VREF") (pintype "passive") (tstamp 400aa19c-b299-496a-a317-e50388fbcbf9))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 64ecf67f-59d8-4316-be00-d6e80f7a30a3)
    (at 177.7 58.3)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/0f30aa3a-8eff-4a94-a2fb-965fa1562b8c")
    (attr smd)
    (fp_text reference "C507" (at 0 -1.68) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b39fc9ab-2bc6-487a-bc92-e1b92f5971c5)
    )
    (fp_text value "10u" (at 0 1.68) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6e2a4fa4-8221-499e-93da-a02fb504bee2)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp fef4548e-af83-433b-bbdf-2311c0aed0fb)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 1ec44904-4779-47a6-a4dc-934eb236336a))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 8801f196-082b-44a3-8351-696de2783190))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 158c38f1-9e36-4c04-8a05-77d1a0264ee3))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 2bf90296-17bf-4619-8e55-f4b38a36f5b4))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 6cf8b8f8-c518-4211-ad35-b83240a20361))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 99964c6c-ca82-4ad1-b029-891268b59218))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 03f48bfc-2609-4db1-a3ba-49021f8362b1))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 2e615e32-d292-40bb-9b9a-2945223649e3))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 9471cb52-8b9d-4451-9b75-b86ada5fcf17))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp dcf637c1-82f5-4bbb-87ab-4900bf413885))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp df93d2c2-4f0e-4550-8081-751c8307e7b5))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 192f9255-6027-441b-b675-8d6ab1f5d3c1))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 68c6a6c3-60c9-4b05-8f16-f0d98f056b7e)
    (at 200.1 89.3 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/4722b69c-6fc4-4eaf-8289-f4781627513c")
    (attr smd)
    (fp_text reference "C820" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp e38d5263-01c8-4a19-af6a-6243b1925c8b)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2002cf7c-0019-4168-9c69-d9488a5491f4)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 32adc144-0705-491d-ac4c-c65ba5b8b61b)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 0c814b36-5e2b-458c-8ec7-90d0ca1f15b8))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp f339b0e8-4535-42f4-b1d0-21459e7ad487))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 01536e75-513a-4712-b61b-d14bd65fbad4))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 19fb00db-9700-4305-9f54-3a2121e5198f))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c6469981-ae20-45d5-bbc2-a0023e5312c8))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fdd37e62-f2e1-4f5c-92e7-b250a83061ce))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 20f38cba-7468-45f3-a1f9-bd1664d8d510))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 2476174e-d6de-45d8-8583-c5b8c4f30fe6))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 4adc1f66-f849-4210-b296-830d72baebd8))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp ef8a6904-f2c8-4e12-88e1-dbad878d9e12))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp d0ab5d5e-7ac7-4bda-8b2d-0242f2bf4634))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 50a49906-7327-4597-bbd7-ac3733d909da))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 68f8a77c-6ef8-40aa-bbf7-1d8a81a6f1d2)
    (at 171.7625 42.6 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/a6a7d54b-0b0f-494c-857b-7a8e7f66dd80")
    (attr smd)
    (fp_text reference "C304" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a509383e-fe2a-4286-b5f8-d97537cf21f4)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b6c49530-92b3-4052-86c5-d18d945daf38)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp b1637418-4f96-407e-8c91-fab16fc3bf8f)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 2382da74-61b1-44ec-9f3a-1bf5a9cb60ac))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 5b2f4ba1-1021-4c9d-8e98-99ccda09607b))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 165f1eb3-055b-425f-b19f-cd1abca9810a))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1df0eeb3-70bf-4ccf-9d89-adb6c7bedb72))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2120e0d7-3c41-49bf-8816-b966e5ccb160))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fcc72ff4-664f-42b0-ac91-7810c0ba7053))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6acf5a09-0e6c-4c63-a4ea-dbb1411d3d00))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 909cf64d-d0de-4c41-ad08-987eb3bd3819))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp af8b16b8-af5d-477c-8fe9-6a03118e7b16))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp faf0da82-5aad-4008-819e-c3630387d2d6))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 31 "/samplers/ADC 1/REFTOP") (pintype "passive") (tstamp 7a0b2b70-e0e8-43d1-bde6-247baef74084))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 30 "/samplers/ADC 1/REFBTM") (pintype "passive") (tstamp 2dffb08c-7786-4ab2-97e1-279efe54c3d5))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 6b6ff8b7-b855-4d96-94f3-2524414bb50f)
    (at 173.2 104.3 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/a6a7d54b-0b0f-494c-857b-7a8e7f66dd80")
    (attr smd)
    (fp_text reference "C1304" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7498bb32-bcaf-47c8-859a-ef9d4f4eb3c9)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8c0bec2c-100e-4d69-946a-9c93275ffdf1)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp f2e28ed9-851e-4d70-b807-e18a5afa8b54)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 3284de83-1efc-4495-963b-7d2d29145063))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 815c64f8-8f98-4551-8fa2-6f8bcf3e3bb1))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 028a504c-3cf5-4a3f-a5ca-0e1f5f93780f))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8b4f50a1-8cdb-45cf-9d16-d814360b9132))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp ac3d1c76-3a0c-4496-85ab-6c5315db8cfb))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp dbfec66a-d14c-4525-b79f-fe5d59798cac))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 22a2f78f-b62d-4f96-ab4a-4ed86c25cf20))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 55949d0d-62d3-435e-863c-dde4ef70468b))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp f69293f9-1f8d-4f2c-9d2d-ae6e2a6c2074))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp fce9dd76-e346-418e-a192-3d0575ff1987))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 48 "/samplers/ADC 4/REFTOP") (pintype "passive") (tstamp c8b71e94-b86b-4914-9c7c-c79587b55f26))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 47 "/samplers/ADC 4/REFBTM") (pintype "passive") (tstamp fada86d7-b58d-4669-ac02-77f7f657c973))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 6bf7397e-7329-4c6f-9c79-a629e6641e8e)
    (at 170.4 83.9 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/c10ee28a-e11f-437a-b965-ac764d416b6f")
    (attr smd)
    (fp_text reference "C701" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8a03d217-2538-4286-935b-40c0ac9f9246)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 16529198-915d-4981-8fbf-ad0e014be5de)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp e7ad9f42-d01e-4c17-9a86-7ccf1c555b23)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 63778574-1db2-42fe-9c9b-08fd3cca045f))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 97df8e8d-e652-4a10-8fe5-53ffe9f115d1))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 438e34a4-eae7-41b1-a63c-0645a2c1590d))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 62e61551-1df6-434c-bad9-4141945c775f))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 6d2df9d2-7326-47aa-bd6b-e29f33712b31))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp f5836a1e-d594-4680-af61-f6fae47f1d6e))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 0b1ed202-d2df-477e-82a4-3ba9fa44e6ef))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 1f315123-eb02-4b05-9d88-98248892ba5c))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 3b39bed6-e040-468f-b2bd-370a6af7a88f))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp d440eac7-dc63-4bf6-bc51-a85b34f7e616))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 42 "/samplers/ADC 3/REFBTM") (pintype "passive") (tstamp d20e3bd2-c251-43df-a233-523813e8ff87))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 43 "/samplers/ADC 3/REFTOP") (pintype "passive") (tstamp b14cad7c-224e-4873-a920-5827eaaa18a0))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 6c713ff9-96bc-4a4d-b8ac-dc6a6dd3fb53)
    (at 199.3 98.2 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/d87f9207-6f8e-4d87-9db3-a8cd0e987887")
    (attr smd)
    (fp_text reference "C1408" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ace084c7-7e14-43bb-99dd-b256c96f0a98)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c423133a-2434-439f-bfe7-7902cc0d4119)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 75444551-e2b3-4fa4-a8e4-dac6da49eaef)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 3bebf6b8-e308-42f6-9d3a-89fef0da5c9c))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 526a9790-dbf4-43bb-9ffa-d697d0caf35a))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1dd8b8f9-2baa-4343-b453-9fc2e776083b))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 484b1e0d-5804-48ea-824d-de3033275342))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 87535178-01d1-40b4-b299-4c727d230119))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp e7000647-9923-4362-ba09-6dc5835037f8))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1eb08549-c6e4-4be5-9ec2-469f277c32c6))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp a39c8114-59cb-42ef-86aa-1542cfd990e7))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a89b0ba9-6d85-415b-9587-bf01e4dc5cdc))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp df202040-6e82-444d-93c2-4be3cef2118b))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 484767a3-9a97-4dd9-8154-c130402ff0d6))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 7c3c1ca5-d596-495b-b590-0e9220a514b0))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 6c97f28b-c983-4747-86aa-1d6b47562162)
    (at 190.8625 51.2 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/24a80803-e577-410d-8e7a-d233a60ea115")
    (attr smd)
    (fp_text reference "C410" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9661fe68-5c69-4fb5-9e0a-45870b4384c4)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2affb347-8cbe-4304-8aa7-52f1c249a0b9)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 013497db-bc56-4a01-8977-ffa13e568741)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 0ecf49ab-6614-438a-8a70-3481851a5d49))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp e24f4ce6-7922-4852-bd1f-2dff803318b5))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 589c637a-f2b7-403d-8416-4e0778c117d3))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 85dd5807-d420-4c93-86cb-a425b1d362db))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp afd198d7-a776-4387-835e-f1303cc5452f))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d25550d3-eae8-4755-8733-4fb9423f8a16))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 2565be59-9e24-4e2e-9c88-1ad6f6585dd5))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 52aec3b2-88c2-4ae0-bd28-a15a77cedfb0))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp aecb0ce0-b425-4422-aa30-63eaf8d807bb))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp c4ea7b8b-43d9-4aa7-bc8e-0d7b336c7afc))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 2f58af7c-2652-48f7-8eff-54dc9c73c8dc))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 0f740cb5-88f8-42e2-a5d9-804197e439e2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 72cace8c-d663-45c2-8e56-ce68584f6538)
    (at 180.6 71.6 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "311-2595-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "RT0603DRE07499KL")
    (property "Manufacturer" "YAGEO")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/048d1ca6-5643-4c50-acf7-be4ef6123b63")
    (attr smd)
    (fp_text reference "R501" (at 2.9 -1.7 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 688dc4aa-c626-466a-88b8-6deeecf8c3c6)
    )
    (fp_text value "500k" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d8c3fa80-b260-424c-be67-5395419dab4f)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp b35c5c14-a04a-4c67-9533-6ef15f9b181b)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 1be07c1f-7ba1-4737-9206-8b4d9d719b8d))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp a474c35a-aee8-47a3-b2f7-296e56a223ee))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 0774bf60-a07b-432b-bd02-01fcd0339485))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 32bcf8b0-fc74-4eb6-ae76-7f6b47f077e7))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9df5a92f-dc43-4030-bcee-243466aa5ef3))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fe1aabbd-58a2-4359-8837-f3ae3ae81dfa))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 6cb656f0-9cd4-408b-99d3-6aab103d8a8a))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 9b524752-6d4d-46a2-9a07-71389fe05365))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp de585955-a3da-4842-bc26-db1b57cb12c6))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp e395b1d7-6dc7-4916-bec6-3142d59b4986))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 53 "Net-(R501-Pad1)") (pintype "passive") (tstamp 599676a7-5c71-4339-b38c-a9ef53679420))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp cb891be0-7aef-4835-892c-936cba4fcc5b))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 74e8719e-b70e-42e4-914b-755e51d5c0ad)
    (at 193.7625 36.5 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/5343f4f0-e100-4eba-b86a-1121786f9ca6")
    (attr smd)
    (fp_text reference "C415" (at 4.7 -0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 04e07a54-995b-4c73-a9e2-48e60c167496)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1ee76fb9-083b-411f-838b-98fabac57746)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 7b71fd69-24de-426c-90c1-3cd6cd4c1076)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 19693962-fb06-4927-8fa2-389fb3b582fe))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 3e09bf88-5c7f-41fa-bee6-904526dcd7a4))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 572c814f-0b9d-4b44-be24-e95c4191a8df))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6aa1e8c6-2ab9-476b-809e-15e1285f0f50))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7a65e8b0-0bdf-478a-aaac-8c0c4b7caa1e))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a48d1336-e2db-4a68-8981-efb013902f0a))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 3f66288b-d154-414d-b7f7-7994b187c6a3))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 43a87a98-9b77-4990-9f24-58491a0bc233))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 47d348c8-72a4-49ab-a1d3-ff96ba63cf27))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp e6ca4bca-ee58-406d-986a-1e0fcb9d4df5))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp 09f5517b-68a7-4a71-abe1-a2a0e730affc))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 257925fa-5489-4e4b-9849-c6f719e8ec4a))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 7584b578-f612-43ea-8292-84c57f695696)
    (at 191.7 78 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/71d155fd-ad28-40c9-908e-51e07e9fd843")
    (attr smd)
    (fp_text reference "C818" (at -4.9 0.2 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp eece142e-f08b-4eb1-b911-f7a6d8396ed5)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2ff46243-dc9f-45fe-bd02-efb6ea240f8f)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp fa857ca5-6eaf-4de2-a4cf-d28ebeb375a3)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp d2634958-a28c-4854-9f63-e4a5a5f05d2e))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp fc3cb07e-317e-4e7a-8a41-7feac289145a))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3ed2dced-9039-4aba-94db-9a6d388dc9ad))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6c305972-a0f0-4ad7-8829-ac1fc2cda014))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a35e50b5-0535-4e2f-8812-9fe084fb0d85))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp a9bc74b3-b7c6-4181-ad5d-4eaf2ae74dde))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 7d8d6b02-7e9a-40f1-bfcf-e4c2dd85fb24))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a5f7c2d0-93dc-4f58-897e-a1cb1e115017))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c4149e1d-dad7-4d99-98c2-5fcbde3fa9f4))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp f04a0479-b9c2-47b3-926f-ee92940bc492))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp be83e354-91f6-4c95-820f-a1f3e3fc7b01))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 200213f2-4e36-456f-8f38-dfe0e06a01e2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 7674ebe3-785d-4264-95d8-4b892a4b0a16)
    (at 189.2625 51.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/6046fca1-d4b2-42d7-b803-7c47602c8ac4")
    (attr smd)
    (fp_text reference "C403" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7439d2c4-931b-4d80-ac28-252a21686d50)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8c8fbc94-3ed0-4981-9ad8-7309b881fe06)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 637cebda-b674-4156-b26b-0ccca9fb2ce1)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp d1ce0d59-e5a1-41be-89ef-bbf6cce9cce4))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp e3ae0d73-ca85-4fcb-aa7f-8d36354e0087))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 30c58d30-ad78-4b17-a989-f08f939380f2))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 35fe1de1-77e5-46db-9cd9-27fc2ca4c393))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5501c3d2-6095-4ce4-94d6-ae7ff177afa0))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7a84dcc0-9cc8-416f-b976-c3a05497cf24))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 20cf1452-4378-4cc7-8aa4-da6327b7669c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 47674c8a-21df-4d6b-8485-03f330954956))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 5a30e881-3342-4278-9377-628da369d746))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 7eceda21-d243-4cb1-94aa-f5ce15fafbba))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 2a2b9b15-67cd-47db-b325-b486329f2ae4))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp ee51c0f6-46c3-4c09-a272-9f84f1235d4c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 7888efb2-0757-49d4-81c9-27ceb4836f7b)
    (at 181.3 92.4 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "311-2595-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "RT0603DRE07499KL")
    (property "Manufacturer" "YAGEO")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/048d1ca6-5643-4c50-acf7-be4ef6123b63")
    (attr smd)
    (fp_text reference "R701" (at 2.9 -1.7 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8431f51f-d2bf-4254-8a01-4cbc4d8adda2)
    )
    (fp_text value "500k" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0aeea76a-7e06-491d-98c8-2dbcc492017f)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 5fb6d40d-a44a-4ddd-a7ba-060f5ad7486f)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp ebf9a886-7acf-4d58-82cc-74a173377beb))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp ef457319-b31a-49f8-af42-d589e2b496b9))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 14166411-35ad-437f-99f6-f5d5d45f423b))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 150fdcb9-45f6-4e21-be3f-85da2df0154b))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5bfe1a92-53a4-481e-86b6-0650644366e1))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c0f2141f-9105-465b-a408-437758ff36e6))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 24f4424c-62ca-445a-aa15-4b8250024149))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 74597208-fa02-4710-9037-cec1a18bd2e1))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp d98ad404-10b5-4e10-a65c-05141fab479e))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp fe675279-36f3-44c1-9ca0-2a5542082d95))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 26 "Net-(R701-Pad1)") (pintype "passive") (tstamp c2ec68ce-0964-409f-9f3e-84a93e85f93e))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 8481e9f0-d14d-4a61-87fd-4b8acc949c19))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:TSSOP-28_4.4x9.7mm_P0.65mm" (layer "F.Cu")
    (tedit 5E476F32) (tstamp 79447970-ee07-4751-aa16-7eae30695f65)
    (at 179.8 64.6 180)
    (descr "TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (property "DPN" "AD9203ARUZRL7CT-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "AD9203")
    (property "Manufacturer" "Analog Devices")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/957aae89-eaad-4355-91ec-b14040eabe5f")
    (attr smd)
    (fp_text reference "U501" (at 4.7 -2.6 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 910f1e02-6f7f-457f-b088-1bf82862d78c)
    )
    (fp_text value "AD9203" (at 0 5.8) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 40d99a9c-f258-48f1-bf93-38b1bb8e7655)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9b7643ec-9924-408f-8a2c-bb746f8f8e2e)
    )
    (fp_line (start 0 4.96) (end 2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 0c250377-5e1b-433b-bf30-0fbde90d35b7))
    (fp_line (start -2.31 -4.96) (end -2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 19070775-6360-4642-9297-375d6996c8a0))
    (fp_line (start -2.31 4.96) (end -2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp 2c44fb61-43df-4a0c-9dc9-16d074a7e593))
    (fp_line (start 2.31 4.96) (end 2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp 3ededfc0-5855-453d-b282-65501c29103a))
    (fp_line (start -2.31 -4.685) (end -3.6 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 68e27611-c645-43c2-bdf1-095fee657e68))
    (fp_line (start 0 -4.96) (end 2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp 7ecb9536-68e3-4551-adfc-3b8dfb3d2eae))
    (fp_line (start 2.31 -4.96) (end 2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 92c87e5c-c711-4a3a-a7ad-ff460d356891))
    (fp_line (start 0 -4.96) (end -2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp c0893cc6-5ac6-42f3-9bb5-c0a0f695302b))
    (fp_line (start 0 4.96) (end -2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp d890bd16-8142-47fc-b202-acc76427e6f0))
    (fp_line (start 3.85 -5.1) (end -3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp 4bf6fd3e-ba38-47dc-bbb8-f96f68f9bb28))
    (fp_line (start 3.85 5.1) (end 3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp 8b4d7a60-1b99-4009-9967-5df06a7fd42b))
    (fp_line (start -3.85 5.1) (end 3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp f5f47307-9f9a-43c1-83a0-106ab36a6fad))
    (fp_line (start -3.85 -5.1) (end -3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp fc9dae2c-a8e5-4687-b040-bddb213ed609))
    (fp_line (start 2.2 4.85) (end -2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp 363d861a-838a-424e-96f3-03c866f81d9f))
    (fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer "F.Fab") (width 0.1) (tstamp 45c8d897-fd5a-44fd-8c61-6709a3bd65f5))
    (fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp 6ad64f3a-f735-443f-aefe-d224c94a86f2))
    (fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp abe845bc-2f92-41ab-97e0-74e711b9f84a))
    (fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp f0ba5d8b-6352-4ca6-8de8-a9d23411e8a6))
    (pad "1" smd roundrect (at -2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "DRVSS") (pintype "power_in") (tstamp 6a76c970-62cb-4ce0-bdb1-3bee8573be0b))
    (pad "2" smd roundrect (at -2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 40 "/samplers/ADC 2/+3V3_A") (pinfunction "DRVDD") (pintype "power_in") (tstamp 36a687c9-df16-408f-9a49-d16f402b5877))
    (pad "3" smd roundrect (at -2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 66 "/samplers/ADC 2/D0") (pinfunction "D0") (pintype "output") (tstamp 543c477c-c304-468f-9046-e7194832bb9e))
    (pad "4" smd roundrect (at -2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 67 "/samplers/ADC 2/D1") (pinfunction "D1") (pintype "output") (tstamp 2fade65d-b075-48e1-a879-aeeba699c8de))
    (pad "5" smd roundrect (at -2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 68 "/samplers/ADC 2/D2") (pinfunction "D2") (pintype "output") (tstamp b2251529-514f-4c85-a2eb-4d52568a072a))
    (pad "6" smd roundrect (at -2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 69 "/samplers/ADC 2/D3") (pinfunction "D3") (pintype "output") (tstamp bb0a83a5-7d1c-4f86-aaed-7aeab566afc1))
    (pad "7" smd roundrect (at -2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 70 "/samplers/ADC 2/D4") (pinfunction "D4") (pintype "output") (tstamp 0b4c8ebe-146f-4deb-b60e-51c91175fdf6))
    (pad "8" smd roundrect (at -2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 71 "/samplers/ADC 2/D5") (pinfunction "D5") (pintype "output") (tstamp 390da9fd-71c0-45f6-9630-cf29e97fde18))
    (pad "9" smd roundrect (at -2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 72 "/samplers/ADC 2/D6") (pinfunction "D6") (pintype "output") (tstamp 6ff816fd-ac45-4bf5-9a6f-0778168c1631))
    (pad "10" smd roundrect (at -2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 73 "/samplers/ADC 2/D7") (pinfunction "D7") (pintype "output") (tstamp 2d2318e0-0f7b-404b-958a-907856edc874))
    (pad "11" smd roundrect (at -2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 74 "/samplers/ADC 2/D8") (pinfunction "D8") (pintype "output") (tstamp 10ce6d61-6986-4545-a2a2-c3800250b258))
    (pad "12" smd roundrect (at -2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 75 "/samplers/ADC 2/D9") (pinfunction "D9") (pintype "output") (tstamp cec8bbec-ca7f-42eb-bf49-f9aac0bb1b25))
    (pad "13" smd roundrect (at -2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 76 "/samplers/ADC 2/OUT_OF_RANGE") (pinfunction "OTR") (pintype "output") (tstamp 5c62af3b-815e-424e-b1d6-bc33bc95ddf2))
    (pad "14" smd roundrect (at -2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DFS") (pintype "input") (tstamp b4cb34d6-1bb4-488a-8151-02c9097d81f4))
    (pad "15" smd roundrect (at 2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "/REFCLK") (pinfunction "CLK") (pintype "input") (tstamp 8fe182ca-12b1-4ab4-8c65-ea3640fd8ce8))
    (pad "16" smd roundrect (at 2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "3-STATE") (pintype "input") (tstamp f47d2852-70b6-418b-a520-b1f59a4ba67a))
    (pad "17" smd roundrect (at 2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "/ADC_~{EN}") (pinfunction "STBY") (pintype "input") (tstamp 32936a51-181a-4a90-b85f-0115be8e26dd))
    (pad "18" smd roundrect (at 2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "REFSENSE") (pintype "input") (tstamp 1d4a42ab-6da8-49fb-96b7-1f51c73e3911))
    (pad "19" smd roundrect (at 2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "CLAMP") (pintype "input") (tstamp dee67909-8e5a-45d3-875a-432fa5e9b86c))
    (pad "20" smd roundrect (at 2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 77 "unconnected-(U501-Pad20)") (pinfunction "CLAMPIN") (pintype "input+no_connect") (tstamp 58ca5941-5fe6-40d3-b178-ce6855a1bb3a))
    (pad "21" smd roundrect (at 2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 53 "Net-(R501-Pad1)") (pinfunction "PWRCON") (pintype "input") (tstamp ff66cff1-f663-4b9a-bccd-22cd6cca9e7b))
    (pad "22" smd roundrect (at 2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 38 "/samplers/ADC 2/REFTOP") (pinfunction "REFTF") (pintype "passive") (tstamp e7884151-ec60-4409-816d-f1075e8bcbcc))
    (pad "23" smd roundrect (at 2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 39 "/samplers/ADC 2/VREF") (pinfunction "VREF") (pintype "input") (tstamp efe12bb6-0ecf-477c-b9f9-a107f1cf3cf5))
    (pad "24" smd roundrect (at 2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 37 "/samplers/ADC 2/REFBTM") (pinfunction "REFBF") (pintype "passive") (tstamp 4d031824-3b8c-4ba8-a8dd-c3d9d747473e))
    (pad "25" smd roundrect (at 2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "/CHANNEL_2") (pinfunction "AINP") (pintype "input") (tstamp 9ef16852-afc9-42d7-aab8-6ac7ab1d12ec))
    (pad "26" smd roundrect (at 2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 39 "/samplers/ADC 2/VREF") (pinfunction "AINN") (pintype "input") (tstamp 374a378f-f9fd-444b-bccd-a458ee1e303b))
    (pad "27" smd roundrect (at 2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "AVSS") (pintype "power_in") (tstamp 6883db07-e7ce-4072-8461-1a88fa30d766))
    (pad "28" smd roundrect (at 2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "AVDD") (pintype "power_in") (tstamp cb983141-68fc-4928-8244-96b22695c8be))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 7c71ddd3-c20f-4e82-b45a-648d02fddee0)
    (at 198.4 78 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/527e65c7-d8ea-4621-b262-27c54a4daaf9")
    (attr smd)
    (fp_text reference "C805" (at 2.4 0.2 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9211db0b-6219-470f-a50d-9e9c0a08afed)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4764fb03-4adb-4c41-8918-26b57a217e9e)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 12d8f83a-cc38-41c6-8a9a-8e85a7204f9e)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp a0866e94-de73-4b9b-a9a5-4c2e5bdb2126))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp e430265a-c37e-4f4d-9ea8-f1a1d024c6ed))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 25b3a18e-0ebd-414e-b65b-9d6c3233d8c1))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6cc41471-2d66-412c-8505-cd845fcf997e))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 81b4faf1-ab68-4bba-ae86-83568e24dcbc))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp c8ecb1c5-1919-4d2b-a4cb-e112cf795fd4))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4d86f723-484f-419c-b254-e139aa54ef97))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4fac1ac5-9fdf-45ec-845f-6fe411f43b6b))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 8184ac14-668a-43f1-b5da-cacb4c22c3f1))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 94562d63-030c-48f6-87d8-98aa687f12da))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 27afb292-5e98-4dc6-852a-206fdfa9eec2))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 5ea64724-a78a-4095-ab86-8dcc29d7903b))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 7d01bfad-d299-432d-a896-5e385389b98b)
    (at 188.3 78.8)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/c0df7e68-f1ba-4776-90af-9f67007d48a5")
    (attr smd)
    (fp_text reference "FB801" (at -1 -1.6) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ae5c34f2-5fbf-4d53-93a6-6bfb596fd01b)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4bf7cb40-2e29-4f2d-8303-39e42e321c6b)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 055aba55-9128-43e2-a0df-07b657c7852c)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 12539e49-0ef9-4097-a995-283b71a35e1a))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp c9705688-1794-4a46-8d7a-7499fd454f8a))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 03f01d03-f775-45bb-b053-98bfc5c2be32))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a3930f21-917e-4fcb-b1e3-5353b5e1b981))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c7ef6fb3-6ff3-4c73-9956-72b72b385bf5))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp c9e1000a-c2fd-47c6-ba55-540185c214fd))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 751eefa3-9dd1-4498-8887-af3cc9f1818c))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 7b7e92f7-caf4-49c1-a94b-976412066f62))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp a1d59c86-38eb-4859-86df-03cb70cfa6ca))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp b8b3da56-bbe3-45f9-a483-be83eeb984e8))
    (pad "1" smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp a364996b-0b30-4571-a8c4-ee9a95942c58))
    (pad "2" smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp c501042c-765b-4e2f-bf6e-a3d6cd22510d))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 7d1879c4-2293-4568-84b1-7150af37c465)
    (at 182.4 79.3)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/18f358e1-dffd-40a8-84ab-79359e4145fb")
    (attr smd)
    (fp_text reference "C708" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a6017d8c-639d-4e78-b1ca-103e9481fcc8)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9475a9d1-3302-45be-ba34-03d248f25728)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 025babdd-9103-455b-bc11-467d5d4ef09a)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 16fa96b5-7970-444d-b6b4-b6bea8eb5e4e))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp b54999a5-2e77-4c1a-8e91-b60a1a345f6c))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 01886005-7755-4c16-8340-acde39f4cbad))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5db78ec1-8bd6-4bd1-8cf5-b22a6eccd11d))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 73dbff6a-5b6a-46b7-88ca-05bff5faa475))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp bfac97b9-4a0e-41ac-b399-43927b8a895e))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 247d156a-8cc1-481f-9892-53b3e5665cb1))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 3a51e904-141a-4314-aa68-78cb8ff8bc15))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6271e319-3c1a-4e92-8a90-f8feca175a56))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp e9dd8ac9-6e59-4962-837b-8aafa32292a2))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 37fc9d87-09ca-48f5-b2c7-2bdb1ae507bd))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 4ae6285e-c8cc-4ba5-a013-7a95dd9218e1))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 7e5e3ec1-0982-4971-ab68-3deecbd76c9b)
    (at 180.2 112.6 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/16a9bd5f-0bfa-4f42-8382-27d5a088e9b7")
    (attr smd)
    (fp_text reference "FB1301" (at 3 2 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 17b8db91-ca8e-47a0-b4ff-d9a980a8717f)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c781fb81-673f-4220-844d-f988604f4282)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 8e37501a-1c7f-4aa6-a276-6d2182ed20cb)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 0e59faa4-430d-43d4-ba00-a627f9e115b1))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp 3f3e12ff-ed45-418e-98da-915f269ce8a3))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1cc73cff-3108-47e5-b6ed-d4ba43331dd0))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3f6954e6-1e5d-4a14-ab2a-30f7345b7f96))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e48c229c-cbcc-49b8-acab-ba9943875a6e))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ffcc049a-f57a-4e43-9e9f-03dbd10e033b))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 708e41aa-b378-4da4-b83b-ddf6c0c562e3))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 9d1e1135-c523-4815-9131-bef1c103cbd7))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp dcc4263f-0baa-42e3-99d9-4f9d3d986527))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp fdd91577-ca25-46fe-9dc3-98abcf1acd50))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 90fc45ac-6d96-441d-a979-f0dd4bf7a207))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 50 "/samplers/ADC 4/+3V3_A") (pintype "passive") (tstamp d1d9ce4e-599b-4906-a685-88a198b60047))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "sonar-footprints:PMOD_Header" (layer "F.Cu")
    (tedit 59FED5CB) (tstamp 7f65c0b9-8d71-427d-869f-269b2c93f1dc)
    (at 221.46 67.09 180)
    (descr "Through hole angled pin header, 2x06, 2.54mm pitch, 6mm pin length, double rows")
    (tags "Through hole angled pin header THT 2x06 2.54mm double row")
    (property "DPN" "2057-PH2RA-12-UA-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "PH2RA-12-UA")
    (property "Manufacturer" "Adam Tech")
    (property "Sheetfile" "headers.kicad_sch")
    (property "Sheetname" "PMOD Headers")
    (path "/0096dea5-c739-4b8e-aade-d8d90eceefb8/f54e5bec-f95e-4858-9e57-d7b90945c527")
    (attr through_hole)
    (fp_text reference "J202" (at 0 -2.82) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp f1148791-9ab9-41e1-8f4f-cb0f3764fad9)
    )
    (fp_text value "Conn_02x06_Top_Bottom" (at -1.6 16) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b685cf48-91b8-4c43-804f-51eaff8dbac6)
    )
    (fp_text user "${REFERENCE}" (at -4.13 6.21 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3fed2529-ee56-409c-acdf-0306565ad51c)
    )
    (fp_line (start -11.46 12.94) (end -11.46 12.18) (layer "F.SilkS") (width 0.12) (tstamp 0024bcdd-e3ba-458e-8df7-68e4ca4f829b))
    (fp_line (start -11.46 2.02) (end -5.46 2.02) (layer "F.SilkS") (width 0.12) (tstamp 0087faba-0443-464b-b762-a9b7918acd24))
    (fp_line (start -0.29 -0.6) (end 0.097071 -0.6) (layer "F.SilkS") (width 0.12) (tstamp 063c6631-af51-4c64-bc3f-4e91aba56a28))
    (fp_line (start -11.46 2.78) (end -11.46 2.02) (layer "F.SilkS") (width 0.12) (tstamp 09359bdd-8c1d-41ec-8ed4-740e00a51b49))
    (fp_line (start -0.29 0.16) (end 0.097071 0.16) (layer "F.SilkS") (width 0.12) (tstamp 09d593b4-95ae-4fc3-a2ee-6d7d8764dec6))
    (fp_line (start -2.402929 0.24) (end -2.8 0.24) (layer "F.SilkS") (width 0.12) (tstamp 0dc304d0-8d8e-43f9-872e-13a757195006))
    (fp_line (start -0.357071 10.32) (end 0.097071 10.32) (layer "F.SilkS") (width 0.12) (tstamp 0f7879f3-6b33-40b6-9ecb-cc5ebc960306))
    (fp_line (start -2.8 -1.47) (end -5.46 -1.47) (layer "F.SilkS") (width 0.12) (tstamp 11002b2e-8f72-4558-b75d-ac07c1e8ad77))
    (fp_line (start -5.46 10.4) (end -11.46 10.4) (layer "F.SilkS") (width 0.12) (tstamp 11d36ccd-42fc-4483-8494-1ffb020b4847))
    (fp_line (start -5.4 0.14) (end -11.4 0.14) (layer "F.SilkS") (width 0.12) (tstamp 11f0c4f2-9241-4ae8-93b8-1616a88b25e9))
    (fp_line (start -11.46 7.86) (end -11.46 7.1) (layer "F.SilkS") (width 0.12) (tstamp 1689bf01-70e9-4a5a-9e2f-6cb242af98d0))
    (fp_line (start -11.4 0.2) (end -11.4 -0.56) (layer "F.SilkS") (width 0.12) (tstamp 17319f02-d8d9-4de8-bfa4-386a6f599e0a))
    (fp_line (start -5.4 0.2) (end -11.4 0.2) (layer "F.SilkS") (width 0.12) (tstamp 219ea15c-4999-423f-a33a-a4fc9f36eeab))
    (fp_line (start -0.357071 2.7) (end 0.097071 2.7) (layer "F.SilkS") (width 0.12) (tstamp 25ddf369-49b5-403c-bbf4-d85fc1436190))
    (fp_line (start -5.4 -0.22) (end -11.4 -0.22) (layer "F.SilkS") (width 0.12) (tstamp 27de69b7-8857-4ad0-95b6-369cd5ffc948))
    (fp_line (start -5.46 5.32) (end -11.46 5.32) (layer "F.SilkS") (width 0.12) (tstamp 29e59c9c-7ab5-405f-9e8a-bf6a8189ab1a))
    (fp_line (start -2.67 -0.22) (end -2.67 -1.49) (layer "F.SilkS") (width 0.12) (tstamp 33a9c9c7-73f6-4821-b766-8674fdf0991a))
    (fp_line (start -5.46 -1.47) (end -5.46 13.89) (layer "F.SilkS") (width 0.12) (tstamp 344da128-71a7-433c-9d39-d5b472826ca3))
    (fp_line (start -2.8 1.13) (end -5.46 1.13) (layer "F.SilkS") (width 0.12) (tstamp 3f3cd88f-9ed6-4c4d-9c88-18158206f4db))
    (fp_line (start -0.357071 7.78) (end 0.097071 7.78) (layer "F.SilkS") (width 0.12) (tstamp 41ce843b-b585-4929-8738-a3ec485d2548))
    (fp_line (start -5.4 -0.1) (end -11.4 -0.1) (layer "F.SilkS") (width 0.12) (tstamp 438b72ae-a134-4024-aaf0-f7929a69076b))
    (fp_line (start -2.402929 12.18) (end -2.8 12.18) (layer "F.SilkS") (width 0.12) (tstamp 48044b8c-c342-442d-b8a2-000b8c28b213))
    (fp_line (start -11.4 -0.56) (end -5.4 -0.56) (layer "F.SilkS") (width 0.12) (tstamp 48210142-0a1c-49c6-b6ba-a92c91ff6b72))
    (fp_line (start -2.402929 9.64) (end -2.8 9.64) (layer "F.SilkS") (width 0.12) (tstamp 4d278aca-9c01-4074-8ed3-78d2f8439a48))
    (fp_line (start -0.357071 4.48) (end 0.097071 4.48) (layer "F.SilkS") (width 0.12) (tstamp 53eacf31-9dd1-41e9-816f-bf61b21c53e8))
    (fp_line (start -0.357071 9.56) (end 0.097071 9.56) (layer "F.SilkS") (width 0.12) (tstamp 5424bf48-204b-4431-91c2-3b100d404488))
    (fp_line (start -2.402929 4.56) (end -2.8 4.56) (layer "F.SilkS") (width 0.12) (tstamp 64571478-f2cb-4d65-bd3f-a42a71860a7d))
    (fp_line (start -11.46 4.56) (end -5.46 4.56) (layer "F.SilkS") (width 0.12) (tstamp 6882bc47-76b3-41e6-91ad-8eeedba64b9d))
    (fp_line (start -11.46 10.4) (end -11.46 9.64) (layer "F.SilkS") (width 0.12) (tstamp 6d3f623d-12dd-4e23-a0c7-2524b54ea403))
    (fp_line (start -11.46 5.32) (end -11.46 4.56) (layer "F.SilkS") (width 0.12) (tstamp 6d7db8e7-8f7b-4e3c-bd9f-f4eb1bcd9475))
    (fp_line (start -2.8 13.89) (end -2.8 -1.47) (layer "F.SilkS") (width 0.12) (tstamp 75b368cf-dc42-4727-b074-f0345e56c534))
    (fp_line (start -5.4 -0.46) (end -11.4 -0.46) (layer "F.SilkS") (width 0.12) (tstamp 81fd2ce2-bada-480b-8a4f-e55193153557))
    (fp_line (start -5.46 2.78) (end -11.46 2.78) (layer "F.SilkS") (width 0.12) (tstamp 847b2b1b-4a21-4fc1-b18c-95de50fe9c97))
    (fp_line (start -11.46 9.64) (end -5.46 9.64) (layer "F.SilkS") (width 0.12) (tstamp 8591698d-42f1-4972-b13c-ef764f57768b))
    (fp_line (start -11.46 7.1) (end -5.46 7.1) (layer "F.SilkS") (width 0.12) (tstamp 88cfe99b-a590-458b-a29a-8e36c716ecce))
    (fp_line (start -0.357071 1.94) (end 0.097071 1.94) (layer "F.SilkS") (width 0.12) (tstamp 8ba62bb7-ce0b-431e-9345-a7fcf5fe9c79))
    (fp_line (start -0.357071 12.86) (end 0.097071 12.86) (layer "F.SilkS") (width 0.12) (tstamp 8e090dbe-4304-4511-9df4-d1d996bf6171))
    (fp_line (start -2.8 3.67) (end -5.46 3.67) (layer "F.SilkS") (width 0.12) (tstamp 9455b7ae-cb53-4759-bdf1-06f072cf4763))
    (fp_line (start -2.402929 2.02) (end -2.8 2.02) (layer "F.SilkS") (width 0.12) (tstamp 9673f654-4403-42f6-b127-aa9e48d97a40))
    (fp_line (start -2.8 8.75) (end -5.46 8.75) (layer "F.SilkS") (width 0.12) (tstamp 96a6dc1f-7291-4a51-bea8-e6fc0f4093ed))
    (fp_line (start -2.402929 7.86) (end -2.8 7.86) (layer "F.SilkS") (width 0.12) (tstamp af68c898-26b4-4883-b823-cb5b1ebb8a78))
    (fp_line (start -2.402929 7.1) (end -2.8 7.1) (layer "F.SilkS") (width 0.12) (tstamp af712e5d-da73-45c4-b7fc-f815e6aece17))
    (fp_line (start -5.4 -0.34) (end -11.4 -0.34) (layer "F.SilkS") (width 0.12) (tstamp afcbd06e-2d62-4723-8af0-215ad46e2f10))
    (fp_line (start -5.46 13.89) (end -2.8 13.89) (layer "F.SilkS") (width 0.12) (tstamp b6ef06d0-0877-41b7-8288-e808a68d52b9))
    (fp_line (start -0.357071 12.1) (end 0.097071 12.1) (layer "F.SilkS") (width 0.12) (tstamp bcf4d847-6699-4a6a-8f73-604051a53361))
    (fp_line (start -2.8 11.29) (end -5.46 11.29) (layer "F.SilkS") (width 0.12) (tstamp bd3bc5a9-cfe2-499e-b692-df987d57904d))
    (fp_line (start -0.357071 5.24) (end 0.097071 5.24) (layer "F.SilkS") (width 0.12) (tstamp c9bdda2c-72c1-4e09-9c60-bc8f977a4323))
    (fp_line (start -2.8 6.21) (end -5.46 6.21) (layer "F.SilkS") (width 0.12) (tstamp c9e31811-0f5d-4c4c-9b3a-14cdc471c2fb))
    (fp_line (start -11.46 12.18) (end -5.46 12.18) (layer "F.SilkS") (width 0.12) (tstamp ce344b27-1740-4a78-b128-e3b95b64a3ca))
    (fp_line (start -5.46 12.94) (end -11.46 12.94) (layer "F.SilkS") (width 0.12) (tstamp d5719dbd-1d9c-41c6-b5ea-c679b2459b83))
    (fp_line (start -5.46 7.86) (end -11.46 7.86) (layer "F.SilkS") (width 0.12) (tstamp d7d782d0-019b-489d-a73d-8129f4b19f9e))
    (fp_line (start -2.402929 -0.52) (end -2.8 -0.52) (layer "F.SilkS") (width 0.12) (tstamp dae63a9e-ec52-4bde-bbfb-a4f3d1b3c31e))
    (fp_line (start -2.402929 10.4) (end -2.8 10.4) (layer "F.SilkS") (width 0.12) (tstamp e043085b-3f3c-47ba-900e-9b10c0f3b9b0))
    (fp_line (start -2.67 -1.49) (end -1.4 -1.49) (layer "F.SilkS") (width 0.12) (tstamp e840fc88-d81e-4e21-9013-f87215b5981d))
    (fp_line (start -0.357071 7.02) (end 0.097071 7.02) (layer "F.SilkS") (width 0.12) (tstamp e8700504-400e-4242-93d0-723f95fa09a9))
    (fp_line (start -2.402929 2.78) (end -2.8 2.78) (layer "F.SilkS") (width 0.12) (tstamp ef41b728-8d10-43ca-b7ab-9a9be0a40040))
    (fp_line (start -2.402929 12.94) (end -2.8 12.94) (layer "F.SilkS") (width 0.12) (tstamp ef8a07e9-2bfd-4684-9b8c-6433651a14ed))
    (fp_line (start -2.402929 5.32) (end -2.8 5.32) (layer "F.SilkS") (width 0.12) (tstamp fa20cd12-c118-4754-af1d-ecab8fd269c7))
    (fp_line (start -5.4 0.02) (end -11.4 0.02) (layer "F.SilkS") (width 0.12) (tstamp fa8472c0-7f62-43c0-a56a-955c89a096f9))
    (fp_line (start 2.85 -2.02) (end -12.05 -2.02) (layer "F.CrtYd") (width 0.05) (tstamp 15a4039a-bbe3-4cc8-b580-aef8529a5863))
    (fp_line (start 2.85 14.28) (end 2.85 -2.02) (layer "F.CrtYd") (width 0.05) (tstamp 99fca3d6-ac16-4506-92fc-7b2a1931e231))
    (fp_line (start -12.05 14.28) (end 2.85 14.28) (layer "F.CrtYd") (width 0.05) (tstamp a24d93e5-0b88-4f20-8b9a-a3c4190a6896))
    (fp_line (start -12.05 -2.02) (end -12.05 14.28) (layer "F.CrtYd") (width 0.05) (tstamp af5c2e21-80e8-4770-9044-0088643ff0c3))
    (fp_line (start -5.4 12.24) (end -11.4 12.24) (layer "F.Fab") (width 0.1) (tstamp 0113db55-f7f0-4216-a657-56b07cfb7c90))
    (fp_line (start -11.4 5.26) (end -11.4 4.62) (layer "F.Fab") (width 0.1) (tstamp 0cac0d60-5c91-49ad-a3f9-5e9d679bdbfd))
    (fp_line (start -5.4 5.26) (end -11.4 5.26) (layer "F.Fab") (width 0.1) (tstamp 19298f48-2d13-437c-bc4f-89bb5b5aa2ad))
    (fp_line (start -3.495 13.83) (end -5.4 13.83) (layer "F.Fab") (width 0.1) (tstamp 1fed5942-843b-4f56-8457-4b3a59b16be6))
    (fp_line (start -5.4 2.08) (end -11.4 2.08) (layer "F.Fab") (width 0.1) (tstamp 28821243-71c6-4585-998e-dd52cba10800))
    (fp_line (start -5.4 7.16) (end -11.4 7.16) (layer "F.Fab") (width 0.1) (tstamp 2b9fd180-347f-4613-b7fd-3801272bb5e5))
    (fp_line (start -5.4 13.83) (end -5.4 -1.41) (layer "F.Fab") (width 0.1) (tstamp 31abd203-7794-482c-9fd0-a263425dcf80))
    (fp_line (start -1.72 12.16) (end -1.72 12.8) (layer "F.Fab") (width 0.1) (tstamp 3c8af0c1-1c78-42d5-836b-a85b40f4ce9d))
    (fp_line (start -1.72 7.72) (end 2.64 7.72) (layer "F.Fab") (width 0.1) (tstamp 422cac28-1831-4b90-b55a-b3ea3c344a23))
    (fp_line (start -1.72 7.08) (end -1.72 7.72) (layer "F.Fab") (width 0.1) (tstamp 450ae5bb-2822-4d62-93c6-03d470ded7c8))
    (fp_line (start -1.72 10.26) (end 2.64 10.26) (layer "F.Fab") (width 0.1) (tstamp 56869dde-600c-4aaf-b005-a8a8bd1c4d7d))
    (fp_line (start -2.86 13.195) (end -3.495 13.83) (layer "F.Fab") (width 0.1) (tstamp 56a710a3-3b0b-4636-bc9f-f557280ba400))
    (fp_line (start -11.4 12.88) (end -11.4 12.24) (layer "F.Fab") (width 0.1) (tstamp 5b194d17-bb8b-44b2-ac4c-6ce068653562))
    (fp_line (start -1.72 -0.54) (end 2.64 -0.54) (layer "F.Fab") (width 0.1) (tstamp 5c01614b-4020-4407-8c3d-107282f16a91))
    (fp_line (start -5.4 12.88) (end -11.4 12.88) (layer "F.Fab") (width 0.1) (tstamp 5dbaff78-1a85-4dfc-b167-cd5e831e7398))
    (fp_line (start -1.72 4.54) (end 2.64 4.54) (layer "F.Fab") (width 0.1) (tstamp 5e05a943-9b15-4805-8c26-a610bf7a3ffc))
    (fp_line (start -11.4 7.8) (end -11.4 7.16) (layer "F.Fab") (width 0.1) (tstamp 72797af3-8b6e-4c67-9428-189628275b25))
    (fp_line (start -1.72 7.08) (end 2.64 7.08) (layer "F.Fab") (width 0.1) (tstamp 73628b75-31f6-4c5e-a86c-06150656ee4b))
    (fp_line (start -5.4 9.7) (end -11.4 9.7) (layer "F.Fab") (width 0.1) (tstamp 7d94276d-0c46-4704-a78c-7b8e6988c203))
    (fp_line (start -1.72 2.64) (end 2.64 2.64) (layer "F.Fab") (width 0.1) (tstamp 879e4548-1098-464a-8acd-0aba8b1ce0df))
    (fp_line (start -5.34 0.14) (end -11.34 0.14) (layer "F.Fab") (width 0.1) (tstamp 9bc106c1-dc6d-4f25-b7e9-5472ae707efb))
    (fp_line (start -1.72 -0.54) (end -1.72 0.1) (layer "F.Fab") (width 0.1) (tstamp 9cb193dd-3994-4d33-a6a6-2934219a4972))
    (fp_line (start -5.4 7.8) (end -11.4 7.8) (layer "F.Fab") (width 0.1) (tstamp a0c4452f-1519-477f-b54e-7ae24dd39420))
    (fp_line (start -5.4 2.72) (end -11.4 2.72) (layer "F.Fab") (width 0.1) (tstamp a44c2f69-cdc2-4a26-b2c1-7dffa095d5b5))
    (fp_line (start -1.72 4.54) (end -1.72 5.18) (layer "F.Fab") (width 0.1) (tstamp b05286b5-bce9-4375-8f8e-81749e85eba5))
    (fp_line (start -5.4 4.62) (end -11.4 4.62) (layer "F.Fab") (width 0.1) (tstamp b65e462d-0737-4cf1-8854-052424ff4804))
    (fp_line (start -11.4 2.72) (end -11.4 2.08) (layer "F.Fab") (width 0.1) (tstamp b6a655f3-1db0-44f7-b611-f9bc9f91e13e))
    (fp_line (start -5.4 10.34) (end -11.4 10.34) (layer "F.Fab") (width 0.1) (tstamp b882d648-fd6b-4b11-8cd2-298463400ecd))
    (fp_line (start -5.34 -0.5) (end -11.34 -0.5) (layer "F.Fab") (width 0.1) (tstamp b934cdcc-486d-49c1-8bda-24150d911316))
    (fp_line (start -11.34 0.14) (end -11.34 -0.5) (layer "F.Fab") (width 0.1) (tstamp ce53e782-9c89-430a-8875-d6ede9bf4fbe))
    (fp_line (start -11.4 10.34) (end -11.4 9.7) (layer "F.Fab") (width 0.1) (tstamp d0738844-a38f-4d43-8ea3-2ce6cfa78436))
    (fp_line (start -1.72 12.8) (end 2.64 12.8) (layer "F.Fab") (width 0.1) (tstamp d5a1d6f5-fccc-4faf-813a-d0df135d4292))
    (fp_line (start -1.72 2) (end 2.64 2) (layer "F.Fab") (width 0.1) (tstamp e0439939-fcba-4ef9-8811-9477d798a529))
    (fp_line (start -1.72 2) (end -1.72 2.64) (layer "F.Fab") (width 0.1) (tstamp e1c3e21f-018f-43d9-909e-1df96be9e839))
    (fp_line (start -1.72 12.16) (end 2.64 12.16) (layer "F.Fab") (width 0.1) (tstamp e6baaf30-1c26-4e5f-8d88-ed26b6a0172d))
    (fp_line (start -1.72 5.18) (end 2.64 5.18) (layer "F.Fab") (width 0.1) (tstamp f10f980b-ae4c-4c8f-afea-4b424c3ebe20))
    (fp_line (start -2.86 -1.41) (end -2.86 13.195) (layer "F.Fab") (width 0.1) (tstamp f1df4b41-ce43-4510-97fd-6a6bea42a17e))
    (fp_line (start -1.72 9.62) (end 2.64 9.62) (layer "F.Fab") (width 0.1) (tstamp f2536ebc-f697-401e-b82c-71750616216e))
    (fp_line (start -1.72 0.1) (end 2.64 0.1) (layer "F.Fab") (width 0.1) (tstamp f5b974dc-bae7-4eb6-9edd-21a3150e1956))
    (fp_line (start -1.72 9.62) (end -1.72 10.26) (layer "F.Fab") (width 0.1) (tstamp fa444670-9b36-4b44-98a9-0a21664c61cb))
    (fp_line (start -5.4 -1.41) (end -2.86 -1.41) (layer "F.Fab") (width 0.1) (tstamp fbce3e1d-ba94-4747-b0c2-380cdcb61ce5))
    (pad "1" thru_hole oval (at 1.14 -0.22 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 "/PMOD Headers/LVDS1+") (pinfunction "Pin_1") (pintype "passive") (tstamp dde4aeda-8fc3-4302-99ee-b4fc19075072))
    (pad "2" thru_hole oval (at 1.14 2.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 "/PMOD Headers/LVDS1-") (pinfunction "Pin_2") (pintype "passive") (tstamp b1b15d5b-60df-4852-8e16-449584f4a118))
    (pad "3" thru_hole oval (at 1.14 4.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 "/PMOD Headers/LVDS2+") (pinfunction "Pin_3") (pintype "passive") (tstamp 09953c79-00e8-4a56-bd77-5ad095a0bb87))
    (pad "4" thru_hole oval (at 1.14 7.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 "/PMOD Headers/LVDS2-") (pinfunction "Pin_4") (pintype "passive") (tstamp e497bbfe-ac7b-4f47-9587-82c34f701d2a))
    (pad "5" thru_hole oval (at 1.14 9.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_5") (pintype "passive") (tstamp 4bbfe583-3404-4cd3-b499-bd7e90b7ed84))
    (pad "6" thru_hole oval (at 1.14 12.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 "/PMOD_3V3") (pinfunction "Pin_6") (pintype "passive") (tstamp e84510c5-0620-4eac-9ea6-d696f75f4f69))
    (pad "7" thru_hole rect (at -1.4 -0.22 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 "/PMOD Headers/LVDS3+") (pinfunction "Pin_7") (pintype "passive") (tstamp c0bbb6f9-ab2b-488a-af2b-0cae8d5191db))
    (pad "8" thru_hole oval (at -1.4 2.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 "/PMOD Headers/LVDS3-") (pinfunction "Pin_8") (pintype "passive") (tstamp 37fa5ab1-355e-4d91-affa-49a979c4b628))
    (pad "9" thru_hole oval (at -1.4 4.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 "/PMOD Headers/LVDS4+") (pinfunction "Pin_9") (pintype "passive") (tstamp 678961a2-2000-4ed9-bb90-86827b9987d5))
    (pad "10" thru_hole oval (at -1.4 7.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 "/PMOD Headers/LVDS4-") (pinfunction "Pin_10") (pintype "passive") (tstamp 7d31fdda-424b-4bbe-9480-0192beba923a))
    (pad "11" thru_hole oval (at -1.4 9.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_11") (pintype "passive") (tstamp a9c6c084-1310-4015-b55d-c027f36b2237))
    (pad "12" thru_hole oval (at -1.4 12.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 "/PMOD_3V3") (pinfunction "Pin_12") (pintype "passive") (tstamp 596467da-e4b0-4700-a6da-bf4da7d3e367))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x06_P2.54mm_Horizontal.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 852f1bc3-36f8-4b20-a454-c34dadbaf0d7)
    (at 182.6625 51.1 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/6d03a26e-0dcd-4a97-9fd1-42e476158f17")
    (attr smd)
    (fp_text reference "C309" (at 0 -1.68 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 183a7bbe-1f43-41a0-9c22-16535d8dd62b)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp e884ad46-a8f7-46be-98f6-cbd242268625)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 1119219d-2205-44f2-aacc-28123ca84545)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 998188ed-6eec-46ff-ab0e-5e1f28264557))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp fa3da833-f3ea-4fd2-bf3c-54bc1bde6f3a))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 27f51f1e-d32a-4988-9f9a-3f94e6185f82))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 8f00e4f3-72ac-4e2f-8a8f-a2515d031710))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp cde5b353-6c66-47d7-b566-5e71b4fbbec8))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp d8a92841-988e-4fbd-8909-3dd0bad7b97e))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 4540f9e6-9605-4c11-ba1a-f86e8566e9d1))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 8c450979-bd01-4a48-b018-9bbbbd5df9fb))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp b2f32ea6-1e74-4d03-841f-9b1a86bc9305))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp ba3c4f92-0d4b-42b1-adb9-afecae0bcd2d))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp b6b79c6a-2e3b-4b61-9ff1-2c68a9185e90))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 35 "/samplers/ADC 1/+3V3_A") (pintype "passive") (tstamp 69f541ac-5275-4a51-80f2-4148394ef5ae))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 875340eb-2fb6-45ff-a657-73e0a87ea9b3)
    (at 183.2 99.5)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/18f358e1-dffd-40a8-84ab-79359e4145fb")
    (attr smd)
    (fp_text reference "C1308" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2c1fe1aa-1a85-439f-baf8-4884fd28c4ae)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c2abcb57-b836-41e3-bbb7-aae8a61d5af8)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 91aa30e6-5c81-4d82-8446-cf422684027c)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 8a3babc2-91a5-41e4-bf3f-c9098e7a627f))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp cbdb0bd5-f7bf-4508-a9be-d3d5e1927638))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 03fbb297-897e-4fe9-b0fc-835f526a7e4f))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 062bd50a-9c57-4ea1-b7d3-de17df35a83e))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1269d374-567f-427f-9752-dd4be062d8b1))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c046b57d-ed68-4c3a-9d31-d8ee007a856b))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0e8175c6-7a57-4f47-a870-e17282baa5e9))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1c1aab9c-51b7-4a1f-8ff0-f67f49e9d299))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 7faf4cb4-a556-4349-8065-b151d824483f))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp d88276b0-481e-455e-902e-1acd2948310a))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 0ccf92e3-2421-46cc-9523-89e494d8ff7c))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp f3a4880d-b0d1-4861-8800-881c81dd0f5a))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 8c0633b2-add3-434e-973c-020304e38fb9)
    (at 198.8625 36.5 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/d87f9207-6f8e-4d87-9db3-a8cd0e987887")
    (attr smd)
    (fp_text reference "C408" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp af9b8f84-ca2e-40ec-a0ed-6b2c73071494)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b03ea400-6de8-438f-a99e-607539b5f7be)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 0d80e649-eb58-4cb1-92e5-cfce5717ed24)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 254dc7ad-b94b-44f0-ad3b-a37bf5291d78))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp fba26cf8-2cf2-4e01-bcdf-86a06206d4c0))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 07594be4-fad9-42cc-b353-f092fe189e72))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8487d333-750c-4afe-a6bc-cc57cd434fbf))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 86045074-04ee-4541-a835-70ba0fe2d5e5))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ec869e08-5462-4028-a7bd-44fe8fbba92b))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 094bdf84-21e6-44ff-b4be-93e147c2ae8b))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 99698820-0cd2-46a6-929e-92a375dcda2c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp cdf3181b-54ec-47d5-8265-a60d6b07f44e))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f7655020-9777-4523-8ea5-857fcabac500))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp df6ecefd-4931-493d-b08a-eb6aaf201059))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp f313ac34-086d-407b-b078-4b859623ad4d))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 8ecc9546-7b87-44d4-a21e-a57e12d2d384)
    (at 197.6 98.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/527e65c7-d8ea-4621-b262-27c54a4daaf9")
    (attr smd)
    (fp_text reference "C1405" (at 2.4 0.2 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2a8a4616-bc4f-4f92-a8bf-e7d4e3520e47)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c0d728e8-b6af-4916-b5ea-4275e38e505d)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 9a65dba4-c10f-4a6d-80cf-085b7d2a6695)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp e5cb7327-7556-4e39-b16f-db5dc08a0d1e))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp f06c0252-2f1f-47ac-8d0f-89552a31b7f1))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3c94c81e-815b-4a36-87b9-387da0e4ede7))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 539a9b5a-1419-466e-b2b0-5c586dc41780))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 54882a3d-2596-4506-98e1-d35f6e15f7e1))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8b58f15b-e11f-4b18-a929-b7ae8d6ac7af))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0935fc1b-9ed6-487b-be92-763cd2508eb3))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 146912dc-f5f9-4ae6-9fb1-71dd52fc495d))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 772f37a8-d2ac-4a99-98d5-6058df107525))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp bfe93c42-4d8a-4468-a987-e87e487cf7d2))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 72cfcb9a-77f5-46d1-b03b-9a5af58112d0))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 170d75d8-983a-4598-a1a6-ac4b0d740712))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp 953e87d0-6c35-4deb-8129-7e25dfc4c2cf)
    (at 187.0625 37.3)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/c0df7e68-f1ba-4776-90af-9f67007d48a5")
    (attr smd)
    (fp_text reference "FB401" (at -1 -1.6) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp fe8b799e-00f3-4bf5-96fa-0e34573c1ef9)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 06f93ea6-ad7f-4477-bcdd-3c64cd7636b5)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp ba60b9d7-67f8-4300-a889-c4fc15fed992)
    )
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp 43dee0cb-ff82-4aaa-9401-4452374e1638))
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp dc29cc59-7e31-453d-b03e-8c68fd5bc15e))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 0b28d256-a7a9-438c-93dc-6b73953f2ba6))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2e58ddbd-2555-4508-b9f1-88fade4659d8))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 78640659-f599-455a-af0c-7bb3e28ca097))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e7399212-4a87-4e35-a4cf-8155fbbc48e8))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 09f39788-582f-4ace-8774-4691eff2808a))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 73c725ec-c9d3-4c35-b3f4-7b22c4a63e16))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp d7a0f45d-f10d-43c6-ad67-2629acbe1d56))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp f39e939b-c6d8-4cc3-a20b-1e58e5f99337))
    (pad "1" smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 9a3ae8df-f818-4e6d-b5fb-57d72ae0627a))
    (pad "2" smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp b289c410-e27b-4ae6-994f-d1722ecd240e))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 98396e7f-ed43-49f3-9ff3-bb7d3d0387bf)
    (at 193.7 92.7 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/13f9d3ac-827f-402e-b049-3746c48e5124")
    (attr smd)
    (fp_text reference "C809" (at -40.4 0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2cbe56fb-4a0a-453f-ad3d-296924dceb48)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 76c175ad-7638-4e30-8e1c-dc50e61165fa)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 9a5a0f44-0fe4-4103-ab95-a4ba3afa2c2c)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 3fb05ee9-50ef-4047-a44e-12050ed5a8bd))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp f8d4f51e-b710-4f1c-a9da-8e27cc89f6a6))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5af26234-ed62-4b5e-a120-04cef187cc1e))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 640f6be1-c389-4347-8c7d-8393a7afda57))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6451565f-7788-4fa3-97d8-d1786d058c1b))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 673e6adb-06b2-4d6d-9fca-5bc4094432e6))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1f5c6203-5614-4a9d-a837-c2f7ffe68451))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 40f56902-176c-467b-93cc-5bf4a062d0cd))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6070c6af-47e8-4a05-aa05-9fe6fe7fe5de))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp f55dadae-f823-401e-bdc9-f1ab842d6074))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp acaf6cf1-c4bd-4b78-8daf-3b7b163ef51a))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp c4918e83-d476-4039-8ebf-146ead6ffc6e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 9958d98a-864a-4382-8664-862c23d12cd1)
    (at 183.3 92.6 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/6d03a26e-0dcd-4a97-9fd1-42e476158f17")
    (attr smd)
    (fp_text reference "C709" (at 0 -1.68 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ccb9249f-fc62-4a7e-b332-c5e7c994b895)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 72609409-9c1f-413e-b3e9-2c0332e413ff)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 1c04c15e-2dda-4a0e-96b9-f175fe167539)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 47d51054-3377-4024-b570-3533495741d1))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 930fc100-2882-4bd8-a9f1-7aec29a05440))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 02b4969a-69a3-462b-bea5-5aae6d146783))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 27206598-eb03-4088-bc55-988a7cf89dcb))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 380bbe7b-5599-4972-8db1-2d6925f8c19e))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 72dda8b6-bdb9-4d91-b816-cc37d62f6ed4))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 06516d0e-e0f8-4852-b5f6-9f5cba4433d7))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 443331f5-b5f5-435b-8f64-cc94713e2bd8))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 6a51c75a-e5cf-4cef-813a-de9660be387d))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp ab15411d-496a-4bae-bbb4-28a91c1d1def))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp d0a61401-8427-4d90-b2b2-33d04c954b3d))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 45 "/samplers/ADC 3/+3V3_A") (pintype "passive") (tstamp 8d535de1-e255-48f2-aa6f-f80c01feb5d1))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 9a0c5eb4-9861-4427-88f6-9ed0ac50acff)
    (at 181.7 58.5)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/18f358e1-dffd-40a8-84ab-79359e4145fb")
    (attr smd)
    (fp_text reference "C508" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2245f79d-d079-41d2-ab11-6c363d4ff4c5)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6ad7a25c-6ef2-48ee-af58-a3b8614f7e59)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp ebd56476-b231-4994-a882-17e5d88a2c48)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 48173254-af2c-42ad-90b1-0f2e64b3ab9d))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp a043559d-169f-4732-bef4-f79da36b2533))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 212121ac-a16c-4908-bb15-27004a972260))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 91c633da-d97e-4e15-b86d-6be24a7cbf90))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp c3f51e09-5382-4ea6-b020-2c2c02fedb7d))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp df483f57-74e7-46b0-9818-4833b18972ca))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 0704733b-eadd-43cd-870b-3f10be8e9b36))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 300d0c4e-2d7a-45b9-9f11-43f70f44b6aa))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp b6fecd0c-95ad-48b4-b323-f3ebc3211814))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp f17b4587-59a5-4cbf-883f-d8dc66b522b0))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 5090cb86-a8d5-4825-83e8-0ef9705f9203))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 52e447ab-cdcf-4caa-93df-2918bbcdad18))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp 9b7a0603-4dba-497c-8f48-f3d663ef0bae)
    (at 176.32 112.84 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/a39dd3a1-8969-4ab5-95e8-86f67f16762a")
    (attr smd)
    (fp_text reference "C1302" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 097c3a45-928b-4960-90ca-c6cf52aea65c)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 11088c9f-96ac-4f1b-be4a-c00a08d7a104)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 4e7a935e-9526-47c1-af23-a19abde23200)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 6c0687e9-ec49-4007-a7ba-0975c48270ba))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp b7713457-3946-43dc-900a-58de3fb69ea4))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 2551a803-5243-4344-a82c-3c36faa57869))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 4dc3647c-3159-4679-8bc4-b441740b6f7c))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 6bf6d235-c3c7-479c-88a9-0eda16a0ba0a))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp e7759bc9-2f96-4ab4-80a4-0f05eeb7b501))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 2f6d09fc-cb6e-4a8b-a6bd-e6aafdc01c20))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 75a1131f-455b-4e4d-bd56-d4557581a3cc))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 810e6dee-889a-4e6b-abae-529b76656308))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp db047c72-6722-43bf-89de-77162b8c028d))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp d6436c9a-e615-4b1f-888a-20edfdc71c14))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 49 "/samplers/ADC 4/VREF") (pintype "passive") (tstamp 348522a5-30ba-4def-986a-db4d5a225505))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp a09a0d92-6f60-451e-bf34-5778b7aed717)
    (at 192.0625 36.5 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/28e1bdc8-d711-48ba-9299-b83344471ae8")
    (attr smd)
    (fp_text reference "C419" (at 4.7 -0.5 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8a31dab5-015e-4dfb-827c-0b2f84dcffeb)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 64c3ad88-a487-47ee-ba19-3e5a13bf6ae9)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp bd62033d-4152-416f-a263-b83a7069c35a)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp b0b908ee-93aa-4d6b-aee3-3b2c89f49800))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp cc0ce94e-2588-414a-81cb-bbd069357701))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6df0a725-d906-4f47-bc2f-390f36408d9c))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 9ed908c6-5f91-4aa0-b9b9-0b1cfb8bdb7d))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d0bb3880-e4ed-4c3e-a5b0-14556dde4065))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f97c81e7-2fe1-47a5-93a9-3e751ff64638))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 1e2f8198-7ac4-4904-ac6b-d055d7768f75))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 9f6dae65-9c09-41cb-afcc-bde5295bfb01))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp d1dc9d24-956c-4556-8430-949613a16155))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp edcc2700-eb6c-4b13-ba13-55467e0ec321))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp ab4a6192-eccc-4d62-a9c5-acc6cfd41175))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp fce62865-b256-43c2-b68a-83f723583acb))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp a216496d-8479-4f7a-8a5d-73c722c52194)
    (at 174.82 71.84 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/a39dd3a1-8969-4ab5-95e8-86f67f16762a")
    (attr smd)
    (fp_text reference "C502" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 06128c5f-f4fd-4430-bfe7-4877bc123679)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2d7c28ab-d5ce-4bf0-9c83-5a2536d9b962)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 5c6e7f2f-4774-4d9b-99f2-9bd2c2c97b98)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 4901311c-583c-4754-b4e7-1ba060e52dce))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp a454cbc4-5aa5-4d90-a5d2-56fcdf2e0427))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 8929fb53-9fc2-4d6d-a719-e89a16905c69))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp bed03bca-ecde-424e-8340-4362c10c04d9))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp efa04f10-22c2-49e7-ae25-99e3ee3c626e))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp f8c8fc6a-98ea-45d5-bb77-e490700126b6))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 1a4d8de2-893c-42e1-8e18-a262d14525cd))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 5e83c65f-4e6c-46f4-bf97-88a688800c15))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 6bdf211e-9a70-4643-aa5c-78a6d99ec0b9))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp f2408412-674a-438b-ac83-2374563682ae))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9cb360f7-d65e-49f4-8d4b-8f8dac3e6e34))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 39 "/samplers/ADC 2/VREF") (pintype "passive") (tstamp 73b8a44a-1835-4268-a340-81d84b2a4ef5))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp a457950a-547c-4b7a-826a-b2ccb7beb93d)
    (at 179.4 92.4 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/16a9bd5f-0bfa-4f42-8382-27d5a088e9b7")
    (attr smd)
    (fp_text reference "FB701" (at 3 2 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9099060c-f5c1-47e4-8425-8d0302efd2c8)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0bd1969c-2713-41c6-ad03-61564c54f906)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 6f603376-d370-426b-9c10-f3862cb0c003)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 373a2754-1e13-45dc-bf78-495a3228d3a3))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp dd7b421c-268c-4198-ab61-10f1c0a05b5a))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 73ada755-cd19-4ebb-83a8-3b8d14a3de0a))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 83bb51d2-b9f1-4923-bbf6-3694fc7a5989))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b8591f5e-13aa-456e-97f3-f47d052016e0))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ea48a607-0d51-4570-92bd-cadc72c1e596))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 8be7a4ce-5e1c-4a96-b99f-d0499ee612ce))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp c18e36f2-f456-42c5-bc9d-5d274f1abafb))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp cb19eb79-0681-4a5d-a98d-3681c008c3ee))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp f51fed9d-169e-47cb-8ff0-623909830372))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp a48cf081-9b0c-4dcc-ba69-0fcd6d0db313))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 45 "/samplers/ADC 3/+3V3_A") (pintype "passive") (tstamp 80ecef65-4e34-43b7-87ac-992a7c9709b8))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp a491491d-49a7-41b5-988a-d5844aa8b0e7)
    (at 171.2 104.1 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/c10ee28a-e11f-437a-b965-ac764d416b6f")
    (attr smd)
    (fp_text reference "C1301" (at 0 -1.68 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b7cc4e1f-0e9a-4066-a352-87a8f636410f)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2e0db48f-b830-4c76-8c8d-addb9f666d84)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 706a762c-c00f-4d1d-bcf5-7943d78144d3)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 0910d02e-15ba-4b67-8105-d92a7019b065))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 5fac8a9c-2344-449a-b1b4-5ebc5f21186b))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 629b67cf-7929-464a-9b8a-59d23f105039))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 750ededb-f312-4e14-b4a2-14ef9f7af9b9))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 81e7f833-2671-4ccb-943d-59946949d99a))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 98f5b570-f8c7-4663-9ba0-1ec1150bb3fa))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 4219ee7b-4720-434f-bcfe-2d4df706f4f7))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 56202efc-0597-416a-9770-344362672059))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 72bc3664-6d80-4494-862e-9b301f4190e0))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp d9255f72-23bc-4183-98b6-54bb973aba15))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 47 "/samplers/ADC 4/REFBTM") (pintype "passive") (tstamp 6f8a7ce6-ade1-44d6-b754-f411ca3e92f5))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 48 "/samplers/ADC 4/REFTOP") (pintype "passive") (tstamp 18d597a3-260d-4a75-9b46-5b9986ea5f45))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "sonar-footprints:PMOD_Header" (layer "F.Cu")
    (tedit 59FED5CB) (tstamp a4fe9f30-ba88-43ef-bd67-2da9ad171359)
    (at 221.46 89.95 180)
    (descr "Through hole angled pin header, 2x06, 2.54mm pitch, 6mm pin length, double rows")
    (tags "Through hole angled pin header THT 2x06 2.54mm double row")
    (property "DPN" "2057-PH2RA-12-UA-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "PH2RA-12-UA")
    (property "Manufacturer" "Adam Tech")
    (property "Sheetfile" "headers.kicad_sch")
    (property "Sheetname" "PMOD Headers")
    (path "/0096dea5-c739-4b8e-aade-d8d90eceefb8/66ffe5a5-e092-4a4a-ba48-607ae062784f")
    (attr through_hole)
    (fp_text reference "J201" (at 0 -2.82) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d1869df6-6c01-4a65-94fb-cd05226d9164)
    )
    (fp_text value "Conn_02x06_Top_Bottom" (at -1.6 16) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 07aeaf02-39fd-4a58-9b64-237476e7149e)
    )
    (fp_text user "${REFERENCE}" (at -4.13 6.21 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp f827a385-f113-4f24-98ea-34fcb4ef3dbc)
    )
    (fp_line (start -5.4 -0.22) (end -11.4 -0.22) (layer "F.SilkS") (width 0.12) (tstamp 04840a94-8eb9-461b-b79c-a86f7b19be9e))
    (fp_line (start -0.357071 12.1) (end 0.097071 12.1) (layer "F.SilkS") (width 0.12) (tstamp 086aac0b-443e-4010-a248-eb352f337410))
    (fp_line (start -2.67 -1.49) (end -1.4 -1.49) (layer "F.SilkS") (width 0.12) (tstamp 0a7fb529-4b38-4084-b552-ac8d1e700852))
    (fp_line (start -5.4 -0.46) (end -11.4 -0.46) (layer "F.SilkS") (width 0.12) (tstamp 0f6192b2-20fc-4d13-8156-78ceb9e84db4))
    (fp_line (start -11.46 7.1) (end -5.46 7.1) (layer "F.SilkS") (width 0.12) (tstamp 11eba532-cadb-4d14-9bd6-05bce27feeb6))
    (fp_line (start -2.402929 4.56) (end -2.8 4.56) (layer "F.SilkS") (width 0.12) (tstamp 192f3e23-fbe7-4a24-a510-9537a1939233))
    (fp_line (start -0.357071 10.32) (end 0.097071 10.32) (layer "F.SilkS") (width 0.12) (tstamp 1e21f4a5-393a-41a8-8f0d-c072c8906587))
    (fp_line (start -2.402929 2.02) (end -2.8 2.02) (layer "F.SilkS") (width 0.12) (tstamp 2cbdc492-4f55-4c9b-8ab7-83840f5fc938))
    (fp_line (start -2.8 -1.47) (end -5.46 -1.47) (layer "F.SilkS") (width 0.12) (tstamp 2d5a68e3-504f-4327-945c-21b305b08a3b))
    (fp_line (start -11.46 2.78) (end -11.46 2.02) (layer "F.SilkS") (width 0.12) (tstamp 32169e96-a4cb-4bd7-9963-41c6c212c067))
    (fp_line (start -5.46 13.89) (end -2.8 13.89) (layer "F.SilkS") (width 0.12) (tstamp 336899e2-defb-4120-866f-4ac3e5ec37ef))
    (fp_line (start -2.402929 7.1) (end -2.8 7.1) (layer "F.SilkS") (width 0.12) (tstamp 37dc65f7-d4a7-4bfd-a8b0-b751e5134169))
    (fp_line (start -11.46 9.64) (end -5.46 9.64) (layer "F.SilkS") (width 0.12) (tstamp 38e02b5e-8dd7-4214-837c-4711ade34fa0))
    (fp_line (start -11.46 4.56) (end -5.46 4.56) (layer "F.SilkS") (width 0.12) (tstamp 39d607b8-1426-4d2d-8b29-f51d82a8b20b))
    (fp_line (start -0.357071 5.24) (end 0.097071 5.24) (layer "F.SilkS") (width 0.12) (tstamp 3c73d67a-0c83-46ba-9f62-a6aea9c670c2))
    (fp_line (start -5.46 -1.47) (end -5.46 13.89) (layer "F.SilkS") (width 0.12) (tstamp 40895581-5387-475b-af0d-93b35d6ed583))
    (fp_line (start -11.46 10.4) (end -11.46 9.64) (layer "F.SilkS") (width 0.12) (tstamp 4a436e7a-7e2f-4cf7-9f97-e56136565b4f))
    (fp_line (start -2.8 8.75) (end -5.46 8.75) (layer "F.SilkS") (width 0.12) (tstamp 4a846c83-0b15-4f29-8341-bbd12549924b))
    (fp_line (start -2.8 13.89) (end -2.8 -1.47) (layer "F.SilkS") (width 0.12) (tstamp 51319b18-6af0-4256-883c-518553fd7ee5))
    (fp_line (start -2.8 6.21) (end -5.46 6.21) (layer "F.SilkS") (width 0.12) (tstamp 5e834a0b-58ab-4721-95d7-57ec66b7c763))
    (fp_line (start -5.46 7.86) (end -11.46 7.86) (layer "F.SilkS") (width 0.12) (tstamp 63585cef-4c3b-46a7-a160-1eda67582ce5))
    (fp_line (start -2.67 -0.22) (end -2.67 -1.49) (layer "F.SilkS") (width 0.12) (tstamp 63e76893-72e8-4f3d-9b94-3219d4528397))
    (fp_line (start -2.402929 12.18) (end -2.8 12.18) (layer "F.SilkS") (width 0.12) (tstamp 6d439331-2d47-4d81-a049-3838915ed45c))
    (fp_line (start -11.46 5.32) (end -11.46 4.56) (layer "F.SilkS") (width 0.12) (tstamp 6d97b80f-c780-454d-9b83-9da5f9291276))
    (fp_line (start -11.4 -0.56) (end -5.4 -0.56) (layer "F.SilkS") (width 0.12) (tstamp 73abc558-52c5-40b1-a296-7b8cb0961be0))
    (fp_line (start -2.8 3.67) (end -5.46 3.67) (layer "F.SilkS") (width 0.12) (tstamp 744e552a-ded2-4370-8528-6ae3800fe817))
    (fp_line (start -2.402929 5.32) (end -2.8 5.32) (layer "F.SilkS") (width 0.12) (tstamp 7d2628d0-c009-4dae-96af-a98e9e0c4f64))
    (fp_line (start -0.357071 2.7) (end 0.097071 2.7) (layer "F.SilkS") (width 0.12) (tstamp 7de2256b-2481-4629-a192-0692c8435121))
    (fp_line (start -0.357071 7.78) (end 0.097071 7.78) (layer "F.SilkS") (width 0.12) (tstamp 87a7330f-cb8c-4d75-b156-722d8c4f2392))
    (fp_line (start -5.46 12.94) (end -11.46 12.94) (layer "F.SilkS") (width 0.12) (tstamp 8d3c7819-4afd-4e7e-842a-773c4b96bf5a))
    (fp_line (start -0.29 0.16) (end 0.097071 0.16) (layer "F.SilkS") (width 0.12) (tstamp 8f8980f2-a604-433b-9252-3807bbad3aba))
    (fp_line (start -2.402929 12.94) (end -2.8 12.94) (layer "F.SilkS") (width 0.12) (tstamp 956f5cec-b809-42aa-bbff-06aa3ad43f07))
    (fp_line (start -5.4 -0.1) (end -11.4 -0.1) (layer "F.SilkS") (width 0.12) (tstamp 9c3220f9-c90f-4ae5-a194-f45d853b0ec1))
    (fp_line (start -11.4 0.2) (end -11.4 -0.56) (layer "F.SilkS") (width 0.12) (tstamp 9e8001af-0043-4fd2-9bf1-a41904e1ad0a))
    (fp_line (start -2.402929 9.64) (end -2.8 9.64) (layer "F.SilkS") (width 0.12) (tstamp a225a635-86c0-422f-9faa-bd8b4c0997f9))
    (fp_line (start -2.402929 7.86) (end -2.8 7.86) (layer "F.SilkS") (width 0.12) (tstamp aad10f54-fed5-4727-978f-86566705e87b))
    (fp_line (start -11.46 2.02) (end -5.46 2.02) (layer "F.SilkS") (width 0.12) (tstamp abf69953-4a54-4fd3-bf0e-90944c8aee94))
    (fp_line (start -5.4 0.02) (end -11.4 0.02) (layer "F.SilkS") (width 0.12) (tstamp ae547b02-8498-49b7-bee7-400d621bb23e))
    (fp_line (start -0.357071 1.94) (end 0.097071 1.94) (layer "F.SilkS") (width 0.12) (tstamp af988f12-161c-4e6b-9832-6d3991f0cb78))
    (fp_line (start -5.46 2.78) (end -11.46 2.78) (layer "F.SilkS") (width 0.12) (tstamp b147f2fb-530b-4372-8352-7d0a85f0fa0c))
    (fp_line (start -0.29 -0.6) (end 0.097071 -0.6) (layer "F.SilkS") (width 0.12) (tstamp b2904855-ba1e-4948-ad5e-0e81a2a891bb))
    (fp_line (start -5.46 5.32) (end -11.46 5.32) (layer "F.SilkS") (width 0.12) (tstamp b51654fa-4abe-459a-b6f7-23009e752596))
    (fp_line (start -5.4 -0.34) (end -11.4 -0.34) (layer "F.SilkS") (width 0.12) (tstamp b94a9a58-10a8-4ffa-aaf2-8ece207256db))
    (fp_line (start -11.46 12.94) (end -11.46 12.18) (layer "F.SilkS") (width 0.12) (tstamp ba66e57f-8eda-41f5-a72c-d927ed7ba3a7))
    (fp_line (start -2.402929 10.4) (end -2.8 10.4) (layer "F.SilkS") (width 0.12) (tstamp bc6adfbc-19ee-4d94-a84a-6d8e625f9654))
    (fp_line (start -11.46 7.86) (end -11.46 7.1) (layer "F.SilkS") (width 0.12) (tstamp be03169a-ba49-47b1-832a-40a8b5a95afd))
    (fp_line (start -5.46 10.4) (end -11.46 10.4) (layer "F.SilkS") (width 0.12) (tstamp bef01af1-d34d-45cc-9108-d0d9f90a2cb0))
    (fp_line (start -0.357071 9.56) (end 0.097071 9.56) (layer "F.SilkS") (width 0.12) (tstamp c7c784d1-cba0-4cad-9b98-7f4479fa9c28))
    (fp_line (start -2.8 1.13) (end -5.46 1.13) (layer "F.SilkS") (width 0.12) (tstamp cb212d3b-b7e0-4001-b9a6-385282ea1279))
    (fp_line (start -11.46 12.18) (end -5.46 12.18) (layer "F.SilkS") (width 0.12) (tstamp cbe99a46-a2bd-4691-9ef5-054a954455fe))
    (fp_line (start -2.402929 -0.52) (end -2.8 -0.52) (layer "F.SilkS") (width 0.12) (tstamp cc9beb49-6f82-46ff-ba6d-a1eee760d064))
    (fp_line (start -0.357071 4.48) (end 0.097071 4.48) (layer "F.SilkS") (width 0.12) (tstamp d0d2c757-0aa9-4aa7-9173-53c9ca73be8f))
    (fp_line (start -2.402929 0.24) (end -2.8 0.24) (layer "F.SilkS") (width 0.12) (tstamp d35cb1cc-3fc1-477e-bbeb-ed1de3326baf))
    (fp_line (start -5.4 0.2) (end -11.4 0.2) (layer "F.SilkS") (width 0.12) (tstamp daed9317-ec1c-4d9a-b2a1-66c25433271d))
    (fp_line (start -0.357071 7.02) (end 0.097071 7.02) (layer "F.SilkS") (width 0.12) (tstamp e2ee8d4c-4c4f-4ffe-9a7e-1412b0f2da7d))
    (fp_line (start -0.357071 12.86) (end 0.097071 12.86) (layer "F.SilkS") (width 0.12) (tstamp e35f7990-2dd0-4ce5-8237-b2d23884dd00))
    (fp_line (start -5.4 0.14) (end -11.4 0.14) (layer "F.SilkS") (width 0.12) (tstamp e3f5f5a4-8fd1-40a5-96dd-1f8909be76f8))
    (fp_line (start -2.8 11.29) (end -5.46 11.29) (layer "F.SilkS") (width 0.12) (tstamp e945fe98-fd3e-4173-8350-810118305209))
    (fp_line (start -2.402929 2.78) (end -2.8 2.78) (layer "F.SilkS") (width 0.12) (tstamp eabbfe9d-ac36-461b-8634-2aafbcb05cfd))
    (fp_line (start -12.05 -2.02) (end -12.05 14.28) (layer "F.CrtYd") (width 0.05) (tstamp 47e70fb0-d579-4fdc-8de8-2a9d26826fe2))
    (fp_line (start -12.05 14.28) (end 2.85 14.28) (layer "F.CrtYd") (width 0.05) (tstamp 50104d6a-18e2-45af-a87a-e387ed063f7c))
    (fp_line (start 2.85 -2.02) (end -12.05 -2.02) (layer "F.CrtYd") (width 0.05) (tstamp 65cd2e24-f7f0-426b-9168-e8166223bec0))
    (fp_line (start 2.85 14.28) (end 2.85 -2.02) (layer "F.CrtYd") (width 0.05) (tstamp ae8cf16a-0d8d-432e-9ab9-1d79685eb163))
    (fp_line (start -1.72 12.8) (end 2.64 12.8) (layer "F.Fab") (width 0.1) (tstamp 024e7323-f1fd-4f55-b707-2704bef348c2))
    (fp_line (start -1.72 9.62) (end -1.72 10.26) (layer "F.Fab") (width 0.1) (tstamp 0f719541-f0b5-48c8-9a60-1231b052bac7))
    (fp_line (start -11.4 2.72) (end -11.4 2.08) (layer "F.Fab") (width 0.1) (tstamp 11ec931d-f749-4670-bd62-c667b64cbed8))
    (fp_line (start -1.72 4.54) (end 2.64 4.54) (layer "F.Fab") (width 0.1) (tstamp 12ac8993-95a7-4b48-9920-bb099b6a101b))
    (fp_line (start -11.4 10.34) (end -11.4 9.7) (layer "F.Fab") (width 0.1) (tstamp 32461e81-1e55-41c3-b73d-7f0d56f93e5c))
    (fp_line (start -5.4 10.34) (end -11.4 10.34) (layer "F.Fab") (width 0.1) (tstamp 3684205a-f6bc-4339-bbc5-d9c0d48df6d3))
    (fp_line (start -5.4 7.8) (end -11.4 7.8) (layer "F.Fab") (width 0.1) (tstamp 50cbbd9d-1e0e-4686-b3f0-c13fa3e31939))
    (fp_line (start -1.72 7.08) (end 2.64 7.08) (layer "F.Fab") (width 0.1) (tstamp 5572b1ee-44a0-44ce-908c-4dc22e718d4f))
    (fp_line (start -1.72 4.54) (end -1.72 5.18) (layer "F.Fab") (width 0.1) (tstamp 62fdc2f7-d9ec-4bc2-8f35-345b61f5e6fe))
    (fp_line (start -5.4 7.16) (end -11.4 7.16) (layer "F.Fab") (width 0.1) (tstamp 6a02effd-9384-4453-bc5a-c334ff6886d5))
    (fp_line (start -11.4 7.8) (end -11.4 7.16) (layer "F.Fab") (width 0.1) (tstamp 720b63b4-995e-4bc5-a409-e5ff3bdc9c62))
    (fp_line (start -1.72 2) (end 2.64 2) (layer "F.Fab") (width 0.1) (tstamp 726e90d3-1dd6-4408-a77a-a5a40cf00012))
    (fp_line (start -5.4 2.72) (end -11.4 2.72) (layer "F.Fab") (width 0.1) (tstamp 7733f4a7-7142-43e9-a402-e984d3f0cd7c))
    (fp_line (start -2.86 13.195) (end -3.495 13.83) (layer "F.Fab") (width 0.1) (tstamp 78a377c2-a85d-45f4-80e5-d0225ebb87ff))
    (fp_line (start -11.4 5.26) (end -11.4 4.62) (layer "F.Fab") (width 0.1) (tstamp 7d1043f4-9e56-47db-8889-cbdf2025def2))
    (fp_line (start -2.86 -1.41) (end -2.86 13.195) (layer "F.Fab") (width 0.1) (tstamp 7fab431a-6ffb-4c85-b124-01369fe9b22a))
    (fp_line (start -1.72 -0.54) (end -1.72 0.1) (layer "F.Fab") (width 0.1) (tstamp 81299d4d-87d7-4978-99bc-8ff27594b89a))
    (fp_line (start -1.72 7.08) (end -1.72 7.72) (layer "F.Fab") (width 0.1) (tstamp 85532d16-e735-45d9-8c88-6710a8229d17))
    (fp_line (start -5.34 -0.5) (end -11.34 -0.5) (layer "F.Fab") (width 0.1) (tstamp 85e5bbe9-2090-497d-8e1e-8484a54ed6c2))
    (fp_line (start -1.72 9.62) (end 2.64 9.62) (layer "F.Fab") (width 0.1) (tstamp 8abf456a-2bf4-4857-9430-d0e10a9b18d1))
    (fp_line (start -5.4 13.83) (end -5.4 -1.41) (layer "F.Fab") (width 0.1) (tstamp a02ceedc-fd8f-4c41-b078-7170c529c313))
    (fp_line (start -5.4 12.24) (end -11.4 12.24) (layer "F.Fab") (width 0.1) (tstamp a162ada6-9785-4cfb-b59e-f65dacd2ae42))
    (fp_line (start -1.72 12.16) (end -1.72 12.8) (layer "F.Fab") (width 0.1) (tstamp b349d1d2-6496-4253-8ac4-792316b956ea))
    (fp_line (start -3.495 13.83) (end -5.4 13.83) (layer "F.Fab") (width 0.1) (tstamp b4f82a02-2d0c-45f9-b090-4cdaf2ccf9e7))
    (fp_line (start -5.4 9.7) (end -11.4 9.7) (layer "F.Fab") (width 0.1) (tstamp b74e439a-e3eb-49d3-870c-d1796899b433))
    (fp_line (start -11.34 0.14) (end -11.34 -0.5) (layer "F.Fab") (width 0.1) (tstamp b7a89094-bb62-454b-9ff9-171d0dffe699))
    (fp_line (start -1.72 10.26) (end 2.64 10.26) (layer "F.Fab") (width 0.1) (tstamp b9b28702-71dc-434d-9bc9-13497737f9e3))
    (fp_line (start -1.72 12.16) (end 2.64 12.16) (layer "F.Fab") (width 0.1) (tstamp c1f431d5-8ebb-45a7-827c-f551543a3ef9))
    (fp_line (start -11.4 12.88) (end -11.4 12.24) (layer "F.Fab") (width 0.1) (tstamp c29e99fe-0c87-4cc8-8888-8a6cf940be15))
    (fp_line (start -1.72 -0.54) (end 2.64 -0.54) (layer "F.Fab") (width 0.1) (tstamp c6ea63b7-0ccf-4760-8ffa-5b3443c6e2a2))
    (fp_line (start -1.72 5.18) (end 2.64 5.18) (layer "F.Fab") (width 0.1) (tstamp c84d6b45-47fb-47c9-8c79-267c05b5acc4))
    (fp_line (start -1.72 0.1) (end 2.64 0.1) (layer "F.Fab") (width 0.1) (tstamp ca8b8ca1-75cb-43fe-8f4a-012f534b8bc2))
    (fp_line (start -5.4 12.88) (end -11.4 12.88) (layer "F.Fab") (width 0.1) (tstamp d6faccdb-2e5d-46b9-93c6-5a0ff8aae097))
    (fp_line (start -5.4 4.62) (end -11.4 4.62) (layer "F.Fab") (width 0.1) (tstamp e12effdf-e739-44a0-a2d4-5c7e4c89358a))
    (fp_line (start -5.4 5.26) (end -11.4 5.26) (layer "F.Fab") (width 0.1) (tstamp e6e3c203-c1e4-4e76-8fc5-fa2f4b442054))
    (fp_line (start -5.4 -1.41) (end -2.86 -1.41) (layer "F.Fab") (width 0.1) (tstamp e86b6f0a-8599-44f2-9a72-83b5cbfef980))
    (fp_line (start -1.72 7.72) (end 2.64 7.72) (layer "F.Fab") (width 0.1) (tstamp e9e39b2f-5482-46d9-8d51-0f6554dce9bc))
    (fp_line (start -5.4 2.08) (end -11.4 2.08) (layer "F.Fab") (width 0.1) (tstamp ec83956c-1a7a-4984-be95-47076cba51b7))
    (fp_line (start -5.34 0.14) (end -11.34 0.14) (layer "F.Fab") (width 0.1) (tstamp f4e7b725-59d5-4069-8924-66a9c029ba45))
    (fp_line (start -1.72 2.64) (end 2.64 2.64) (layer "F.Fab") (width 0.1) (tstamp f5b58469-b6e4-462f-bd73-e9381ad58d6a))
    (fp_line (start -1.72 2) (end -1.72 2.64) (layer "F.Fab") (width 0.1) (tstamp f87e1f19-a65b-40a5-b79b-70343a171366))
    (pad "1" thru_hole oval (at 1.14 -0.22 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 "/REFCLK") (pinfunction "Pin_1") (pintype "passive") (tstamp dcecc0c0-83f3-40cb-bd6f-78e7492a41a4))
    (pad "2" thru_hole oval (at 1.14 2.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 "/LVDS_~{PWR}") (pinfunction "Pin_2") (pintype "passive") (tstamp 6b278322-5c0a-445f-995a-312e695e5d8b))
    (pad "3" thru_hole oval (at 1.14 4.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 "/LVDS_DEN") (pinfunction "Pin_3") (pintype "passive") (tstamp 250bf7c7-00dd-4939-b208-dd8edb789c40))
    (pad "4" thru_hole oval (at 1.14 7.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 "/LVDS_SYNC") (pinfunction "Pin_4") (pintype "passive") (tstamp 3eb61b6c-8594-4999-9018-83c5db188e34))
    (pad "5" thru_hole oval (at 1.14 9.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_5") (pintype "passive") (tstamp a5134fc7-4141-4865-a507-0f4e2ec9c8b5))
    (pad "6" thru_hole oval (at 1.14 12.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 "/PMOD_3V3") (pinfunction "Pin_6") (pintype "passive") (tstamp 08e273be-35ff-4b7b-9be8-55d20e049d6f))
    (pad "7" thru_hole rect (at -1.4 -0.22 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 "/ADC_~{EN}") (pinfunction "Pin_7") (pintype "passive") (tstamp 002381e9-811e-4b32-a559-cf8dfd99a1bf))
    (pad "8" thru_hole oval (at -1.4 2.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 "/GPIO1") (pinfunction "Pin_8") (pintype "passive") (tstamp d2481b5b-b32a-4639-81c4-f7e33d2788a1))
    (pad "9" thru_hole oval (at -1.4 4.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 "/GPIO2") (pinfunction "Pin_9") (pintype "passive") (tstamp ed6ea0a7-3178-4f63-bfb2-150c5fec2b21))
    (pad "10" thru_hole oval (at -1.4 7.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 "/GPIO3") (pinfunction "Pin_10") (pintype "passive") (tstamp f55a83be-c165-483e-89b7-2f4435c58e8a))
    (pad "11" thru_hole oval (at -1.4 9.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_11") (pintype "passive") (tstamp b032b6d1-1c42-4e37-b13a-dd3c869833f4))
    (pad "12" thru_hole oval (at -1.4 12.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 "/PMOD_3V3") (pinfunction "Pin_12") (pintype "passive") (tstamp c661c756-437f-4efb-9f4e-1d8ba5e3fbe9))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x06_P2.54mm_Horizontal.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp a76300ae-567b-4e2b-a529-75fccb3da631)
    (at 192.2 71.9 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/13f9d3ac-827f-402e-b049-3746c48e5124")
    (attr smd)
    (fp_text reference "C609" (at -40.4 0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a74fd828-47fb-4d79-b9e6-e8e10195792d)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8ffb0de8-f44d-4ce2-82df-8530a9f094c8)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 1b295670-b44a-4c62-b847-7b7b3d9b093a)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 8158aea4-e617-48f3-8f7f-d67381d8577c))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp ae69703a-abb8-40ac-99e6-46f913954116))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 49ba97bc-f836-481e-a982-06d55b88d061))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 53977758-ffa4-4c73-9741-aafd702df62b))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b7a01ddd-7861-4b6a-ac20-6d199e0e75d0))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c5e84191-b451-4de2-a18b-1d40ba8073a0))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0a309957-772e-4590-be34-d9ded5a9fdf6))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 15f52d8b-9959-454b-abd2-602b943bc1cc))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9b7f94dd-5815-44ef-9ea7-9f771a685efb))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp cd374af3-9166-4387-9174-86126ed36db7))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 9c1f1a07-28c9-45b9-ad1a-d02cf1671faf))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 8a106b7c-fb2e-4f37-bfd4-4a91940a1e3b))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp a8d001e4-a5c0-4158-8b41-ce3730ac8fa6)
    (at 191.8 57.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/28e1bdc8-d711-48ba-9299-b83344471ae8")
    (attr smd)
    (fp_text reference "C619" (at 4.7 -0.5 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 14af9bbf-41cc-46be-85d7-3b91a75e7afc)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 26501c57-ff29-454f-947e-abde42451b1f)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 5ee76f8d-785b-4ad7-89ea-40d59080f5ae)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp b82ac42c-28c1-424a-a0af-622b624adc9e))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp fd75c7e5-75ef-4702-b648-445d38dc4845))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 14f61db8-e0ec-4a15-9836-1bbc99095814))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 237821bb-2bef-49a4-b8cf-883dff15b485))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7209e685-3574-4f57-bd6a-3d86f4675eb1))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp efbf62bd-8af6-4ffe-807e-81ab8b80c5cb))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6f3bb824-dd1d-4fcb-b60e-6df2f556bec2))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 86b65261-4fb8-43ad-b3f7-5e14c3059058))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 8901f579-3b10-435b-98f0-af46626684db))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a7727dfa-c63e-4241-aae0-4632371a5b5f))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp cb826bbc-b992-4e9b-bbd7-fb7e105385fd))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp b7f879f7-620a-493f-9601-a9f1b6d6cfdd))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:TSSOP-28_4.4x9.7mm_P0.65mm" (layer "F.Cu")
    (tedit 5E476F32) (tstamp ac947f2f-edcb-4068-bc52-23b6709daccd)
    (at 179.8625 43.9 180)
    (descr "TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (property "DPN" "AD9203ARUZRL7CT-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "AD9203")
    (property "Manufacturer" "Analog Devices")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/957aae89-eaad-4355-91ec-b14040eabe5f")
    (attr smd)
    (fp_text reference "U301" (at 4.7 -2.6 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp da159a8b-93b4-40be-add7-bf23215b130f)
    )
    (fp_text value "AD9203" (at 0 5.8) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp e8083b01-62a7-475c-bdab-dff26fc4f59d)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4ae30d16-9470-4eb9-a0d5-5e66263e6dc1)
    )
    (fp_line (start 2.31 -4.96) (end 2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 066ab8b4-f595-45db-8c5a-2b1979b576de))
    (fp_line (start 0 -4.96) (end 2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp 0a42444f-625d-4638-9a42-4cc4c842e544))
    (fp_line (start 0 4.96) (end -2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 11d0431c-dbee-488e-9499-4cfd394f2a36))
    (fp_line (start 2.31 4.96) (end 2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp 530032dd-7646-47ed-ab0b-857d3bf7a5d9))
    (fp_line (start 0 4.96) (end 2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 59f8c19f-42a3-4bc9-9950-3e83ef8a232d))
    (fp_line (start -2.31 -4.96) (end -2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp b671ba9c-c07c-4dac-afad-7393104b74c6))
    (fp_line (start -2.31 -4.685) (end -3.6 -4.685) (layer "F.SilkS") (width 0.12) (tstamp b7564c82-27a4-4c72-a48e-56620db5ea1e))
    (fp_line (start -2.31 4.96) (end -2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp d7ba2dda-99fa-48c5-8b56-7abaeecfcc68))
    (fp_line (start 0 -4.96) (end -2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp fed31272-1ac9-400d-b2bf-8d393e86b6a3))
    (fp_line (start -3.85 -5.1) (end -3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp 0d177eea-7043-4eff-9ffe-ce657e4b2414))
    (fp_line (start 3.85 -5.1) (end -3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp 7a40eb62-b111-4ee7-9d04-09efcf174c3a))
    (fp_line (start 3.85 5.1) (end 3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp b5fb6bd3-5d52-4c41-bcdd-ceedc5c091ee))
    (fp_line (start -3.85 5.1) (end 3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp d217e4df-3f26-402f-a1d5-917f2afd3fb3))
    (fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp 1369a3c7-4c10-4585-8cfd-f64473dbbff3))
    (fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer "F.Fab") (width 0.1) (tstamp 1674dd2e-77a4-4bcf-86f1-1f89e5d2c206))
    (fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp 25d47bc6-9698-4f84-8d68-f5ddd725e36f))
    (fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp 542b94c6-a5b3-43ad-af74-c8c0df7817bf))
    (fp_line (start 2.2 4.85) (end -2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp e9e9a177-5ccb-4732-8ba1-05a161bfcbb1))
    (pad "1" smd roundrect (at -2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "DRVSS") (pintype "power_in") (tstamp 74ab8ecd-0d8a-4aea-8764-d7cfb55906a2))
    (pad "2" smd roundrect (at -2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 35 "/samplers/ADC 1/+3V3_A") (pinfunction "DRVDD") (pintype "power_in") (tstamp 9a16db65-003a-4cec-81f2-3e3331a8e194))
    (pad "3" smd roundrect (at -2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 54 "/samplers/ADC 1/D0") (pinfunction "D0") (pintype "output") (tstamp c4a646f1-37ef-439e-8727-f75a1774c53f))
    (pad "4" smd roundrect (at -2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 55 "/samplers/ADC 1/D1") (pinfunction "D1") (pintype "output") (tstamp d1869c85-972c-4ae3-8ce1-957b77e8e521))
    (pad "5" smd roundrect (at -2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 56 "/samplers/ADC 1/D2") (pinfunction "D2") (pintype "output") (tstamp b56a5030-30f2-46c2-9f9f-b01fc22fc17f))
    (pad "6" smd roundrect (at -2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 57 "/samplers/ADC 1/D3") (pinfunction "D3") (pintype "output") (tstamp df3e910d-18d2-4f06-8c7a-4936e62a72c7))
    (pad "7" smd roundrect (at -2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 58 "/samplers/ADC 1/D4") (pinfunction "D4") (pintype "output") (tstamp 869bdfa1-3008-467a-908a-cd1438b4e3e5))
    (pad "8" smd roundrect (at -2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 59 "/samplers/ADC 1/D5") (pinfunction "D5") (pintype "output") (tstamp 156eb7b4-535a-4288-997d-ae03b55b47f6))
    (pad "9" smd roundrect (at -2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 60 "/samplers/ADC 1/D6") (pinfunction "D6") (pintype "output") (tstamp ad3afcd8-a4ba-4de2-bfaa-3d5d60ff42b8))
    (pad "10" smd roundrect (at -2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 61 "/samplers/ADC 1/D7") (pinfunction "D7") (pintype "output") (tstamp 6c24510a-1dce-4381-b3f5-f5a7d6dbea57))
    (pad "11" smd roundrect (at -2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 62 "/samplers/ADC 1/D8") (pinfunction "D8") (pintype "output") (tstamp 7811a00d-ebdb-42c5-9956-be3c83336b16))
    (pad "12" smd roundrect (at -2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 63 "/samplers/ADC 1/D9") (pinfunction "D9") (pintype "output") (tstamp 394ba59c-d89e-45d4-92af-de9fe8849711))
    (pad "13" smd roundrect (at -2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 64 "/samplers/ADC 1/OUT_OF_RANGE") (pinfunction "OTR") (pintype "output") (tstamp d269e4e7-b9ba-4081-bf25-d4284126e671))
    (pad "14" smd roundrect (at -2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DFS") (pintype "input") (tstamp e8af8e42-cb4d-49c5-9e54-26e5a9cc8979))
    (pad "15" smd roundrect (at 2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "/REFCLK") (pinfunction "CLK") (pintype "input") (tstamp 6c7daec0-c0e6-42e8-bbe8-298c70ef9e0b))
    (pad "16" smd roundrect (at 2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "3-STATE") (pintype "input") (tstamp d47a945e-be26-466e-8979-5a443a49b867))
    (pad "17" smd roundrect (at 2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "/ADC_~{EN}") (pinfunction "STBY") (pintype "input") (tstamp 856b45c3-130e-4f15-a0fb-db27e452450b))
    (pad "18" smd roundrect (at 2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "REFSENSE") (pintype "input") (tstamp f5bf5f97-2081-4550-aaa4-fbd2c18df4e5))
    (pad "19" smd roundrect (at 2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "CLAMP") (pintype "input") (tstamp 405a6760-c8a8-4e76-a2e2-69bfd540fd78))
    (pad "20" smd roundrect (at 2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 65 "unconnected-(U301-Pad20)") (pinfunction "CLAMPIN") (pintype "input+no_connect") (tstamp 301f4dfd-301e-482b-876c-d0e20d6ebd67))
    (pad "21" smd roundrect (at 2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 52 "Net-(R301-Pad1)") (pinfunction "PWRCON") (pintype "input") (tstamp 20e7f012-b123-4010-88ec-7e534e599614))
    (pad "22" smd roundrect (at 2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 31 "/samplers/ADC 1/REFTOP") (pinfunction "REFTF") (pintype "passive") (tstamp 851f85f1-eb88-4eca-949c-9d15cc7d6f45))
    (pad "23" smd roundrect (at 2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 33 "/samplers/ADC 1/VREF") (pinfunction "VREF") (pintype "input") (tstamp 923b2bf7-425b-4025-b4bf-8826b0ed3fa2))
    (pad "24" smd roundrect (at 2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 30 "/samplers/ADC 1/REFBTM") (pinfunction "REFBF") (pintype "passive") (tstamp 88b84261-68fd-433e-a268-92ce42a1ef4c))
    (pad "25" smd roundrect (at 2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "/CHANNEL_1") (pinfunction "AINP") (pintype "input") (tstamp 584afd34-3064-4034-b16d-a1dc8814544c))
    (pad "26" smd roundrect (at 2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 33 "/samplers/ADC 1/VREF") (pinfunction "AINN") (pintype "input") (tstamp 3a4a55e5-89d2-4797-b0b9-dd0906dbcd52))
    (pad "27" smd roundrect (at 2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "AVSS") (pintype "power_in") (tstamp a9cf188c-d25d-4506-8673-3d5ef8d0bcb9))
    (pad "28" smd roundrect (at 2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "AVDD") (pintype "power_in") (tstamp 8c54f9cd-da0c-49ae-8950-50ac6fe88e07))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp ae10a63f-720c-48a5-b917-c1e5101dbd40)
    (at 192.4625 51.2 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/13f9d3ac-827f-402e-b049-3746c48e5124")
    (attr smd)
    (fp_text reference "C409" (at -40.4 0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a88ea8aa-0bdb-4e77-bf60-ae5d1a21b0c4)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c45ba1e9-70d7-46e6-b182-9fcf376b5e1f)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp e84e7481-02d2-461d-b9c9-0b426fef0eeb)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 34c73c57-c5de-431f-8d35-879c9fdcc040))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp b4122cdf-b6e6-4b23-9b9e-2420465216bc))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 029b86f9-d310-486b-86de-8e7419bb8cda))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 28e825f9-c189-4667-9045-a6e4124ca6a3))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 47ad9988-63a5-4ca8-b499-94ecb304e04e))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 99593b58-a07a-4ab8-ae71-d4c70e880403))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0c24d8c0-3f66-4e66-82e6-57272238b08e))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 340b1f11-58f9-40d3-ae8c-88ba455daad0))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4a62f350-7f17-45b1-a3a8-e3fe8bbe951c))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp e7dbb8cf-65a0-43f7-9699-b276ef474fd4))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp bcb2545f-82e8-4ac3-bc5e-5d2c1b7d020a))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp d03ffaae-157a-43a5-bfe0-39172dcb9c02))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp af251cb9-27f5-4b3d-9f69-5261f0c06b24)
    (at 198.8 91.9 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/a41a4a91-9b32-4e57-84de-62d74310a1e3")
    (attr smd)
    (fp_text reference "C813" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3317dc89-78c1-44d8-b4ea-36a348357667)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 22e9426e-b8a5-44c5-acc6-8ece663703f2)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 9127a200-20d7-4c91-bb24-838673e66a62)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 8231f5ff-3d94-48f0-a768-fde4600849c6))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp e71f3b43-e5ca-43bd-905e-c1e5203d6080))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 11921e71-e8ee-4bfd-9ae2-3178e7abd954))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3b2ff265-2036-4d02-84f9-7023c613e69d))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 44f94a38-0a8e-4e27-98cf-749d608b2e5e))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5aa4a73a-bda6-4d8c-bebe-98dbf5314b66))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 8462b322-80a6-403d-ae77-fc70eadb1b30))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 95d4a64e-7120-47cc-bfa4-e035190e36ca))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp a1631dae-65cd-4d5f-ade4-9c22bf4951df))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp d4b9c26e-9c1e-422f-93cc-14dee1860381))
    (pad "1" smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 56b0c75e-c0d8-42c4-893c-c8d8a04e8c2c))
    (pad "2" smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 73d606ec-b0b3-4dfc-a425-9ec16a5cb264))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp b014db26-d2b6-4e36-bd1b-2f6f2e3a6e57)
    (at 172.2 106.9)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/d21d427f-890e-427f-b79e-77f66923f259")
    (attr smd)
    (fp_text reference "C1306" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp deea1495-023e-4e28-b303-d5fdf481d7e5)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 2cd2af0a-8738-409d-957e-9bffa9dd754e)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp c751e8d9-8e2b-4f8a-b406-273a4f307102)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 00084d95-986d-4f12-a0dc-5f16a8901044))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 895209af-1dba-4aa0-a18c-6a1c6fa29d5f))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 99f93663-7a52-4d6c-bb27-ff173e873dc6))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a4338492-e888-4469-a218-53a3597868ae))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b3c3b6d4-c39b-4926-a823-0a458c4c86b4))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e8d88feb-459e-4fd1-8287-4fd5794084d0))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 6a03c54b-5fed-4af7-9e0f-d24ba4e5db4c))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 876d1b3a-0380-4dc7-b9d8-55ec95c69c9a))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp c286cd8f-b9b6-4c08-9250-da853b10cbfb))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp f5522f54-d2bf-410b-a368-f701c4b8fb77))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 01dd1393-4490-4fd7-b145-48be3f964e01))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 47 "/samplers/ADC 4/REFBTM") (pintype "passive") (tstamp 967dfeed-7264-4876-9b99-2220fb241be4))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp b44cb1e8-02d2-49e8-88d6-bbc50d047140)
    (at 174.3 81.8 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/4c3e582c-dee4-4ebb-a1e9-7c647c777882")
    (attr smd)
    (fp_text reference "C705" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4b135a6b-0871-483c-8f06-78469aa7999f)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ac515ccf-b6cd-46a8-96f1-c62c53d3c054)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp ebb97f80-cde1-4cac-8e2f-d29749fe8614)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 1e0eb944-6a17-4635-8b32-1ca4226d054d))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp a8e8eb86-cdc2-4fb8-9a28-446e784d78af))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 150d42e9-3e84-4fbd-b86b-09116ae8cc7a))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 24de78a6-f8d1-419c-a754-447ef46f8926))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp a89b5e2c-db24-4672-9f21-14dd3a524eff))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp e54286ed-3f4c-4079-b8de-ac5ee9d73b75))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 682769cb-741b-457d-a127-f830527f1c9f))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 7a2552b9-728f-4f30-990b-b8ea91ac9e0d))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 7fb3dcce-e206-430c-8e1a-d9a4bb729336))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f3024c2a-969c-4e3c-8c64-ac203319df41))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 3f50a617-0f69-4c44-8a9d-6272b119501c))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 43 "/samplers/ADC 3/REFTOP") (pintype "passive") (tstamp ec0a32eb-ce3f-445f-b2aa-4e87d6b0a2b2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp b4db2d69-618e-4fce-920b-c4158a922b0e)
    (at 186.8 58)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/c0df7e68-f1ba-4776-90af-9f67007d48a5")
    (attr smd)
    (fp_text reference "FB601" (at -1 -1.6) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0934c49a-4d8a-4139-a5ab-328fc0909820)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 131bbb5f-ade4-41b7-9919-07f399d3d7eb)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp b64e05f2-cbe3-4dca-8f17-125ea3f2cccf)
    )
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 6040b949-f6d4-4d3d-a3e9-2a8b3bad732b))
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp 8d3aeef2-30c8-488e-89c8-1096bd807d95))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5f29309a-71fd-4927-bd6d-ca4ac8e5fd21))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 73f67b71-a6eb-4700-b7c3-ff119f44d61f))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 74651829-0a4b-4f48-8c6d-f9bdb3039f00))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp cc6b5146-3fb5-4007-8ad4-a292abcf7aa5))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 19ec6e46-7aea-4232-8c10-a7df3ece2f60))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 798748e3-b6d9-4cca-84a8-cc1fbc49b672))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp ca2956f7-ad00-4a6d-a5f9-b626a70a59f6))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp fa375d65-6ed3-4a9f-8390-4e2c1ea156e5))
    (pad "1" smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 2ee86cd1-6e7b-4013-b144-41f20e45904c))
    (pad "2" smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp 20e84b1a-e75c-4239-ad69-6d7bf462779e))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp b5e0c03b-e0f5-4149-922e-55661775d9af)
    (at 195.9 98.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/940fe02b-e726-41d7-806f-7da0064a837b")
    (attr smd)
    (fp_text reference "C1404" (at 4.7 -0.6 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp f7a01ca3-2b43-44c5-8b87-c7e5ec098d0c)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp eb9a8671-fdaa-48ed-b4cb-1907b9a2d1b2)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 3d0efcaf-5d68-4a41-942d-dfd8d14d487f)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 6bb42a40-3458-4dd3-9f6e-9b2ec87e1287))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp c466de25-2898-43eb-af33-e44ea13e7b83))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 73ff6b87-b12b-4e86-bad4-bd122387e21e))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 90319c7c-b1c8-48d2-b793-82f7c9f59c43))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b0a8c257-a140-4906-9f68-8d1d6c01e5bc))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e6708f5e-65ed-41f3-8a38-d9106e4d5371))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 0fb9ad12-1eff-451c-b883-ba4acd650f7e))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 78896299-c2b7-42ce-9872-95ef053a8f6a))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 9c12eee7-ccd6-4d0f-b57b-36c1f6b16857))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp f5471b69-c8a9-41f4-a696-2b60c231935e))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp edf49206-d221-479e-ab03-c37c0cbc74d6))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp b37469cf-b360-433e-a4ac-198de3b1942e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp b7e4347e-8f49-42d7-ac7e-7efd07548944)
    (at 201 109.5 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/10b59b44-25f0-4aaf-a2da-c29e1b1eb698")
    (attr smd)
    (fp_text reference "C1414" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7574c2ac-d47b-4cbc-be72-5d3d6e6963c5)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp cb4fb9f1-91c0-44f8-a950-2f2ca8947896)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 81bb90af-f9d8-4b0c-866e-41217c9f31cd)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 07f3399c-e0d8-46e0-a89a-d564c603ed3d))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp c7a46dd1-f8ec-4c4b-a0c2-dd75a8d9f273))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 58497296-e588-4636-9078-94c876b8883e))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 869fd3b6-563d-4766-b54a-c13be723e670))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c08444de-4082-474e-8fa5-e0a347c88768))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp d43799ed-7dde-4ca0-a885-679ea353e38a))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 04b5426d-57f3-421e-b878-8c01695d401f))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 5a26eea4-248a-4b0f-b802-4d2d46c7b9a3))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp b12d69f2-672f-41fa-b056-1b0ab597d83a))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp bbef5927-c9f7-43de-8eb1-87c16fa1288e))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 0e32d6c9-6e63-45e2-8bd3-eb47b8430e62))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 4e17bfa4-5ce0-40fa-85d4-36547a455109))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp b874b2c4-1914-4fce-bf08-cba296b0c9a3)
    (at 195 78 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/5343f4f0-e100-4eba-b86a-1121786f9ca6")
    (attr smd)
    (fp_text reference "C815" (at 4.7 -0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 78ebc226-7713-4372-832f-fe6ab8713297)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9cda2acf-9f4e-469e-84d3-bd133a8d33d4)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 7ffd42c2-219c-4b60-9cbd-c95747890d68)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp ae5345f9-da1b-4974-bb09-682ac0b0582b))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp f03f4de6-fe42-4155-aa8f-49a2f46149e6))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 0652a58d-cae7-4e08-904c-db4b159abba8))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 275c8978-c69b-4667-9a6e-75eb9909ccc6))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2cacd151-42d3-454b-af9d-0f1030d91c4b))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp de8296d6-0161-4b03-81d6-4e82d88e3015))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp ad406080-3914-4523-95ab-ae1877a335d5))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp cc5b3c7e-ab48-463f-a5c9-1de462e03c30))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp d89c344b-29c7-4ed9-9bff-468c2b52befa))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp d8dfeabf-f9ef-4847-8577-772311af06b1))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp be55e00a-d989-452b-b8af-cce2988307e9))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp ac43c1ef-fd40-4e58-8949-4b6cd925a6ba))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp be6128f1-0c01-49d2-a14d-b3ab17768790)
    (at 190.9 98.2 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/71d155fd-ad28-40c9-908e-51e07e9fd843")
    (attr smd)
    (fp_text reference "C1418" (at -4.9 0.2 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a4323248-4265-49fc-a873-9a7e5823c1c5)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d4ebad9a-1a6f-4b77-8be2-569f4ad7319c)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 65c5a8a9-6b0f-4b4d-88e8-8484c7e415db)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 883b99be-7fee-46d3-989c-83bac7e6c9f6))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp d0c3cae6-0018-439d-859a-284fe780e7f9))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2eae51fe-1969-4fd9-9c76-5fcf6b85f16d))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 83d602f3-85f3-4256-b9e4-5ef6d6abb16f))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp cf580749-3821-45de-80c3-7e2fbdcca31a))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f2b7e328-7153-46c9-872d-e4d02129a40e))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 188812cd-1978-4f40-94ca-3882f6b3d826))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 2dc1e388-e6d0-4316-89fc-9d51ae76fc2c))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 2fce36a2-9d2a-419d-88f5-a9bc5b2bb644))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 5bab4a11-a466-4fe0-8507-062a645a7bcb))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 4ce7ca1f-7055-42f3-9f61-4bf1ebf43638))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 1209d3f7-a0da-4f12-a634-123b814afc3e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp c0cc6393-281e-49f3-8ca0-67e333996582)
    (at 197.1625 36.5 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/527e65c7-d8ea-4621-b262-27c54a4daaf9")
    (attr smd)
    (fp_text reference "C405" (at 2.4 0.2 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 210c32ad-4a16-4b01-a58c-078119f7a2b8)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7ac033d3-4335-49d6-823d-304f49d5694a)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp b6d0744d-aca8-4682-a486-564c0df4c357)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 42a42c28-1a06-4c5b-9318-46f3698dfd18))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 440da4d3-9838-46a3-b8e1-0687e4c28354))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1d047e0d-96d4-42f9-bc82-d1441c464d01))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1e8e49b3-eaee-4767-92cb-44fbc3d54dcf))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7131bcea-5150-424b-b913-ae71ea5f75fd))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ee787aa1-495a-4aec-b849-0fe96cab1e97))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 23a4eba3-1c84-412a-afff-176125c6b723))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 38a2e706-1642-4f66-8ad5-6a2d7ffc26e2))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 3ed9a85e-5287-4dad-be89-be2a2c3ee77e))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp d3342271-a3fc-43e8-8beb-bef8eefc7aa5))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp d675bd91-4ecd-44d6-abe4-f3dabb4a8225))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9a9a004f-d00e-4815-8fd6-1b7b9402d71b))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:SSOP-28_5.3x10.2mm_P0.65mm" (layer "F.Cu")
    (tedit 5A02F25C) (tstamp c1c06112-41e9-45ea-ad75-3eac9c3d8521)
    (at 193.1625 43.9)
    (descr "28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (property "DPN" "296-21243-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "SN65LV1023A")
    (property "Manufacturer" "Texas Instruments")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/2ad0fe99-7922-4fbc-bd4d-010a935ab389")
    (attr smd)
    (fp_text reference "U401" (at 5.5 -3 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 05ed7a97-241c-4405-a17b-06607c442625)
    )
    (fp_text value "SN65LV1023A-EP" (at 0 6.25) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 510a9a8a-2fc0-4132-9d00-c35877ec1c7a)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.8 0.8) (thickness 0.15)))
      (tstamp b876a36e-9141-4025-bdcd-24a44d6c8e2f)
    )
    (fp_line (start -2.875 -5.325) (end -2.875 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 1d061c38-d8a6-4820-bb29-0183300ffd1d))
    (fp_line (start 2.875 5.325) (end 2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp 71613620-7184-4d06-91dd-9a8885cd7b12))
    (fp_line (start -2.875 -4.75) (end -4.475 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 7c6c2412-022b-4cc8-98d8-d470926a2c8d))
    (fp_line (start -2.875 -5.325) (end 2.875 -5.325) (layer "F.SilkS") (width 0.15) (tstamp a1188feb-db1e-4ea1-a1df-57cdb3913a5c))
    (fp_line (start -2.875 5.325) (end 2.875 5.325) (layer "F.SilkS") (width 0.15) (tstamp e5fb4944-7565-4e92-9fd6-2b7749e1f49a))
    (fp_line (start -2.875 5.325) (end -2.875 4.675) (layer "F.SilkS") (width 0.15) (tstamp f6ad7a40-9e9d-427b-ba0d-d7870c07d882))
    (fp_line (start 2.875 -5.325) (end 2.875 -4.675) (layer "F.SilkS") (width 0.15) (tstamp fc47d182-27ff-4523-a8fe-6cdc6fdeae19))
    (fp_line (start -4.75 5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 27beb83d-baeb-4b77-98fe-355ca670a232))
    (fp_line (start -4.75 -5.5) (end -4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp 709e8087-c560-44f4-87a0-8b3d4871fbe1))
    (fp_line (start -4.75 -5.5) (end 4.75 -5.5) (layer "F.CrtYd") (width 0.05) (tstamp 790ede9b-89f4-4c13-9bb8-401d354bc754))
    (fp_line (start 4.75 -5.5) (end 4.75 5.5) (layer "F.CrtYd") (width 0.05) (tstamp fbabb077-294e-44be-bd78-d2b5c0113f90))
    (fp_line (start 2.65 5.1) (end -2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp 06626444-ec18-4517-b5b6-4931c6fca167))
    (fp_line (start -2.65 5.1) (end -2.65 -4.1) (layer "F.Fab") (width 0.15) (tstamp 244a130a-a823-4315-a93f-5434a75205b4))
    (fp_line (start 2.65 -5.1) (end 2.65 5.1) (layer "F.Fab") (width 0.15) (tstamp 2e3f10b1-6539-46bd-ab7a-25803b590f54))
    (fp_line (start -1.65 -5.1) (end 2.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp 90070b91-42b6-4d7e-b175-541af2e8c067))
    (fp_line (start -2.65 -4.1) (end -1.65 -5.1) (layer "F.Fab") (width 0.15) (tstamp c56e7dd4-4d42-4651-96d4-3dee2dd5127a))
    (pad "1" smd rect (at -3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC1") (pintype "input") (tstamp d35e1805-61dc-4c3b-8860-9c5211342712))
    (pad "2" smd rect (at -3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/LVDS_SYNC") (pinfunction "SYNC2") (pintype "input") (tstamp 4c9fd963-6295-4eb1-94d9-2bcf8f25ea27))
    (pad "3" smd rect (at -3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 63 "/samplers/ADC 1/D9") (pinfunction "DIN0") (pintype "input") (tstamp 816504b8-35bf-4401-9a85-910f4352d805))
    (pad "4" smd rect (at -3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 62 "/samplers/ADC 1/D8") (pinfunction "DIN1") (pintype "input") (tstamp 97b088ae-4a3d-4c9a-82ed-545987e55f1d))
    (pad "5" smd rect (at -3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 61 "/samplers/ADC 1/D7") (pinfunction "DIN2") (pintype "input") (tstamp f59b94f6-98d6-4ec0-947f-83f1446d1c7c))
    (pad "6" smd rect (at -3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 60 "/samplers/ADC 1/D6") (pinfunction "DIN3") (pintype "input") (tstamp 1b25b028-fa5a-480d-97cf-57c31a6512f9))
    (pad "7" smd rect (at -3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 59 "/samplers/ADC 1/D5") (pinfunction "DIN4") (pintype "input") (tstamp 2f3cb119-0200-4588-85d6-5fd0425161c8))
    (pad "8" smd rect (at -3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 58 "/samplers/ADC 1/D4") (pinfunction "DIN5") (pintype "input") (tstamp 71c28bf8-0634-466f-b09f-221ed539aa1e))
    (pad "9" smd rect (at -3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "/samplers/ADC 1/D3") (pinfunction "DIN6") (pintype "input") (tstamp a8b10d02-4f51-4b1d-876a-df131873bae1))
    (pad "10" smd rect (at -3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 56 "/samplers/ADC 1/D2") (pinfunction "DIN7") (pintype "input") (tstamp ba9288de-4c4c-4342-8340-ff6f701850fa))
    (pad "11" smd rect (at -3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "/samplers/ADC 1/D1") (pinfunction "DIN8") (pintype "input") (tstamp 49e96f05-b026-4f6b-b82d-153c4871691a))
    (pad "12" smd rect (at -3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 54 "/samplers/ADC 1/D0") (pinfunction "DIN9") (pintype "input") (tstamp 7b10603b-a14d-461c-9bda-4a4fa10ec1b4))
    (pad "13" smd rect (at -3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "TCLK_R/~{F}") (pintype "input") (tstamp 3c76d843-372e-4e8e-a61b-036fc2bb2c2b))
    (pad "14" smd rect (at -3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "/REFCLK") (pinfunction "TCLK") (pintype "input") (tstamp e7e63238-779f-41b7-b3d3-8126dbc47164))
    (pad "15" smd rect (at 3.6 4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp b3792f68-2e69-4d17-a3af-419ac844194d))
    (pad "16" smd rect (at 3.6 3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "DGND") (pintype "power_in") (tstamp 6e90f82b-b57e-4c8f-8e97-dd89e3b8df08))
    (pad "17" smd rect (at 3.6 2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp f10cd45b-4520-42d4-bc93-cad9926b52f5))
    (pad "18" smd rect (at 3.6 2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 78bbfe7f-5132-4c80-81c4-2b5142845e63))
    (pad "19" smd rect (at 3.6 1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "/LVDS_DEN") (pinfunction "DEN") (pintype "input") (tstamp 1ab4f96b-fc2a-4986-b829-96726687868a))
    (pad "20" smd rect (at 3.6 0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp ae4cee3b-d7fb-48bc-a7b4-1c3cbec134f6))
    (pad "21" smd rect (at 3.6 0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "/PMOD Headers/LVDS4-") (pinfunction "D_{O}-") (pintype "output") (tstamp 0944edd2-9be2-4116-adb6-d449be994609))
    (pad "22" smd rect (at 3.6 -0.325) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "/PMOD Headers/LVDS4+") (pinfunction "D_{O}+") (pintype "output") (tstamp cd6d0bcf-f3c0-46df-a164-c44b98ac4d1e))
    (pad "23" smd rect (at 3.6 -0.975) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 864accad-bb96-4feb-b582-dcf2f384608a))
    (pad "24" smd rect (at 3.6 -1.625) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "/LVDS_~{PWR}") (pinfunction "~{PWRDN}") (pintype "input") (tstamp 636ff7c1-2812-482d-895b-529fd080c02c))
    (pad "25" smd rect (at 3.6 -2.275) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/samplers/GND") (pinfunction "AGND") (pintype "power_in") (tstamp 63727593-7437-4b71-90a0-3448516eea50))
    (pad "26" smd rect (at 3.6 -2.925) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pinfunction "AV_{CC}") (pintype "power_in") (tstamp 94484a37-0948-4755-add9-d7658f9495d2))
    (pad "27" smd rect (at 3.6 -3.575) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 74dd187b-fdb3-469d-a8cb-8fd26a5ad290))
    (pad "28" smd rect (at 3.6 -4.225) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DV_{CC}") (pintype "power_in") (tstamp 1dc60b99-52e3-4fce-a1ca-51c5e61ceec3))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SSOP-28_5.3x10.2mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp c2606ae5-32cf-482a-a443-494831c71b9c)
    (at 195.2 57.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/940fe02b-e726-41d7-806f-7da0064a837b")
    (attr smd)
    (fp_text reference "C604" (at 4.7 -0.6 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 4afc3e6c-1f1d-431d-b3cd-5c1ba14bca56)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp cd800dba-d65a-46f2-984a-6825c8536d02)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp af54037d-5f65-409b-9f2c-e3906868536e)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp d7054eb0-f24a-41ea-87b6-6bab42db53ce))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp dcb56d67-2222-4ef4-91d0-d255422e2621))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 24e30d38-ebe9-4671-ac0e-b971ae34d4ec))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 48e378d6-3f0a-44db-881b-26b9933d9982))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 661a6081-29fd-4b24-b51d-909456da3564))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7b98b808-6e09-4171-818f-9e2bcef533ea))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1b6d2726-3185-4034-b9eb-14a86f769379))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 94afc354-c627-480e-a220-b2a0344ae880))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp b7f861bb-2553-4b9e-a0b6-fa7880eecb3e))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp ff20b3cc-9603-4980-bcbb-425cf100a09c))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 002e2352-78c3-49ca-acc3-fe78bc85e8ee))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 65f7edfe-0698-4f33-a0a8-a14897420470))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE) (tstamp c2a770f3-e06e-47ee-b711-074d3efb5f76)
    (at 178.7 71.6 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "DPN" "240-2378-1-ND")
    (property "Description" "FERRITE BEAD 1 KOHM 0603 1LN")
    (property "Distributor" "240-2378-1-ND")
    (property "MPN" "HZ0603B102R-10")
    (property "Manufacturer" "Laird-Signal Integrity Products")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/16a9bd5f-0bfa-4f42-8382-27d5a088e9b7")
    (attr smd)
    (fp_text reference "FB501" (at 3 2 180) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp fd761bbb-ecd8-4173-805c-96b3a91b1770)
    )
    (fp_text value "FerriteBead_Small" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 57437733-0a26-4287-8468-3ccc0aa26638)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp f0b14364-abc3-476b-9351-b5e8035d30de)
    )
    (fp_line (start -0.254724 0.5225) (end 0.254724 0.5225) (layer "F.SilkS") (width 0.12) (tstamp 136fffbb-d875-47e7-b1b6-28761ea98d96))
    (fp_line (start -0.254724 -0.5225) (end 0.254724 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp fcf89b7b-c7e4-410f-8149-a98f0287bd5c))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 329221b9-1856-40dd-b5bb-939f4c9d25be))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 39bcf695-ac05-48fa-af1d-35e98696466c))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e0b4b1a2-7834-46d0-8521-1771281d29b9))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp f37f175d-a4ab-49ae-969c-e2d1a8bb53af))
    (fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp 2ecbf31d-9683-4f7d-8d5b-c2187a797f38))
    (fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 9e03f27e-69a6-4640-aace-2cd7b8ca85a3))
    (fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp cc254e76-a965-4e8b-be43-ac45dad9617b))
    (fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp dfc460f0-eed4-45e2-8332-f74e03e4cde5))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp a842ebf5-3c36-43e5-a904-e42fcf75ce74))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 40 "/samplers/ADC 2/+3V3_A") (pintype "passive") (tstamp 61e3d5ed-0fec-46d3-8f41-4e379f724eb7))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp c5610f1f-ca5a-4370-a1a6-ba8c0c0a88f1)
    (at 197.3 71.1 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/a41a4a91-9b32-4e57-84de-62d74310a1e3")
    (attr smd)
    (fp_text reference "C613" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp cc825a28-ea80-4f10-b829-b28a83fd8143)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b74f5024-cbb2-4594-90c4-4334949212ee)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp fa21977c-1b8b-4856-be00-67262e312ac5)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 54815e54-76c6-4bb1-863f-a9235a4b76f0))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 7da056b2-e822-40ae-99b6-555e642f6216))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 23e6a1ca-2568-4a83-b338-ba158301dca4))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b579d558-6ac9-4f9f-988d-f9a2fd43ea68))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b6792fd3-ac27-4c81-b963-4d3314aa9078))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp bf6037b5-1dab-43bc-9462-bbde950dc343))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 10615a58-f053-4b1d-ac3e-2e76c5176c19))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c4f98ecb-635f-458c-88ce-48248e2cf229))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp d2c2e16f-021f-4e1b-b573-990346e21113))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp da628053-39b6-47a7-b61d-2f7bc36bf26a))
    (pad "1" smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 2e9980c2-9b5c-48b6-9715-37275182f882))
    (pad "2" smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp c8af12ad-8299-4efd-a70a-04e540a9ad4b))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Connector_PinSocket_2.54mm:PinSocket_1x03_P2.54mm_Vertical" (layer "F.Cu")
    (tedit 5A19A429) (tstamp c644eb9f-9cfe-4f3c-b4f5-faf61cc0a1a1)
    (at 222.925 72.025 -90)
    (descr "Through hole straight socket strip, 1x03, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x03 2.54mm single row")
    (property "DPN" "SAM11930-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "SSW-103-01-F-S")
    (property "Manufacturer" "Samtec Inc.")
    (property "Sheetfile" "pmod.kicad_sch")
    (property "Sheetname" "")
    (path "/944a230b-87d4-40b4-aae8-48769658e35c")
    (attr through_hole)
    (fp_text reference "J103" (at 0 -2.77 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp bd958ff0-8bca-4ac7-a410-f11d953981ad)
    )
    (fp_text value "Conn_01x03_Female" (at 0 7.85 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp f17a34e1-b040-466f-9536-8567c409e1f6)
    )
    (fp_text user "${REFERENCE}" (at 0 2.54) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 8883a230-391e-496a-92b9-40fd5eb5b1e2)
    )
    (fp_line (start -1.33 1.27) (end -1.33 6.41) (layer "F.SilkS") (width 0.12) (tstamp 06fcead0-ec86-4b2d-aca4-e07f8517d54b))
    (fp_line (start 0 -1.33) (end 1.33 -1.33) (layer "F.SilkS") (width 0.12) (tstamp 17f770b8-e79c-40be-93a9-915bdd1bf0ef))
    (fp_line (start -1.33 6.41) (end 1.33 6.41) (layer "F.SilkS") (width 0.12) (tstamp 7450d3db-7956-4c84-bff9-d382fa9f6f74))
    (fp_line (start 1.33 1.27) (end 1.33 6.41) (layer "F.SilkS") (width 0.12) (tstamp a6dba3a8-356b-4378-9025-502cb25f23c4))
    (fp_line (start -1.33 1.27) (end 1.33 1.27) (layer "F.SilkS") (width 0.12) (tstamp b7d02856-3743-4c25-ab05-38da99f53329))
    (fp_line (start 1.33 -1.33) (end 1.33 0) (layer "F.SilkS") (width 0.12) (tstamp dd1169b2-5211-49b6-84ee-74fd919de389))
    (fp_line (start 1.75 6.85) (end -1.8 6.85) (layer "F.CrtYd") (width 0.05) (tstamp 12cb1ccd-8b9a-48ae-b117-f8d415dacbd7))
    (fp_line (start 1.75 -1.8) (end 1.75 6.85) (layer "F.CrtYd") (width 0.05) (tstamp 4dae88dd-a4f9-4941-afd5-fb00a19751dc))
    (fp_line (start -1.8 6.85) (end -1.8 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp 5e058843-3706-4956-bfdc-bfc0e8927456))
    (fp_line (start -1.8 -1.8) (end 1.75 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp c585f749-90d1-4719-ba29-9ae7c7f845b5))
    (fp_line (start 0.635 -1.27) (end 1.27 -0.635) (layer "F.Fab") (width 0.1) (tstamp 3a58b20f-2624-4b60-8c8c-925617ae2b00))
    (fp_line (start 1.27 6.35) (end -1.27 6.35) (layer "F.Fab") (width 0.1) (tstamp 4c6a6376-3d8c-4635-9240-1b4f6329f911))
    (fp_line (start -1.27 6.35) (end -1.27 -1.27) (layer "F.Fab") (width 0.1) (tstamp 97328ee1-e2c5-49a0-a9a7-b1a7383f4d6b))
    (fp_line (start -1.27 -1.27) (end 0.635 -1.27) (layer "F.Fab") (width 0.1) (tstamp e85a92a6-a06a-4ebb-ae77-772c53764efe))
    (fp_line (start 1.27 -0.635) (end 1.27 6.35) (layer "F.Fab") (width 0.1) (tstamp faa8e019-2cb0-4ba0-9565-8911536d6078))
    (pad "1" thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 "/EXT_3V3") (pinfunction "Pin_1") (pintype "passive") (tstamp 1ec72139-1a24-4f27-bef3-d4d76310ba11))
    (pad "2" thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 "unconnected-(J103-Pad2)") (pinfunction "Pin_2") (pintype "passive+no_connect") (tstamp 8bcaa291-fecc-42af-afc7-38e3f0dfaf08))
    (pad "3" thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_3") (pintype "passive") (tstamp 18c78a40-cd56-4dc9-a299-70293de0288d))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x03_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Connector_PinSocket_2.54mm:PinSocket_1x03_P2.54mm_Vertical" (layer "F.Cu")
    (tedit 5A19A429) (tstamp c6788cd5-4d4d-42ad-b126-2d2fe0517952)
    (at 220.4 104.8 180)
    (descr "Through hole straight socket strip, 1x03, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x03 2.54mm single row")
    (property "DPN" "SAM11930-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "SSW-103-01-F-S")
    (property "Manufacturer" "Samtec Inc.")
    (property "Sheetfile" "pmod.kicad_sch")
    (property "Sheetname" "")
    (path "/ef0b46d9-b707-4df1-9d9b-4da7002ba22e")
    (attr through_hole)
    (fp_text reference "J102" (at 0 -2.77) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 7b3ba9f7-f05a-4887-9e97-919c2316a1ff)
    )
    (fp_text value "Conn_01x03_Female" (at 0 7.85) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp dcd088e6-17b8-4cd3-8524-49e6d73e8bce)
    )
    (fp_text user "${REFERENCE}" (at 0 2.54 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1c74e63d-1ea4-4647-b74b-1e2f9051f64a)
    )
    (fp_line (start -1.33 6.41) (end 1.33 6.41) (layer "F.SilkS") (width 0.12) (tstamp 2c146954-8378-4a3d-b9e6-0783b7f4df6f))
    (fp_line (start 1.33 1.27) (end 1.33 6.41) (layer "F.SilkS") (width 0.12) (tstamp 5f2ca4fb-58be-4ce4-8cc4-6b9be8f054f6))
    (fp_line (start 0 -1.33) (end 1.33 -1.33) (layer "F.SilkS") (width 0.12) (tstamp 8b328088-e794-4852-a771-42e798ef83af))
    (fp_line (start 1.33 -1.33) (end 1.33 0) (layer "F.SilkS") (width 0.12) (tstamp 8b7d1988-2034-43d8-994f-c6470e53207f))
    (fp_line (start -1.33 1.27) (end 1.33 1.27) (layer "F.SilkS") (width 0.12) (tstamp c1bda8b0-c640-480c-a84d-9c334c416143))
    (fp_line (start -1.33 1.27) (end -1.33 6.41) (layer "F.SilkS") (width 0.12) (tstamp e1bd3baa-ca75-4ec7-b6db-f4e27ca378d7))
    (fp_line (start -1.8 6.85) (end -1.8 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp 0d7d759b-ee6c-4697-8155-c956078b3820))
    (fp_line (start 1.75 6.85) (end -1.8 6.85) (layer "F.CrtYd") (width 0.05) (tstamp 7660893a-8999-482d-8845-86e62fe6902b))
    (fp_line (start 1.75 -1.8) (end 1.75 6.85) (layer "F.CrtYd") (width 0.05) (tstamp b71a5d75-f6e3-4d21-a928-3c1b77513968))
    (fp_line (start -1.8 -1.8) (end 1.75 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp fd6b0da7-1f96-4862-9c23-df25ea8e6aa0))
    (fp_line (start 0.635 -1.27) (end 1.27 -0.635) (layer "F.Fab") (width 0.1) (tstamp a23963f6-4a64-4a1d-9e43-f8dad44cce42))
    (fp_line (start -1.27 6.35) (end -1.27 -1.27) (layer "F.Fab") (width 0.1) (tstamp bb793389-6650-45a6-ba91-b5de369e29ec))
    (fp_line (start 1.27 -0.635) (end 1.27 6.35) (layer "F.Fab") (width 0.1) (tstamp c15f9ce4-e295-4947-aea1-71a9236695fc))
    (fp_line (start -1.27 -1.27) (end 0.635 -1.27) (layer "F.Fab") (width 0.1) (tstamp c38a9457-3b54-40fd-b4af-82a83438c5fc))
    (fp_line (start 1.27 6.35) (end -1.27 6.35) (layer "F.Fab") (width 0.1) (tstamp cdb94d28-d1a3-456f-bee0-9cdda3f24d20))
    (pad "1" thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 "/GPIO1") (pinfunction "Pin_1") (pintype "passive") (tstamp 83618349-7dca-407c-a84d-52ef55e9b3ea))
    (pad "2" thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 "/GPIO2") (pinfunction "Pin_2") (pintype "passive") (tstamp 170513a4-c6d4-4743-a1f7-337d18a48578))
    (pad "3" thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 "/GPIO3") (pinfunction "Pin_3") (pintype "passive") (tstamp 8843ce79-4e77-4350-93e9-bbd65f9b7f21))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x03_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp c99db1d0-7953-4cd0-9ef3-75d875d9dfc7)
    (at 191.3 112.9 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/24a80803-e577-410d-8e7a-d233a60ea115")
    (attr smd)
    (fp_text reference "C1410" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp fa950f75-0793-42b4-9d93-6c93abad8d53)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0c517af6-5600-4ec2-b9e7-0cd8488445c2)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp a75fd13a-8e4f-428a-ae06-284fdd2434cb)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 105b13d0-6038-4d54-8ed1-a86f089a7a7d))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp dbe96e5a-0c23-4706-bb23-55a6dbc246ec))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 15ad6752-9ce7-4deb-bb82-5249bc712b00))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 863e2ca1-0f2d-4f84-945f-c0c16cf853b4))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp c857f0be-82f7-4a2c-b109-5546d388446d))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fc6bcfc1-01d1-404c-a73b-0cc3830fa5a8))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 5f56bd42-fc40-40bf-b012-95529a4e1382))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 80ac5ae3-6000-41f5-aede-6443564b0a9c))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp aee3aa00-2357-4082-92f7-3d27040da6ba))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp d23a3de9-7e38-4aeb-b96a-a191bfad56e4))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 7680c19f-95b4-4c82-88e9-b1ec6da273cc))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 68c2ca42-5187-49f1-9ac1-16bb10c1da88))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp ca3726e7-f014-4d90-a2d2-def54fd2f62d)
    (at 184.6625 50.9 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/181df231-b3b5-464f-9673-3f2af95e7740")
    (attr smd)
    (fp_text reference "C310" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp b9ceff7a-6503-4d05-bda4-12fb822c53f9)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5c0fac15-95d6-4067-bd13-e0eda8a4433e)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp fe961e63-3cbc-45a9-a683-5ba9710957ac)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 4660c5ba-5fb3-4517-9ff5-7dfe5b94e580))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 5435ad5c-ea47-450d-bc35-efb66a2ad38a))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1a5a7a51-88db-4c5d-a7bb-ad3dd80f367a))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3ceba94c-441d-4678-a8da-0b607571d2d8))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 7d443480-e00d-4e7c-a89b-dd26bc406cbf))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8e8581e0-b820-4b94-9a5f-8b1bc6e91837))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 21146032-d1a6-462e-a29e-f1c72fa4269c))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 5ca7483a-ee88-466a-ac4b-ea63e2329f97))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp b32d9947-af7c-4193-82cf-8598e79923b0))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp c2790b51-9042-4936-a7a8-a181c46c041e))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 8313ffe6-298a-4556-afba-61b6db5ebccf))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 35 "/samplers/ADC 1/+3V3_A") (pintype "passive") (tstamp 95e20f36-1d3a-467a-a138-ed6bcf34ce00))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp caa50544-28f4-4348-adb5-8ec38820b0a4)
    (at 190.4625 36.5 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/71d155fd-ad28-40c9-908e-51e07e9fd843")
    (attr smd)
    (fp_text reference "C418" (at -4.9 0.2 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 33eecb04-642e-4383-b741-c0cb38a86021)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0f9c7b09-5a87-4b63-8d0f-eb94432d1c45)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp aa17594e-d1ec-4dd4-9c2f-ec75e8a9f7eb)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 6046d73a-bdcf-44ea-a7a1-8f8193b7b5d1))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp b42f491d-a618-4c7e-a40e-edc76acf05ca))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 04ba2cc4-0c84-4c8f-994c-1153d2321463))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 07d2fa51-46df-4b6a-8fae-d009bedb4154))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2346c19d-f39e-42bf-a81c-965054963144))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp c741c24e-f1b6-4f83-ba2c-edc8e68af289))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 02184fa9-2fc6-4bd1-923a-53b6209b9198))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 0aec8498-2c75-4e74-8aab-8ec2db113111))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1be91506-7fc7-40ab-9738-356b72601d3a))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a1520d9a-d652-4ba4-885b-d6edee36eaff))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp c2944030-3954-4504-955b-d9b2d9b5b7bf))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp 671f8f5c-61bf-40c2-9b94-2cb3e86590c0))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp d171cc1e-7768-449b-b485-38c76e1bb09e)
    (at 177.7625 37.6)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/0f30aa3a-8eff-4a94-a2fb-965fa1562b8c")
    (attr smd)
    (fp_text reference "C307" (at 0 -1.68) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 0213cae0-4689-4ffd-8862-038224330b43)
    )
    (fp_text value "10u" (at 0 1.68) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 71953a32-0657-4d4c-a073-106d0b97bfc9)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 5edacef2-2887-475b-a074-635d0a34dea9)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 51eae326-52af-48b1-beb1-c09b76252cf1))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp b8f7720a-03a2-4d48-a4bf-545d9f1de922))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 2faed2b6-e79f-4eea-b208-97b65c06d3cd))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 78da6209-9dc9-4f27-9fbd-a9cdf792c585))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 8d279e81-3c8d-4dac-b434-78d5db4e4e1e))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp ad221490-e527-4394-b0fc-f68e5f23bd37))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 2a0e55a7-8f8b-4f1c-9742-2af00b9abf69))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 3f1d5ce8-fa65-4043-b63d-ea67f5befad0))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 9eb7fa4c-09b6-4a29-a501-37a3a4159b6f))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp d0936862-7384-43e3-9dd9-e6226649a198))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 8dde5e3d-4b32-45a9-9f37-e5491cb326ec))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 13f2f5f4-3408-43fd-92ab-f5f68b65c667))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp d215c86a-c364-4dc8-b932-99c081e358af)
    (at 173.6 61 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/4c3e582c-dee4-4ebb-a1e9-7c647c777882")
    (attr smd)
    (fp_text reference "C505" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp af716f04-a958-47ba-b912-6492f178b711)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 23790227-3841-4747-9033-96bf4dbae4c8)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp f47983a0-2bf2-406b-9086-fe6ba0a00114)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp b7e9990d-7dea-48e3-8bc9-e4ef5f66b892))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp e8424fe2-f84a-4b36-b8f7-7adfe2d02127))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 79adb4fc-ec10-4a06-895a-e8d06a3af7a2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 933c8392-bee6-419c-b2b6-02bd209a1532))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp b8c0dc83-7953-4426-b524-6b02f6897075))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp bf804a4b-a002-428f-ad1d-ec2ad8627b93))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 0ad6fea7-34c4-4d16-9c35-5bb63f2dc02f))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 36ededc3-2de6-4080-b806-1b4695c3da7d))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp c210c6c8-5e30-4588-81db-a184c7f10046))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp fcf0e0f2-87dc-42d2-95ff-847f39549e43))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9695e896-df02-4426-a0de-5e99a3684218))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 38 "/samplers/ADC 2/REFTOP") (pintype "passive") (tstamp cf633d43-8970-4e30-8635-659726d4037f))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp d6fcf0a9-424c-489d-ab18-7ea7e3feab60)
    (at 200.3 68.5 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/10b59b44-25f0-4aaf-a2da-c29e1b1eb698")
    (attr smd)
    (fp_text reference "C614" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c47404e6-38c1-4fd3-86c7-a55438061e9a)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a834766d-fef4-402e-863b-9a2263a7dc27)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 23a25353-efc4-41f8-8491-c67889078be7)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 58ed1090-a428-4208-87a9-87c0123f1fb7))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp c1180aaf-9f93-40bd-8f41-4b90ee823959))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 029b6bfd-edb4-443d-b852-b72505b3c139))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp ad2c9198-ef59-47a1-98c7-dd96dc4a957a))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e6bd3ecc-52a6-429b-827d-51e441da1d62))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp fda16d24-0a3f-4f2c-816f-77bddf106b6e))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 13006987-db41-4360-95bc-793ece787752))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp a02a3a94-8fd8-4f05-8211-c37699f6937e))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp a889ea94-9277-4b33-a460-45d7edb7196c))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp e332724a-1636-4dfc-883b-88437da6bfc7))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp 587ebbf0-9e26-4375-8490-d013546900ad))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 6a49428f-3bc4-451a-bef2-643d09270fb2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp d7266cd8-d718-4609-afc5-e97e1816fd10)
    (at 194.2 98.2 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1018-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B102KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/5343f4f0-e100-4eba-b86a-1121786f9ca6")
    (attr smd)
    (fp_text reference "C1415" (at 4.7 -0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a41811bc-b3a3-4b97-b303-21a8fe2ddb9b)
    )
    (fp_text value "1n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp c1c38a51-dba2-4c76-ba96-d2fbe392ac3c)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 091b301b-4eb5-4bf1-beaf-59c42cc83603)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 686ea438-194c-427e-9724-ef39811f0666))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 80a46088-a767-40b2-b410-9fb7dd5323dd))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 17b634a6-edc2-494c-b62b-0937efb121b4))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 28201b42-0405-4477-945c-7ed175837ca0))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp e772c300-f3b7-4c9a-9093-af9b14e3c8d6))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp eaa8f844-9653-4e24-b400-09f7d6e12be8))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 44e6c02f-9127-4cd6-b966-9d8162936667))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 74d5ef1e-55b4-4d47-9c8b-4e0ac1c1c66e))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 7a1dd918-9539-4f62-bcfe-8697f82bf43f))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp fd25bf0f-53c5-4eed-84ce-c5ffe7e08596))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 40302ecb-8433-464d-bee6-460e2eb9f9b9))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 1ff1ecb7-2cb8-4eeb-a9d8-573bad22e9ec))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp d97b5f8c-d352-4b10-9b66-061d1c994ae4)
    (at 181.7625 37.8)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/18f358e1-dffd-40a8-84ab-79359e4145fb")
    (attr smd)
    (fp_text reference "C308" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 6a035241-0d90-496e-b059-4e277aea7f58)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 62beefb0-c704-4a27-bb5d-9cafaa5ac2ec)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 7dfd7542-39b7-4a57-bd56-b57a7ae3311d)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 3ae1769a-4600-4977-b5aa-30948676e32d))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 5a091b18-e13f-4c27-b02b-60a2147296a6))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 41e197d1-7b09-4fa7-9dc6-8b479b9ce70c))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8d88b8e9-addd-40fb-b138-30e56d413658))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp af651bad-ef13-4801-82e9-0a1cb313acd2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp fc365d33-a723-45d8-8e6e-d4fda73dbc6b))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 071fe597-4c44-4e35-adf6-929666c1b784))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 6908e550-5189-421f-ad0a-c719be527264))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 9c49559f-e923-4ea6-93fb-84c5569b9a71))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp eefe8ebb-d1ff-4732-804d-ebb66cfe7815))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp b4a7f6a4-2f2b-4cbb-90c6-e772a422b0ce))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 2b8af164-3538-4064-8164-34f2c5c9b30c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp dd676c0a-c336-4fd7-95f1-8a80c32bdd8d)
    (at 198 112.1 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/a41a4a91-9b32-4e57-84de-62d74310a1e3")
    (attr smd)
    (fp_text reference "C1413" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5a77e49f-15e3-4c8c-958f-120827fac579)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 52a7821b-0a5a-41ad-8850-6d5133ee1504)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 2a5550ec-d2d2-4721-8093-413ca73a6b10)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 89e000e6-49b5-4a73-919b-ff635df754f2))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp e64b8566-be1e-4eac-acab-6ec9f72e9ebd))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 12ecc077-5dec-43d0-82df-5761bb82f83e))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 19d2256a-b507-4243-9d7e-9554cc647240))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1a3aeae7-afcc-434b-b094-b7a18e6ec5b9))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 4a806adc-4187-4aee-b04a-44b9e8631db3))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 29deaf5f-fe10-4286-b455-a97264c09f2e))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a81645a0-0c4c-4c21-8e08-1b120681a5ce))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp aede64fb-fb65-4cd0-8cb5-b1cef94b07f4))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp bf9472f6-1343-4e6c-a36a-a918e491072f))
    (pad "1" smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 61ba514b-88a1-41b8-8a7f-4f9781b97cf8))
    (pad "2" smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 27a2ce86-7841-4602-97c0-363d067b4e08))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp df26a851-c4da-4348-9723-e18263654fd2)
    (at 198.6 57.2 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/d87f9207-6f8e-4d87-9db3-a8cd0e987887")
    (attr smd)
    (fp_text reference "C608" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d68c356b-2edc-4b17-a465-483ca0fa4059)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp bb664c0f-2af0-4621-9cd4-2344806d8ad0)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 5ce64ec7-8d98-4b68-8e90-8e637af9c9b4)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 54e261e6-ef4a-4a80-a489-b007eb4bd6d2))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp bd8b488d-2872-4f57-8f0d-e1a3f29750c6))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 3f2effc7-9d53-4126-a88e-b6110dcb6922))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 75dcac1d-7fba-4435-abf5-9dfa13787e0c))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fab5020e-6a39-40e5-b0a3-da0b130f36c0))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp fd3d8401-df3d-4ad1-baec-ebc721005313))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 046d89d0-5b8c-4099-88ae-06f452601e64))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 2d6987f6-8202-4e73-9db1-499732ea50ba))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 93495137-3bc1-425d-a432-08ca8fb035ea))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp fa7eeb39-8f38-4ded-8644-00fef2f1646b))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 2b6ebc31-0a1e-4aad-9e2b-26231ae90865))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 4983112b-8d7c-4b8b-8df8-a8564c31be74))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp dfb2385e-9db9-4af9-b149-b68dbc61047e)
    (at 175.52 92.64 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/a39dd3a1-8969-4ab5-95e8-86f67f16762a")
    (attr smd)
    (fp_text reference "C702" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp a4b9cb3a-74dc-43fe-ba2f-c6adc95a71c4)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp e8e40529-c32a-4685-9f13-584543248c23)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 472c988b-d3f0-47b0-95c8-d585c18df95e)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 26102b7f-b13e-46f1-87ea-41ef98c0e62d))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp c227edbb-1909-4728-ab83-47a12059c2b5))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 05fefe20-9959-4281-ab51-45b5797800df))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 74cd5de0-35df-49bb-ab2c-ef0b08952c44))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp b603f263-5523-425c-9659-138a0095a00d))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp da249e98-4c28-4045-a303-5542a354fb2f))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 2d84ed6a-ce93-40da-a962-6606d926af06))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 33f77c93-2ce9-4ae1-a735-8f35d6f18547))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 6d15f8e0-b860-485c-a639-a92e5281bae5))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp ae3f69c7-d631-4c55-ad43-a3e4e240f0a3))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 680e424c-aa05-4b9c-942b-75a9014874a9))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 44 "/samplers/ADC 3/VREF") (pintype "passive") (tstamp 23434bc1-78e4-48d1-b7b4-19e9e4c04fc3))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp e57efe12-1439-43de-814a-5944f7d89e11)
    (at 195.4625 36.5 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/940fe02b-e726-41d7-806f-7da0064a837b")
    (attr smd)
    (fp_text reference "C404" (at 4.7 -0.6 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d3dad439-6dc0-40ab-ac73-228530e46519)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 13ed9682-15af-4446-98bb-fff7ce35158b)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp f2d0bc7e-6967-43ed-9640-55d715f5e4a4)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 3ca8d635-45b5-434b-9be0-0ea4c6900d87))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 7e28c9dc-7312-4119-87fd-3db9a2b91770))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 21002e03-1821-4463-9991-ca3099a0a3fb))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 56274af5-feb8-49c1-acfe-e51329d64c31))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6c0c6098-9748-4704-b671-ed2b22dfde5c))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp d09b29f5-85f5-4c4c-9bee-279b315de3e2))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4ca39f2c-69c6-40ef-a42f-ea8bd792885d))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 8509b4a3-5675-4501-a834-f11301554b30))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 954fad90-fe62-4d51-bf20-5858a01747e0))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp bba9b604-3ea7-4799-9dff-c1aa9a5d911f))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 912baaef-9dcc-4f41-8433-4d15181ffc40))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp db918232-9dd0-4e77-8787-6a4cdd3b6a2b))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp e99ddbd3-be5f-4f65-a482-9a2c11e35dc5)
    (at 184.6 71.6 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/181df231-b3b5-464f-9673-3f2af95e7740")
    (attr smd)
    (fp_text reference "C510" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1648ce49-815b-4454-a12a-781202593f16)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 39b264e1-0694-4942-b82f-5da5f6f5b7da)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 8941d807-b89f-48a3-b395-7ee3e65dfd60)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 4bad5585-6c0d-4625-88ce-8d22ebaee0e7))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 769d1e9e-b12d-405d-8e61-6ba17266ccf2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 46cd0f49-8dcb-4be6-96cc-55a560a12600))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6131c471-266d-44ab-a64a-4d0cfb35b818))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 99cc6db1-5bd5-498e-9370-88b7097e76b4))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp c61e7089-5764-4518-a282-9e092e049efe))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4261f033-a528-4f04-a088-360c717eb3f6))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 43616e8b-a6fd-4b39-a040-48c1e14e830a))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp a83c42bd-c97b-4eac-a017-58d5df88f275))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp e8f13fe6-21c9-4c27-b3da-cc83e7a394c0))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 1749380c-fb64-4e47-b90f-39b28ed251a9))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 40 "/samplers/ADC 2/+3V3_A") (pintype "passive") (tstamp 1e49f968-2b77-4d7d-8d52-b0ea98badaa6))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp ee770c65-5442-40eb-97cd-7777ff80a0e3)
    (at 192.9 112.9 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1009-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B103KB8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/13f9d3ac-827f-402e-b049-3746c48e5124")
    (attr smd)
    (fp_text reference "C1409" (at -40.4 0.4 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9040eca9-e4d2-486b-bc53-c1533a5ce735)
    )
    (fp_text value "10n" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 51e629a4-bf2e-46e6-b293-9e21114fb76c)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 39ae4ccc-5410-4171-bf31-c90f9a7994c6)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp a869d9da-ef42-40ed-90c6-eaa3d908ceba))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp eca7453c-ae0e-4fdf-8aad-eb3680f0d3c1))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 07ae5067-8e36-4f2b-a404-b6546304c95b))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2cf954db-e7d5-4cbb-874f-2ff9a470385c))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d67ffeb0-c1f1-4d34-a997-fb16a2f04cd3))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp df249dd6-ed1e-4741-b867-4cb899dd7540))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 1ed280ca-0628-41db-b86d-f14628928d94))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 28618c51-0938-4b92-9359-fd02eb810c2c))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 8d90e929-ad2a-4c3a-9816-3b54a9951a97))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp fb8754ca-6a74-4370-b1f0-17ae02dfdbe9))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 55ccb41a-c935-4649-b2cd-a13dcb66fcde))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9c93964f-be2d-4f3b-8d94-63eff1db4ad5))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp eedf88d4-8324-46ab-95dd-15f35d68aed3)
    (at 184.1 112.8 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/6d03a26e-0dcd-4a97-9fd1-42e476158f17")
    (attr smd)
    (fp_text reference "C1309" (at 0 -1.68 180) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp ec747655-b593-4eac-8e75-bbc6e05a9d80)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 1fa4b958-f26d-4f25-a794-dba307c47237)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp 32a2dcf2-cdbf-4e65-a6b8-8083d0aae733)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp ee640b97-5465-462e-86ce-ee410d63fd7f))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp f72c97e9-9dd0-441f-9d9c-d239ddc5b478))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 5d466a21-4a4a-4f0a-b3c7-05a88e54ffaf))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp a79ec432-4683-49b3-a265-4418e115b0f8))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp dbd2026e-67dc-44d4-b1f5-0cf3e31e4196))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp f804a44d-ce90-4232-95a9-92e467333abb))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 7363656f-3f10-46f2-bfc6-7850e965f31e))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 81242b83-da62-4b1b-a089-02044c28dafb))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp a851c140-bcdf-41a6-bf76-767123e414af))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp f4a85409-63a8-4a28-a3f8-d7cf61865832))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp fed58385-aa04-440c-a73b-10db971537f5))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 50 "/samplers/ADC 4/+3V3_A") (pintype "passive") (tstamp 83043abc-dec9-4c93-b6ed-4b963a56f98f))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp ef988c29-f87d-42be-8ddf-e264f32625b1)
    (at 178.4 79.1)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/0f30aa3a-8eff-4a94-a2fb-965fa1562b8c")
    (attr smd)
    (fp_text reference "C707" (at 0 -1.68) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp d408a5ef-198d-4804-a24c-0d5c1ade738f)
    )
    (fp_text value "10u" (at 0 1.68) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 3d198d8b-68d1-49fd-9898-12d76dca2d5f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp e4f7187d-f049-43d9-958f-e22b84db2829)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 12bf65c6-86b7-47e9-985f-13a2a9172b16))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 58734a7e-8fde-43a6-81f3-99e7b2c20006))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 1091cdd1-0b9e-48e2-adbd-e7506a063b18))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 4638f7c2-5c66-4601-8a41-1c191e1dd957))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 830c3907-3c1a-4449-b0ca-835999d3a445))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp a08425be-7259-4e2d-a771-ac47ee86e6cb))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp ce7d97f8-562d-4af8-bf88-816d97683e8b))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp d5ea02d5-5672-4038-bbda-6b92c86af565))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp f6075ea7-fc69-4456-b985-90c623258c2c))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp fbdef1e7-8c2b-4e25-8477-3441c0d35681))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9ea4e6b1-5249-42b5-80f9-b30c6e26a006))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 6185e1f9-85df-411c-9e12-506014ee6c94))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp eff2b6ef-75e7-41bd-ac35-880bd18738e5)
    (at 169.7 63.1 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/c10ee28a-e11f-437a-b965-ac764d416b6f")
    (attr smd)
    (fp_text reference "C501" (at 0 -1.68 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5c1c70df-7f16-4180-a510-4cc1d2dc074d)
    )
    (fp_text value "10u" (at 0 1.68 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 340b9465-f18c-4eb3-9d64-c5f0d4595716)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)))
      (tstamp e24f763f-a2c6-4527-b764-f5a177d1246f)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 1e950625-b374-4222-a7d5-c61229b5643e))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp 8a31250b-bb45-4eed-a9fa-561df55a8b45))
    (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 07d5c754-5d47-4b83-be77-77487ee22c1a))
    (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 9417876f-5555-4ea0-a941-974270561f58))
    (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 9f0ff070-08af-4e75-8908-1c5b9dea46a8))
    (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp eadd47be-2888-4007-ad4a-2dcf25f346e1))
    (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 0b028500-8c03-4f07-a84e-3dd6b72ca42e))
    (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp 16947c10-9abf-4aeb-b49e-c830d0dbaa1a))
    (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 2726044d-ad80-4656-91ca-20609b6b99ef))
    (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp 8735d8f8-c2a3-4c16-b953-29cbaae294f1))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 37 "/samplers/ADC 2/REFBTM") (pintype "passive") (tstamp aa004620-484a-432c-86a6-0c52c6a9894c))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 38 "/samplers/ADC 2/REFTOP") (pintype "passive") (tstamp 516c8632-f115-410e-b206-6d72e97f8a0c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp f2d2f324-336d-4e7b-a17e-5d0c8e2cbde3)
    (at 173.6625 40.3 -90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/e2d5a27a-590e-4787-93b8-8fa3f83cc562/4c3e582c-dee4-4ebb-a1e9-7c647c777882")
    (attr smd)
    (fp_text reference "C305" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 540bcf9c-4ed2-4747-b0bb-e3e5c1835553)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 9060bf73-c496-493d-973a-47eb778135a1)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 563c1b21-bfb9-4aa8-ad3f-d79c014e5ba5)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp 236d9587-4180-4e34-8c29-52539e5a96c8))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 871f4ca6-60eb-4481-a5a5-71517afa32e2))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 057c9c6a-24c9-4184-aa1b-90a4e19e989c))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 45051180-5b7c-4a14-8b91-1e9801ee808b))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 4dd6da06-3e3d-4197-890d-25662ae8acda))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp d151b140-1090-44f2-b88a-63485e50411d))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 147b3a78-556a-4982-b4d1-3f66aeed4ed5))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 3acf7a1e-6fc2-433e-ba78-3e23d0e33871))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 41521a65-f21a-40ab-aa00-a4e28b793da1))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp fe019086-090f-4baa-b58d-ffbb9ba4b953))
    (pad "1" smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9b55da40-3d0e-453d-a21f-fb926b4a06bd))
    (pad "2" smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 31 "/samplers/ADC 1/REFTOP") (pintype "passive") (tstamp 05e4fff8-d684-45f5-8ddd-4c475af4ea6e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp f441fcf5-c23f-41cf-b577-73ad5534e4d8)
    (at 177.5 92.4 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/54c3d8ac-aa96-4ec1-a156-967370296365/cc8d276b-090a-453c-85c5-9e95f587b7e7")
    (attr smd)
    (fp_text reference "C703" (at 0 -1.43 90) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 27f44050-8d9a-4a0b-a15d-1d543bec445b)
    )
    (fp_text value "0u1" (at 0 1.43 90) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 21961a6a-f6eb-475e-afd9-d6a5fe3660d3)
    )
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp eef9a5f2-e135-4869-a1bf-797ddc8a83ad)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp a66413d6-c1f7-4eb3-a822-62fda2406309))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp fd620a91-0ac3-46d3-9b3b-7c0483f03f08))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 14e1b2b2-dabe-4a5b-ba8f-c30bf0067e59))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 1b90f7c4-9a68-48e0-b05b-859f741f51de))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 69077c26-dcd5-4ca4-a1ac-26a77ae58430))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 6f4af621-666a-4650-af22-cfeff7883048))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 14b46be8-064d-4cf9-a385-972c1f2ffed8))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 1a5c865d-2975-40d1-93bc-e92330b9fd0c))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4a6a3895-1d35-4cff-a526-1075c54cc3ae))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp a3f01054-4521-44f6-8005-b3537c237ea9))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp e4dd1807-e306-4101-b2cf-15dcebd79763))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 44 "/samplers/ADC 3/VREF") (pintype "passive") (tstamp e0bf1af6-3906-4527-aaa0-29023637dc0e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF) (tstamp f6b8a6e3-a068-44d6-8d58-d48bb5a7bf16)
    (at 170.7 65.9)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1935-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B104KB8NNWC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/37aea625-308b-47c6-9292-d19b3a3addb7/d21d427f-890e-427f-b79e-77f66923f259")
    (attr smd)
    (fp_text reference "C506" (at 0 -1.43) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 87103f2a-6b86-4c00-90f9-14fa652246e4)
    )
    (fp_text value "0u1" (at 0 1.43) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp eebf8cf0-45b5-4f9b-9e33-3a9f5692d529)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)))
      (tstamp 1063b116-8212-4a2e-a98a-94e203ec7d2d)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "F.SilkS") (width 0.12) (tstamp 83a65bc3-d0a1-4103-b9b5-e6a6122212b2))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "F.SilkS") (width 0.12) (tstamp be010715-3bb2-44d8-90d6-3d5a33318d61))
    (fp_line (start -1.65 -0.73) (end 1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2aa3e66b-302e-4ad5-a3b5-d78f1c602d77))
    (fp_line (start 1.65 -0.73) (end 1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2f0771a5-1d24-485f-9dd5-ef6944d3535a))
    (fp_line (start 1.65 0.73) (end -1.65 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 8523bbb6-44c7-4970-a0b9-6cd5818e4c57))
    (fp_line (start -1.65 0.73) (end -1.65 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 87b27341-9ab8-4ec3-92af-ab8dc15e306e))
    (fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 431131a3-d06e-4e83-bae4-0db9655f36ec))
    (fp_line (start 0.8 0.4) (end -0.8 0.4) (layer "F.Fab") (width 0.1) (tstamp 4a6b5420-5dea-4233-a321-9ea2bc38bb02))
    (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp 60e6f40b-7e70-4e1f-9ee6-c42f4bdf4429))
    (fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer "F.Fab") (width 0.1) (tstamp f2022654-7e84-4d1a-a150-f930130f2173))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp e2beafe9-5a9d-4e6e-87cf-2097189c4073))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 37 "/samplers/ADC 2/REFBTM") (pintype "passive") (tstamp 2b63c61e-3904-4e96-a3f6-289a17de1bbf))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Package_SO:TSSOP-28_4.4x9.7mm_P0.65mm" (layer "F.Cu")
    (tedit 5E476F32) (tstamp fe24ee68-79b6-4066-9eaa-e7fe5bebc51b)
    (at 181.3 105.6 180)
    (descr "TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (property "DPN" "AD9203ARUZRL7CT-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "AD9203")
    (property "Manufacturer" "Analog Devices")
    (property "Sheetfile" "adc.kicad_sch")
    (property "Sheetname" "ADC 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a17cd4bb-fc04-4069-bbdb-c4bb11ee99d5/957aae89-eaad-4355-91ec-b14040eabe5f")
    (attr smd)
    (fp_text reference "U1301" (at 4.7 -2.6 90) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp fb833ac1-5f32-4c7a-a301-07f2dc696d86)
    )
    (fp_text value "AD9203" (at 0 5.8) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 5d68d584-d5e1-4b84-8f2d-7e714901fdb8)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
      (tstamp 831a12dd-5346-43b2-9552-54217dc7d29f)
    )
    (fp_line (start 0 4.96) (end 2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 048c04d1-cd43-4fb9-b1cf-95863c1ab128))
    (fp_line (start -2.31 -4.96) (end -2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 2f3407f2-cc9e-4066-99a0-be7adfbcaa76))
    (fp_line (start 0 4.96) (end -2.31 4.96) (layer "F.SilkS") (width 0.12) (tstamp 5d9fcff4-3439-4887-8ef9-6b831ab70a91))
    (fp_line (start -2.31 4.96) (end -2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp 71100f53-eba8-43dc-a3c7-d84193d72e48))
    (fp_line (start 2.31 -4.96) (end 2.31 -4.685) (layer "F.SilkS") (width 0.12) (tstamp 7c5b90c6-70f6-45c8-99a9-785584ae94e1))
    (fp_line (start 2.31 4.96) (end 2.31 4.685) (layer "F.SilkS") (width 0.12) (tstamp 826f1c4b-a678-4a95-9de7-7bb87739b129))
    (fp_line (start 0 -4.96) (end -2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp d30c9ca2-4b13-4c0a-8305-b824192f7e13))
    (fp_line (start -2.31 -4.685) (end -3.6 -4.685) (layer "F.SilkS") (width 0.12) (tstamp f2d89ac5-1163-4090-924b-717d36454112))
    (fp_line (start 0 -4.96) (end 2.31 -4.96) (layer "F.SilkS") (width 0.12) (tstamp fe73b3e3-9937-4136-b5a9-8e239636ab0d))
    (fp_line (start -3.85 -5.1) (end -3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp 37b38630-bca4-4092-a545-45ef587169c5))
    (fp_line (start -3.85 5.1) (end 3.85 5.1) (layer "F.CrtYd") (width 0.05) (tstamp 848219a3-871b-4662-8492-22c7dd1630f5))
    (fp_line (start 3.85 5.1) (end 3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp a7314326-d0b4-4482-bae2-65262935bf80))
    (fp_line (start 3.85 -5.1) (end -3.85 -5.1) (layer "F.CrtYd") (width 0.05) (tstamp e950e79d-8284-4219-b08c-8ddf83fecf0c))
    (fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer "F.Fab") (width 0.1) (tstamp 04ff509b-b549-445f-8861-769f3aabf19e))
    (fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp 0e26e008-bc5e-458e-944f-4f61225a5af3))
    (fp_line (start 2.2 4.85) (end -2.2 4.85) (layer "F.Fab") (width 0.1) (tstamp 4f772c83-8159-407c-966c-0f1b9b4877be))
    (fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp 5689af15-2e89-44ce-8818-36fbfa57c74f))
    (fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.1) (tstamp 8f101285-4eca-455d-bd84-147dcf5271a9))
    (pad "1" smd roundrect (at -2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "DRVSS") (pintype "power_in") (tstamp e48849d4-3c21-49d8-b3a5-c6ad8d774a87))
    (pad "2" smd roundrect (at -2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 50 "/samplers/ADC 4/+3V3_A") (pinfunction "DRVDD") (pintype "power_in") (tstamp caad917c-c218-40a0-a542-a2717bf42619))
    (pad "3" smd roundrect (at -2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 89 "/samplers/ADC 4/D0") (pinfunction "D0") (pintype "output") (tstamp 2c017417-95ca-4c15-a5b4-fc9614c4e3bb))
    (pad "4" smd roundrect (at -2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 90 "/samplers/ADC 4/D1") (pinfunction "D1") (pintype "output") (tstamp 170025b6-df5f-41dc-b5b9-39c78c5633b6))
    (pad "5" smd roundrect (at -2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 91 "/samplers/ADC 4/D2") (pinfunction "D2") (pintype "output") (tstamp f204e910-5cb7-4987-8bcc-3886c2ff3543))
    (pad "6" smd roundrect (at -2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 92 "/samplers/ADC 4/D3") (pinfunction "D3") (pintype "output") (tstamp e161b8b7-4ce5-4fbb-a706-1a4c8c0b215e))
    (pad "7" smd roundrect (at -2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 93 "/samplers/ADC 4/D4") (pinfunction "D4") (pintype "output") (tstamp df9e2a1c-9e9f-4d66-955b-0c3cc92ab8b5))
    (pad "8" smd roundrect (at -2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 94 "/samplers/ADC 4/D5") (pinfunction "D5") (pintype "output") (tstamp 9305947e-e43d-4c4e-b90f-9feac4e7b28c))
    (pad "9" smd roundrect (at -2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 95 "/samplers/ADC 4/D6") (pinfunction "D6") (pintype "output") (tstamp d4bcf734-e54e-4bbf-b3c3-7e47d0432095))
    (pad "10" smd roundrect (at -2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 96 "/samplers/ADC 4/D7") (pinfunction "D7") (pintype "output") (tstamp 68a434f2-a885-46de-9b0b-834b8a5b83c7))
    (pad "11" smd roundrect (at -2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 97 "/samplers/ADC 4/D8") (pinfunction "D8") (pintype "output") (tstamp 0d36785e-d41c-44f1-b5f4-a7b240f36dfe))
    (pad "12" smd roundrect (at -2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 98 "/samplers/ADC 4/D9") (pinfunction "D9") (pintype "output") (tstamp 5f08db2d-d697-4cbe-a3d7-162221e0865c))
    (pad "13" smd roundrect (at -2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 99 "/samplers/ADC 4/OUT_OF_RANGE") (pinfunction "OTR") (pintype "output") (tstamp 4dda0aba-f417-493d-9deb-6887a28253b6))
    (pad "14" smd roundrect (at -2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "DFS") (pintype "input") (tstamp 59b8552f-c34b-4ef7-a484-1917ce40afc4))
    (pad "15" smd roundrect (at 2.8625 4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "/REFCLK") (pinfunction "CLK") (pintype "input") (tstamp 3097184d-d746-411f-b237-96a234b85070))
    (pad "16" smd roundrect (at 2.8625 3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "3-STATE") (pintype "input") (tstamp 3739ad0f-7090-4120-96a8-9e60d0674591))
    (pad "17" smd roundrect (at 2.8625 2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "/ADC_~{EN}") (pinfunction "STBY") (pintype "input") (tstamp 09652380-ea72-4e0b-aa2c-db5aa395e328))
    (pad "18" smd roundrect (at 2.8625 2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "REFSENSE") (pintype "input") (tstamp 2e4b2c2f-cdb8-4429-97a1-3b6e8ca2fc0e))
    (pad "19" smd roundrect (at 2.8625 1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "CLAMP") (pintype "input") (tstamp 0940f4b0-e52e-4b38-95b5-98736d2ecfef))
    (pad "20" smd roundrect (at 2.8625 0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 29 "unconnected-(U1301-Pad20)") (pinfunction "CLAMPIN") (pintype "input+no_connect") (tstamp 195c170b-48eb-420f-9c72-e45f6f96b0ce))
    (pad "21" smd roundrect (at 2.8625 0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 27 "Net-(R1301-Pad1)") (pinfunction "PWRCON") (pintype "input") (tstamp 83f51536-52f2-47c2-ad08-606b24e3d24c))
    (pad "22" smd roundrect (at 2.8625 -0.325 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 48 "/samplers/ADC 4/REFTOP") (pinfunction "REFTF") (pintype "passive") (tstamp 70150972-2db4-4d64-b6d3-1850c9b312f9))
    (pad "23" smd roundrect (at 2.8625 -0.975 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 49 "/samplers/ADC 4/VREF") (pinfunction "VREF") (pintype "input") (tstamp 597a5269-95be-4b3c-b019-77d3af8ffd01))
    (pad "24" smd roundrect (at 2.8625 -1.625 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 47 "/samplers/ADC 4/REFBTM") (pinfunction "REFBF") (pintype "passive") (tstamp 2e910850-05da-4988-ab2c-8a6adc22cbbc))
    (pad "25" smd roundrect (at 2.8625 -2.275 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "/CHANNEL_4") (pinfunction "AINP") (pintype "input") (tstamp a05fabdd-ac85-44bd-ac44-cd42be0aa4e8))
    (pad "26" smd roundrect (at 2.8625 -2.925 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 49 "/samplers/ADC 4/VREF") (pinfunction "AINN") (pintype "input") (tstamp 1ba925d2-7ce3-449e-9d09-927a38cd9ca9))
    (pad "27" smd roundrect (at 2.8625 -3.575 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pinfunction "AVSS") (pintype "power_in") (tstamp 54761679-3a6b-43be-bc2d-cfcd31b3f56d))
    (pad "28" smd roundrect (at 2.8625 -4.225 180) (size 1.475 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pinfunction "AVDD") (pintype "power_in") (tstamp a48be7bb-a781-4372-b1f3-e431b812f6a8))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 007d9325-65c2-4f6b-8d6f-ccc7371bf9d5)
    (at 195.4625 43.6 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/1941a529-e2bf-45a9-9695-f073e95c413f")
    (attr smd)
    (fp_text reference "C411" (at -4.4 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 0ea0a781-cca6-410d-b5be-5532f3c0cfac)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 05c14d25-f294-4974-9f26-43152427ac65)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp e4986dab-a9e3-45c6-9fd6-78cf84c7ad25)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 153d061a-07c3-4350-8578-ac41669be4ce))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 35debb69-a2f9-475f-9f2a-734ffc121e9f))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 080f7811-522a-4884-a706-944697445622))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 30e35b35-7b4e-427c-a9cb-101adaa89301))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp a881a27a-57ae-4fa5-921e-053fbeb4ed16))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp df8b1b3a-8810-49af-87b1-b62a4ad0f7e8))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 1c799e3c-057d-4386-b96f-b182e3d84fec))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 8726e2c0-03ed-44ed-91fc-909fb0a1aacf))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 8d54526a-20ec-4e43-8ff3-d91e97560177))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp f8a76360-515e-46c5-a8d3-4d71ea0edf10))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp ff3d7230-b014-42c8-a892-6e935f51dfc0))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp cf0ecca1-5896-4c42-a33e-48265f54b347))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 053c6f18-8232-46c5-96fb-34a5cf1b52f0)
    (at 195.7 103.4)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/ebdddcbf-6f90-4c06-b551-ef3582c8a5aa")
    (attr smd)
    (fp_text reference "C1412" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6bcbfb36-17bf-46a6-ad32-fc7c67840723)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp b1a13382-79bb-4213-910b-918a2056ca53)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp b05440ad-d5a9-4f58-8544-05cd9aa4a790)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 4d172ad8-a100-46ec-a3d3-8eb796107884))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 5f16a911-de8c-4277-9c2b-fa377721e8d5))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 053bc96a-42f8-485a-a739-3061174fddb7))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 1eee8f0c-f9bf-4976-9ad6-a86cc05584fe))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 313c581e-524a-4b98-9283-80a7b22662b9))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 655de97f-0418-404a-8d8d-4c90d052cebc))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 68b5c184-7ece-4094-909f-324d49af1f52))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 7f824847-1347-43b3-a834-c627527d6c17))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 8643d9ff-d5ee-4929-9f84-215bc653f79a))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 9044d8a7-5712-41f4-87b9-ee09633b3e50))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 21c8e199-4473-4a30-aff5-c4b7329e27da))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp a98624a5-3b28-4ab3-ab6c-347d522d115a))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 064f593b-b750-419f-9123-8d3ac2bca393)
    (at 189.4 105.29 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/260a300c-d35c-4903-9853-493168f9a991")
    (attr smd)
    (fp_text reference "C1406" (at 4.5 -0.01) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp cc42539a-715f-416d-ac8f-84a26e600f56)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6b83ba46-2db2-4b59-8316-cf0836aa934c)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 40c25b86-30fc-45e5-a1f0-adafc5e64c9a)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 29c85118-8ee5-4194-8bbf-a54611d55383))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp f037222b-e560-4670-b47e-2ddeee018fe4))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 0e8a0bd9-679b-4b61-894c-d9b58c08e93f))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 0ffc3b14-7acf-434c-aca8-04211ca73b32))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 50385435-9c3d-4af1-976b-6257608f9f6d))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp afd0837f-324c-4157-8c2e-4f23c87fbcdb))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 8a1a35ac-65af-42a4-b6fc-d04fde33fbb8))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp c71c61d2-3e72-44e8-9159-c9f4165d5cd6))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp f4071882-32f6-4d04-ba02-3052b294be54))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp fe982cc6-6c77-4b76-89b9-170ccec6aca6))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp b71df101-7b43-400c-8c72-ffb936e730ed))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 7f8c3dec-dcd1-447b-af3b-363dbc232940))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 1062afc6-268f-48eb-bfbd-237d5d0c2add)
    (at 188.5 60.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/9e26e534-3dba-489a-8e4f-cca6039bae2e")
    (attr smd)
    (fp_text reference "C607" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 70bb9744-8604-4562-beeb-a604267da369)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp ac4b05e7-cb30-4f43-9acc-b715fda65359)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 7185e1e3-38f7-4899-87b9-6f80cd8ef606)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp ec1db46c-ff69-4bed-9fac-4953e3e85615))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp eee67744-df0f-4102-905a-1596e220b8c2))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 02e8b2b3-549d-4c31-a076-ad0e4dbd411d))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 3d9cc646-c19b-420d-adec-a3df164f94d8))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 7200c103-3c7c-4e67-b3dd-e27a74621a37))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp b777aeec-06d0-4403-b5a4-c12d1d966905))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 00362297-2eb6-4979-8b17-401e2724761c))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 5b098679-2ddd-4c8a-8de8-afb1c414531f))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 64fa8e77-e5a9-43b3-aefd-09d56b58c10b))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp cc2471fe-2221-47be-8a10-c2fcdb288773))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 51fb9597-56bd-4155-8e31-5a5aa7b6098b))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 24913425-68f1-43fd-acae-8cbaa4ab652c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 16166cb1-16e3-417a-bdb5-f45e2577a3b2)
    (at 188.7625 41.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/8ffbe9b4-2e1e-43a7-b489-5a21c5a8afad")
    (attr smd)
    (fp_text reference "C402" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 969cc388-f6bc-4794-b4f2-8223abce9f83)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp ebc1fc37-5cfb-4204-8f1e-d33e4b2eaccd)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp e126b4fb-8261-498f-9f9c-022b87faf238)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 4149ea87-b601-46f9-81ef-7188dde3a180))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 5a5cc24e-bdfd-480a-adf3-4d448aee3b33))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 0bc783c2-8c4a-4b5a-a287-aca4c40e8670))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 70690104-94cf-4863-a748-d17df549bce7))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 93914e4e-40d6-4fa4-b3b2-a16a948115d8))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp d4a67fc3-2a72-4408-aafe-8eadb2e5b25e))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 0e37b737-efa7-4d50-94a4-3b8002386918))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 54550655-bd38-40f1-83b3-14f800b8d5cf))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 7a73da23-53db-44f9-9422-664cb5f5030a))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp dea8d0d9-a472-4849-bfcd-6bd4694056b9))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 401e282e-5e19-4d12-bdf2-47afe1624528))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp eb8023d7-f88a-4c01-b342-007f64fe3163))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 26274ed3-6417-4ee3-aa45-f22c6efd6c17)
    (at 188.7 66.4 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/00e46d39-6f2c-40ca-b6ce-62f43b6eea38")
    (attr smd)
    (fp_text reference "C601" (at 4.5 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp eabad0fd-b761-47a4-a608-dab525251555)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 5532a5a0-c4fb-41ae-a916-f255db3b64d5)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 7ff0bd79-92de-490f-bcab-ebf3bef95093)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp ecf8dc1b-3cd5-4a05-b561-f27a7f72cb6c))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp fba20c4c-b69a-4ef4-ab08-1af18debd31f))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 30d70871-3c22-4df4-a8e7-4773beb9e808))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 3fdd81f9-c5bd-4c6d-bd81-aaad413d6e9e))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 6f6acc1d-84b2-4e5c-b573-82ec4c4ea5bd))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 889eb23a-a14c-4412-a2f4-0fb67e257917))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 00c36f1b-64c9-4d73-9038-377fe0d6d439))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 1cf92923-db3e-4995-a8da-f312acbb34d4))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 20944a97-a0b2-40a3-97cb-8f06a1045feb))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 785bf7ec-4bed-41b0-8216-ee252899c17c))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp feeb1385-4a68-4345-acc6-9db1e8e6c768))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp e4b06b4d-cc8a-4779-aef0-864f7a9725ae))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 3033f4ef-00da-421b-8626-b35ac6864ec6)
    (at 188.9625 43.59 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/260a300c-d35c-4903-9853-493168f9a991")
    (attr smd)
    (fp_text reference "C406" (at 4.5 -0.01) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp fb4e7906-377b-4bc0-8a41-a733bed7ae22)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 0745ff81-eafa-4225-9d8f-da6ad3aa91ca)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp b2f35992-c8fc-4496-b34b-7f322b9df40a)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 1021f023-47de-4570-9e90-94202b2200f1))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 56cf1606-c0a3-4ba6-9d6a-54b5e0a42ad9))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 100dc7e0-2f26-4db0-85d1-193336878874))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 55f878c1-2853-40a4-a523-a15c12deb652))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 60a3a0c6-2109-4f7b-a566-26befcebb7fc))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp ede93005-fc37-4474-b168-65e057ee08bf))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 5c822918-270f-4b10-aac2-13575eb0ed91))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp a0dc24e7-e8c2-4283-b62c-e19a1034e46e))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp b1896a76-5907-480e-b7d1-e5c994a59a58))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp f8bb7652-8ce8-41a0-97e2-92e485a82bf3))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 93eec84e-8de9-4815-a624-bf29022f9209))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 1abede63-ae1d-421c-ad6c-b1b6990db83f))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 34f158da-23a4-490d-9cd3-9961c9525511)
    (at 188.7 64.29 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/260a300c-d35c-4903-9853-493168f9a991")
    (attr smd)
    (fp_text reference "C606" (at 4.5 -0.01) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp cbfd1c9c-d3ce-4d0c-af13-e5f8da7c8880)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 72ef3fa4-aa1d-4242-8fa4-baeeb8550a72)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 56d769ba-414d-4046-a067-0aa6a0219006)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 69059444-ca3c-4779-8411-fe62fd1a7720))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp cd2110be-5159-4c5c-a57e-2ca34a15bb9c))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 143a215b-e0b1-4efb-99eb-757f6bbacd6a))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 2c4afe4c-eba8-4ddc-a09e-38d4545272cc))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 85a9af7f-6fbf-4c50-beed-09bba2b4c765))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp f38ce997-16f8-4541-aee0-7747df1b1cb7))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 31ab3346-6908-49c5-a0c5-068d24897e41))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp b9ce056f-ed1d-4aed-82d5-882a184aeca8))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp ec6584b3-ba0f-47c5-aee9-0c5ff42e9d85))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp fe67f3f9-41d5-4dcc-9b63-86f4ef65c9cd))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp c12df794-5332-4185-8430-157e224ad15b))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 2c957620-08ac-4d93-b5e2-87017442a9fb))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 418e0080-30a8-4ec3-8bbd-6366a56ebab5)
    (at 195 60.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/b8173e5b-3247-4073-b968-f97dff8e75a6")
    (attr smd)
    (fp_text reference "C617" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 9dfd8cb2-664b-4470-9269-dac5bc15db8e)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp f51fcbbb-84c6-4310-ac7f-5df81c0563a5)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp c47dd0af-9b18-48c0-bca5-3ff8493fc4e3)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 164216dc-1601-4445-b16f-d80c05161e4e))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp ec8151e3-d8dc-4835-bd7b-f533febde4e4))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 102bb9db-dc6f-4ae2-b092-84c74f7c5dcf))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 4a97b2f9-1205-4b08-93f7-d492940e43bf))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 4d2e674d-233f-4e0e-aa10-9c19e803dc7a))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp dfcd9ebf-040c-4068-a617-67b0533996ef))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 59bc3a79-40f3-4849-a8a6-64891c5d37e4))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 882c6dd4-c375-4fcb-8e72-cb18b4260be7))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp b2f9eaf3-64a1-4a18-9248-f68db13a48f3))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp ceb1baf6-6003-42a9-8100-7240524337b9))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp d64e3737-5d5d-4a56-907e-1ddcdbe1d7ed))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 658d01e3-e113-4354-a0a2-aa55e0af1053))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 4347b947-56cd-46d9-ba23-3219d3808eb8)
    (at 195.2 64.3 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/1941a529-e2bf-45a9-9695-f073e95c413f")
    (attr smd)
    (fp_text reference "C611" (at -4.4 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6fa95216-1964-434c-a62b-3e9058b84e76)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 1fdcc11b-2586-4226-bbcb-d1e558c99b0d)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp aad18053-bd15-4440-af66-2353b29df15e)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 013b6bef-bd10-4222-9285-644cab184164))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp e845d05e-2738-4164-a2db-3a1ba1e497ce))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 85ee052f-7b22-4846-8870-c6e2ecf6f823))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp a590d36a-ec7d-43eb-8c2e-a8a3c4fcabf1))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp a9ff99ce-edca-4d88-a7ad-67994ac49cdd))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp e84bde12-5f2b-485a-94f8-a52f2ac43cb8))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 24c5eecc-b2e7-46a3-a14c-d0452e1a4127))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 5a9cc4d1-aa85-4294-bc88-16d9f0b42b51))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 66243756-ff42-4530-b0f1-6dc42a81b67e))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp b916235b-f97d-4926-80c3-da1186e668c7))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 59504154-d6de-48c2-95ef-cbb66aef1991))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp 318757c6-b337-4e8d-bfba-51f24970691c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 48417ab3-3b15-463a-b99f-bfe8391603bb)
    (at 189.4 107.4 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/00e46d39-6f2c-40ca-b6ce-62f43b6eea38")
    (attr smd)
    (fp_text reference "C1401" (at 4.5 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 3b837a8e-1ee6-444a-9527-50e3dcdefd73)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6e0f9473-21d0-46ce-a214-a49a970ab07f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 4b763a0c-f938-4dd3-9205-7f57e864c7d5)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 1931c56f-d6d1-41b1-8e97-ed6134ac752e))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp eae5a357-9bfa-415c-88b0-5fd52575ae5a))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 18a18d5a-364e-4d81-82ae-06eeb6ce573b))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 48ee4c6a-5203-4ee4-8e78-cdf82a927e6d))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 4f699d1f-1c6e-4298-8569-dca7b70c7769))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp f8a89dd6-8f8b-4256-9226-a4d8ead6c35e))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 262fa9a8-5ca0-4f75-afb0-4c36245ba874))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 6d34f664-6f93-4498-8aa9-6ea2c23fb8ff))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 77dfcb6a-6efc-42e6-a438-6d27383ff075))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 8e315d6d-4c97-40c2-aca8-0e912362cb17))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 115a6c28-14a1-4033-bc26-36facd790dd8))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 044b3be1-1fbc-41ef-a642-a1edb52e88d3))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 4e4d6a83-2bf8-4ce2-a30b-2caea824d925)
    (at 195.7 101.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/b8173e5b-3247-4073-b968-f97dff8e75a6")
    (attr smd)
    (fp_text reference "C1417" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6bfabeb4-139c-4053-9d17-7fcaf9e32b63)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp a1a80ce6-d10a-436e-8cfc-d98e607aea3c)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp d8de6471-bd62-4de6-9cf8-9eb56c9a655c)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 2ed5094a-8798-4c83-a6ab-8d449214d578))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 447fabc0-8e6d-492d-888d-198588388504))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 62398251-64ff-44ff-867a-b84d15b06fe6))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 6a39a790-306e-48d9-83a2-054d504d013f))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 957aee0b-112a-4ac0-bf57-eebc357b6905))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp b174b206-6d4c-49f6-a40b-e3109b81411d))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 3b16af42-4568-4754-b7f6-aaa86a5008aa))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 4f686aeb-b80e-4868-8b35-e6f566c79d49))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 8edb3406-cd5c-44a6-b33f-3b48ddf3d3ce))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp c71936d9-e2b2-411b-928b-eef264dad26f))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 93a4a38f-79fc-4bdc-9f70-b077f4a0fafe))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 9140db71-d988-4fe9-b544-58289470ba2e))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 572b0494-11e4-4f2d-a975-48d7c2de6c75)
    (at 195.9 105.3 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/1941a529-e2bf-45a9-9695-f073e95c413f")
    (attr smd)
    (fp_text reference "C1411" (at -4.4 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp f6ef90a6-3fb7-468f-8709-ee05df706ea9)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 5ec09059-e4fc-4dc5-ba89-deb906718727)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp ed1b1d25-264c-465d-9ded-aa6c6299d2d8)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp f0a8d9ec-6588-4328-8c29-eb63b142edd6))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp ff7bab27-8523-4bfc-99b7-e0020228ac32))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 10607338-944e-40c4-93be-08d5cff94f2a))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 3b7112c0-448a-4b70-bfb1-37fcbb1ba364))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp b0b1d7ea-cd7f-4bf3-9ff9-d7140fea2b53))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp f24f0769-6d8b-49c6-ac8a-488c2316e711))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp aeaf91dc-35d2-4003-a013-b3eb4374aa1e))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp c72ef33e-c5b9-495a-9176-86d0183ee424))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp c89259c7-d5c9-4825-bf9c-2014b5194ca5))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp db3ea27d-4646-4cb4-a79b-1d6701115c62))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 0e9d786a-5b09-484f-a869-c1ba9ce32f30))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp fd66c6af-27ba-4e56-9113-531f6e7f77bb))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 5ffc3c02-65b0-4232-9edb-62162c127c4e)
    (at 196.5 83.2)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/ebdddcbf-6f90-4c06-b551-ef3582c8a5aa")
    (attr smd)
    (fp_text reference "C812" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6e726b12-af9d-4046-ae20-b5f10568120e)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp d3a925fb-59de-43dd-8f0d-d49621dad760)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 2911f42b-2b76-4cd9-ab80-d8ab53bde4bf)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp b14cb837-a21c-4b99-8203-890374b63648))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp df0d07cf-1325-426f-a503-b814a360280c))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 2c43e2a1-bf74-400e-a093-23740b5a7d65))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 5c8f9c8d-ab44-4b2a-ab58-75e81a5af360))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 6835d6e2-8c03-4c1b-9449-91ce0e7178d5))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp c03697bb-aa0e-4210-8d22-fd63f891eb83))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 231bf1a3-d861-4ae8-824d-025fe7e86f7f))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 252142e0-d908-4119-bf0b-1ec4e3832826))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 49f4f657-eb3a-4722-aae1-4e1e88785d65))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 93bc776b-d6e3-4ba2-b507-53fb8bdd0d26))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 4f1a5dd5-efe5-48f5-b2b8-00cc237ce7cc))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 7f0a572e-76de-4553-9f21-089b85629605))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 64b7b4da-de35-4714-8eab-4cf2c6ff3a2b)
    (at 190 81.5)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/9e26e534-3dba-489a-8e4f-cca6039bae2e")
    (attr smd)
    (fp_text reference "C807" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 1ca6326c-af18-49f6-836d-f23719b5e841)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp c925819c-6d96-4ea4-b81d-e6008722bb02)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 99547e5c-92e6-4fff-a8de-6b5eecb799f5)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 01c3c264-b870-4dfc-a766-016a3a92a320))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 54462d6c-0259-45d1-9809-f1bee19a0ed6))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 036f67a5-b46d-4ee1-8463-c441525fea9a))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp d99d3d99-5d9d-40fa-a4d7-7e4cdaa69782))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp f2b89f78-2a7e-4989-a385-bdece863f89b))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp f64c8d4f-2874-4bac-99a0-f1f23a26220e))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 01bdc53e-b1c1-46b7-9647-beceaa905dba))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 0f988dd3-7225-4568-a707-bfd5a3341a6b))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp d0fb315c-8289-4b47-b7c4-b8389797e995))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp fd1b8343-4285-426f-a63a-1cb12afa40fb))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 714c5241-c573-4116-a673-f8c4954c956a))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 43720045-8af1-4ec1-9777-52d2f28d4755))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 75b6d0b3-bb63-4d8b-89b3-57c09bb7d0bd)
    (at 195 62.4)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/ebdddcbf-6f90-4c06-b551-ef3582c8a5aa")
    (attr smd)
    (fp_text reference "C612" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 554728e0-0d35-40da-a5f6-bb0260c8663b)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 73c09113-e7fd-4e75-8043-2cf65a3eb510)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp d0e7977d-448e-47a3-8efb-20d202c9d34d)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 1bc59799-9d63-44e7-898c-b55900ebac3b))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 8534b5b9-badf-4fb7-97f0-5ef8c6883164))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 22d26c59-aed5-4a77-a5c1-a97640a6fc73))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 3ecaab3f-7750-4740-8c2a-8f65e9864fce))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp b1390a96-9a7e-4a44-99de-f927a2865c3e))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp c606810b-b416-4743-a574-f760f8177498))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 2940997a-3270-4d2b-92df-77a2cffc6071))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 35f47c35-438f-4934-8614-bf097d6c217c))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp b4ae6b5d-654d-4caa-98f1-9a68b9596307))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp db7958b7-cbae-47c0-9bac-19c166a801fc))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp b8dc66f2-a769-4824-8690-6e81c358c44c))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 49c77f64-62df-4c7d-9455-9e62a7db22de))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 8307b4e1-388e-46c8-b07e-ae03ae6a6632)
    (at 189.2 101.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/9e26e534-3dba-489a-8e4f-cca6039bae2e")
    (attr smd)
    (fp_text reference "C1407" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 26b3d28b-be02-4421-b9af-718553c5267b)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp ce044285-385a-45c2-98ff-baa479b3479f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 008345e3-9177-4eb4-8454-701626604d14)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 3da57e09-e86c-4a06-9f88-c770289e0e3a))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 480562f7-aa5c-4608-95a4-1e6a2c030b9a))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 690cec8f-9fe0-4cde-ba9c-018e6c8a85d4))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 77df6111-d112-45ac-b887-9bd6d60c52a1))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp e2629c78-7fae-460c-a75c-a19d8e2d2fc1))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp e6e7b603-48b7-473f-8148-0f2383f788c2))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 94dbb677-2ff8-4e88-b7b6-330f81d2aaf4))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp ae85b687-3390-4ad2-8d0f-6e6cff60443b))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp bbbbd7ab-d235-46ba-8771-e177823ce5ba))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp df02d887-3e6a-4f73-b590-a9aa78e453b7))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp b7707f54-ac70-4469-a62b-26493d44fa63))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 5ee20931-dc66-45d0-99e7-d0544870b347))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 8d62f923-2a11-4fe1-bc62-4683520a9d0c)
    (at 190 83.2)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/8ffbe9b4-2e1e-43a7-b489-5a21c5a8afad")
    (attr smd)
    (fp_text reference "C802" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp efd042c4-af29-4055-bb04-77732220ceaf)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 91c5143f-0f1d-4a90-a677-c1c20bc4b857)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp b475d845-6617-4e96-a34b-d530ec31628c)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 4899789c-a3e7-4183-bebc-ea87207c33b6))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 98787f88-d372-49fe-bcb5-f9d16c01f263))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 4411e118-d707-4511-a549-c566ba13cf9f))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 48e480d2-d99f-4e15-a100-55eb60db95e5))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 4aa4d07d-7775-4572-92bb-1c9f8d2bcac3))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp f064009e-d0d4-491d-898a-9ee439c88783))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 0568adb2-9117-490b-bc88-9ca0524104aa))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 16a649d4-c184-480e-b46b-b520a9212eb9))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp b6ee3a6a-d69a-4170-9dbe-694b3a24ef05))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp dba24de6-134a-4a46-bb36-e9e9480119ad))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 7684654f-410e-4f81-9a6c-a57946887fb2))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp aacd939c-0d6a-493f-b625-74e884903354))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 8fec1d18-8866-4ec5-9f28-93bfb7812239)
    (at 195.9 107.5 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/9c65710d-18cb-411f-a58b-3d0a7fb65668")
    (attr smd)
    (fp_text reference "C1416" (at -4.4 0.1) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp e155ac51-e4c6-46c4-82d5-b561fdde1f98)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 2efaaebc-d54b-4a5c-a277-22568425c460)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 11278618-02c2-4691-8841-d537c0280509)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 252241b8-0f20-4b2f-a93d-af4789a3097d))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 6ad57384-7cf6-4e82-9c34-8c69e3fbc06a))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 083ac9b0-f8b9-4ae2-a9a0-80c39d0bd530))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 0a61bbe5-6561-464b-9962-c722bdcee30a))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 1764fc60-8388-4af9-ae8d-dfd6c4fbb468))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp f67bf476-35fc-4107-97ba-8542902eee0c))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 4fd6b373-7bdc-46db-8524-d9b514052e82))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp a0e9928d-9606-4b09-abeb-c89d3ef53874))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp ba9c90f1-1638-4a96-9f2a-f79a174143ef))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp dfacabf2-e952-4286-885e-88f694286dbe))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 277bb62b-8a93-45d3-96ee-362ed08fa3b6))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 51 "/samplers/LVDS Serializer 4/+3V3_A") (pintype "passive") (tstamp 5af0ab20-0086-4a85-b8a7-62e56e8905a0))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp 9db95f47-b744-4b67-a2a5-1bb2aec39b6d)
    (at 195.4625 45.8 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/9c65710d-18cb-411f-a58b-3d0a7fb65668")
    (attr smd)
    (fp_text reference "C416" (at -4.4 0.1) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 468b9b89-4864-4f0b-bc6e-75e790c1a0ee)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp f085cb44-8764-4ea8-850f-b7616488fe5f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 85ca6a0d-7db2-464d-9086-8f639310c93c)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 63dc4b5a-9c97-411c-b129-d68753049657))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 9bed8d1c-ab7b-426e-9a35-095d89d15312))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 52d0e0af-1691-4b55-91fc-78dc8014d048))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 9f5385a6-cf5e-449f-87fa-eb1ee4d02717))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp c4c3bc08-4e7a-4138-aae2-43a069aa2cd4))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp c89bfc90-89be-4622-85a4-3f4119f13638))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 073ad50b-97d6-4e08-9e53-5a3b0a2c5ecc))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 613d7e29-78b6-42dc-b625-9f1e7b226d47))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp c1720d71-f03d-4f7b-acfe-5725fe69f297))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp eadac83c-ec94-48dc-9907-299e8d3de179))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 1f896353-93c9-4480-ab11-4ae5f536ba58))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp 8f1129ab-97a6-41ac-bad0-a88f3ad2a405))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp ac4a40a6-b989-4f7b-9da8-301594ba0a3d)
    (at 196.7 85.1 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/1941a529-e2bf-45a9-9695-f073e95c413f")
    (attr smd)
    (fp_text reference "C811" (at -4.4 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp ed049993-addd-47d5-ab40-8da535f4cb6d)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp acdd6f96-5519-4cba-920a-962ae5a2412c)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp f369df92-077f-41de-9316-912e94e79ee7)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 14095458-90c4-48d4-84af-7c29b245ef90))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp d9c08fad-0901-4062-99e2-7226079f4486))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 5e742317-ab2b-422e-af3b-fd63b63a42d1))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp b3509998-36a1-4fc0-bbd8-1c7655f473bf))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp ef3c6b78-15d6-4275-ab2f-72ad3481ab65))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp fbbfc7f7-e843-40a7-97f5-44d0454cc759))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 285ac0a0-cb77-4ea5-a006-780a060ef9b1))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 33e34884-61f6-477a-991d-6d5d1479aa0d))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 59636d59-e487-4513-9b8a-99859a2b0384))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 8d30ddf7-6a39-4a69-b45d-fac1a1ddb4ee))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 874538ba-a18b-4c70-b090-67a99204ecc0))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp cb08fc00-f0fb-4fce-ab2b-df17acad27ce))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp b0b6d822-7706-4f1f-b03a-0de494a46c52)
    (at 196.7 87.3 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/9c65710d-18cb-411f-a58b-3d0a7fb65668")
    (attr smd)
    (fp_text reference "C816" (at -4.4 0.1) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp bdc4c4db-7499-4368-8b26-022990babd53)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 54bc4bcf-38aa-4d9c-9e77-3cc20782efdb)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 87543d37-b8c1-444d-8f00-5ea04ce0b9c1)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 495fcc27-fa71-4225-aad5-d4bd3f3a2cea))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp f5dc3c3d-ade3-4da2-b02d-790d75ca1c4c))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 2ea51ca3-ebe9-4274-b10a-57473fd61ca4))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 516509ba-0098-4e4c-beaa-047c72477b34))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp baf6ae83-c331-440e-9125-9b111caea968))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp f7458987-046f-439b-8ed9-7180abc2f5cd))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 8cff28f2-4d53-461e-a3f8-8f26efc1929d))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 9b315bc2-1e1c-4091-bca0-a971675394a5))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp b508dde8-f608-4b52-a749-8b522eed6d76))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp f90ca0c0-4b66-428b-95c9-393504f04cab))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 5a7d1d43-c993-48b1-8a78-fb3e79f3f701))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 62500891-70d4-4098-83b7-c5ec363c1ad5))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp b113ef78-3f9d-4e16-9566-18ecbeb7c094)
    (at 190.2 85.09 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/260a300c-d35c-4903-9853-493168f9a991")
    (attr smd)
    (fp_text reference "C806" (at 4.5 -0.01) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp c479eb9d-36e5-4589-ae2c-9ae317ac6e30)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp e1905fc5-8b06-487a-b4e3-f5b16e3b5c1b)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 58cc5270-ce80-4385-af37-73216f4234b0)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 89a4df65-e87f-40a7-859a-dfb4e2f64198))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp b6d09145-0048-4ab6-861a-64210eaa48ec))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 2aa78bdf-1a9e-4f1f-9788-cca7cdcdd5f5))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 2bca09a1-6879-447d-89a6-6a9c87a61b3f))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 3a1eb345-4781-42b8-aa38-428538ef91e7))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 61e9d33c-5487-40e3-9345-a6c1b40913fe))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 58b52214-6693-4de3-a429-7fe5f74a6aed))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 85337e02-ea1a-43bd-be02-5b09303445df))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp a8d8688f-611a-46d0-8bdc-d545c5fc28b2))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp d6e0d32e-ced0-42b5-a94d-1134f14f76f6))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 199762b2-b7cb-44d7-94b8-a717aaade84c))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp ed7a95c1-9e96-4a2e-9577-e77ff15f5f91))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp b2d3c83a-a068-44ad-a8d9-f206334ac852)
    (at 189.2 103.4)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 4")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/1ff317eb-6813-47bf-b5f8-208a01323d5f/8ffbe9b4-2e1e-43a7-b489-5a21c5a8afad")
    (attr smd)
    (fp_text reference "C1402" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp dd74717f-0185-4688-ab2b-9b4e2036e885)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 8d3aaf9e-74ad-48fe-8c04-71d35a0e2fa2)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 3cbb68b3-9cba-4854-b548-4d78f829cdc1)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 51e66d69-2436-4e76-a79a-74f2e1a9e9a2))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp fab7caae-9f5d-4663-9cf6-4fe605b65945))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 1ded1b3c-c7d7-45a6-8be2-b77e9f9ca426))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 739da156-bcb3-4c4c-9360-70123318ba6b))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp b0b9f929-35b2-4fca-a898-07339cc48bd9))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp f856a76d-210d-4cda-8f49-253008fe9399))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 64fbb5cf-9c81-4509-8f6a-ba9bec0b13fb))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp b84dd7d0-a437-4e28-9cb6-ef3a2c941bde))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp baa97039-d13d-4013-b51f-c8f16231d742))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp cef68975-61ed-43a4-a215-730b3e98278e))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp e17b8f34-f15f-4027-bb24-ee743a61927a))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 29ec3f30-8d57-4b6d-90e4-518ee3e0c91c))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp b539c8ef-2338-4f57-bfe0-88e4ecdc1aec)
    (at 190.2 87.2 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/00e46d39-6f2c-40ca-b6ce-62f43b6eea38")
    (attr smd)
    (fp_text reference "C801" (at 4.5 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 49ad6a15-3dc7-4f94-a0d2-cd0df2032d20)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 875cdce0-a842-4c0a-9001-1fbb1825cc28)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 9ce9e26a-5aea-42ea-9eeb-b3245463ff1f)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 12fe755e-3658-4b4a-8da7-f1b04bec84f6))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 24b4c07c-3c75-47bd-8616-12193ee43b83))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 14e0b2af-5b68-4ac1-8476-8c8032d787e1))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp a3623373-3e93-4d99-9ed7-428bba5057de))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp aa729578-872c-47c3-badb-a5c796bb596d))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp bae98980-7e91-400b-895d-7591fb04eefe))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 194dd6f6-e2a6-480a-817d-78deab83654b))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 1d4e5cb3-8566-45cf-9752-18bf2818ac02))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 793b6332-331e-4cad-907a-d70442f85574))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp ab20a7d1-e6c2-4912-8fd3-5b36639bc34d))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 1c02a45e-ffa7-483d-aad7-5f32fefa759a))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 8dbcf280-06c8-4885-80f7-989bd34e1542))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp caf544e5-225d-4640-8228-c22cb87a9b3f)
    (at 195.2625 40)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/b8173e5b-3247-4073-b968-f97dff8e75a6")
    (attr smd)
    (fp_text reference "C417" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 851817d6-941f-49c3-9491-c8f17c4fd382)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 5c231f53-5e32-4577-8837-7df1d3508ac1)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp fb28c13a-a683-4e7d-a739-d6ab696881bd)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 3b0ce732-f512-4261-b741-fee22af43f07))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp fc6f0d95-35f9-4727-adf4-c2adcb5409ff))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 21c4588a-5c29-4768-b9e6-675ee602a25c))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 8690bdd1-04f7-47a7-82c0-cc410716e389))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 958b7733-89c6-417f-bc75-9061b145922a))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp ea415276-d879-42ff-bb77-8942aa6f6a91))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 123c51cf-800e-47bf-9ce2-4db8ea2381e9))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp ad1af46d-7681-4d0b-bb37-ac38bee21851))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp b1fd470d-aeb5-4c04-a0a9-712d7e5b74be))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp ca8aad2c-c86d-41e4-acca-81774656fa92))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp 91748dc5-b2a6-475a-9f23-17feca9e7c07))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 36531271-6abf-41dc-bea1-06c3a3dc056f))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp dcf9e7d0-3288-4b63-897f-19e2454fdecf)
    (at 188.7625 40)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/9e26e534-3dba-489a-8e4f-cca6039bae2e")
    (attr smd)
    (fp_text reference "C407" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp ef6f2aad-f29b-4df7-875e-7e6a4f157912)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 72ce5dd7-b322-4fa8-82c3-a15457c56974)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 9fb82a62-afa0-490f-a238-bd0aaa8cae6c)
    )
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp 92b9e321-46eb-4e25-b441-44de1d12af7f))
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp dda3b572-d70b-40de-8369-42f8ef3758ba))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 603d0baf-7821-4fa0-b47b-14b79dae7540))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 6efc6986-5406-484f-97d7-b8e5ed8003af))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp b9bd9635-42c8-423d-91d3-c72fed0980ae))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp e062ab34-ec5e-4ebd-8f26-e5cf5f60f6f0))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 39ef455b-9b9f-43ec-b226-5d7b238a657f))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 4b418e1f-cefc-4a33-9582-1e3df5304b7b))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 64895659-13e6-4a40-a1ed-51dfd3898796))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp a7ba3d09-0c88-4bfb-adcc-a6f27ac9be20))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp 4999f816-f998-48c5-932b-21e5f73f8790))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 0d6037e4-29ee-429c-a075-083a861cebb2))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp dd2ac9fd-518e-4f2d-b491-9bac67d9dff1)
    (at 195.2625 41.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/ebdddcbf-6f90-4c06-b551-ef3582c8a5aa")
    (attr smd)
    (fp_text reference "C412" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 02584c07-8843-4cd2-8eb6-db0717e17297)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 9bf7f881-2f16-47c6-92a5-1457396ffd69)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 117304d8-849f-4013-9e0b-57f2a716a297)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp f82e2bb0-988d-4cc5-ab5d-7aaa0b4784eb))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp fd939c80-4033-4472-94db-60aa70b9f73b))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 03a41d62-df69-46b9-9395-c32ea51f4068))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 2c1d06bf-5fe5-4880-b3e7-6c609b56a409))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp a121ecf1-1aa4-4d1b-b24d-c8da172342af))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp ea6de8e3-dddb-43de-9dc8-c5893785caa2))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 0f8f0bc3-f701-4a4b-b698-ef5efd0c313e))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 20356b67-bf72-45e3-8c29-7ac542f92cb2))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 23e942e4-885f-4aa2-8e98-2866791ae719))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp a85fb584-dbcc-47a1-ac7e-b02f55ba980e))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 36 "/samplers/LVDS Serializer 1/+3V3_A") (pintype "passive") (tstamp dbb1cb96-b8ed-4671-9784-20da9c3f3d67))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 18223898-749a-4a4e-8ad5-b9d9b3288591))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x07_P2.54mm_Horizontal" (layer "B.Cu")
    (tedit 59FED5CB) (tstamp ddbcc810-786e-466a-8c73-449b02305493)
    (at 147.675 48.075 180)
    (descr "Through hole angled pin header, 1x07, 2.54mm pitch, 6mm pin length, single row")
    (tags "Through hole angled pin header THT 1x07 2.54mm single row")
    (property "DPN" "2057-PH1RB-07-UA-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "PH1RB-07-UA")
    (property "Manufacturer" "Adam Tech")
    (property "Sheetfile" "pmod.kicad_sch")
    (property "Sheetname" "")
    (path "/9f68750c-6f8f-4055-ad66-ff879c2862c5")
    (attr through_hole)
    (fp_text reference "J101" (at 4.385 2.27) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 9383ba23-9cef-4baa-8e20-647c827c49f6)
    )
    (fp_text value "Conn_01x07_Male" (at 4.385 -17.51) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 2a7eee7d-92fa-40ee-b651-f295b26a61dc)
    )
    (fp_text user "${REFERENCE}" (at 2.77 -7.62 90) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 45975d27-701f-48ba-972d-95c887e801a0)
    )
    (fp_line (start 1.042929 -12.32) (end 1.44 -12.32) (layer "B.SilkS") (width 0.12) (tstamp 00fd628d-a762-4368-9e58-ca8aeeced35a))
    (fp_line (start 1.042929 -5.46) (end 1.44 -5.46) (layer "B.SilkS") (width 0.12) (tstamp 03511373-3e8b-4c17-a279-8497056a6f48))
    (fp_line (start 4.1 -9.78) (end 10.1 -9.78) (layer "B.SilkS") (width 0.12) (tstamp 08c82efb-84e5-4617-848b-ed87acad6bdd))
    (fp_line (start 1.042929 -2.16) (end 1.44 -2.16) (layer "B.SilkS") (width 0.12) (tstamp 1041dbf1-50d4-462e-bd68-c26d1dafb2bd))
    (fp_line (start 1.042929 -8) (end 1.44 -8) (layer "B.SilkS") (width 0.12) (tstamp 1181758f-d9dd-4782-981f-16d8d3634ca0))
    (fp_line (start 10.1 -15.62) (end 4.1 -15.62) (layer "B.SilkS") (width 0.12) (tstamp 13ed1d64-d18f-4271-978c-2597a74bb574))
    (fp_line (start 1.042929 -7.24) (end 1.44 -7.24) (layer "B.SilkS") (width 0.12) (tstamp 1845b030-f6c4-45bd-8b0a-99da9ebe7f99))
    (fp_line (start 1.44 -3.81) (end 4.1 -3.81) (layer "B.SilkS") (width 0.12) (tstamp 1b5b4919-356b-48a7-a2a1-4b94ce966f49))
    (fp_line (start 1.44 -16.57) (end 4.1 -16.57) (layer "B.SilkS") (width 0.12) (tstamp 1fae4b8f-17a3-4058-8227-bd30b207cd46))
    (fp_line (start 1.042929 -10.54) (end 1.44 -10.54) (layer "B.SilkS") (width 0.12) (tstamp 206cbdb6-d1ec-41bd-829c-ccc6a8e787d6))
    (fp_line (start 10.1 -5.46) (end 4.1 -5.46) (layer "B.SilkS") (width 0.12) (tstamp 22af5a35-6bdd-4ff0-9b81-a6fc7da1a000))
    (fp_line (start 1.44 -13.97) (end 4.1 -13.97) (layer "B.SilkS") (width 0.12) (tstamp 44744c9d-42ae-4327-b861-de79434c66df))
    (fp_line (start 10.1 -12.32) (end 10.1 -13.08) (layer "B.SilkS") (width 0.12) (tstamp 44cd88b0-6b8c-4095-963b-cbaf7faf7e0a))
    (fp_line (start 1.44 1.33) (end 1.44 -16.57) (layer "B.SilkS") (width 0.12) (tstamp 4ecf562c-c5ae-42db-8fb4-2e69a0e32d38))
    (fp_line (start 1.44 -11.43) (end 4.1 -11.43) (layer "B.SilkS") (width 0.12) (tstamp 50e54866-a5db-4b84-8bd7-13f3a5bf15a8))
    (fp_line (start 4.1 -16.57) (end 4.1 1.33) (layer "B.SilkS") (width 0.12) (tstamp 5685be04-8c3a-41c6-a528-7a8439a24f1b))
    (fp_line (start 4.1 -0.28) (end 10.1 -0.28) (layer "B.SilkS") (width 0.12) (tstamp 5a3085ea-b384-4eb5-9581-c38384e237ad))
    (fp_line (start 10.1 -2.16) (end 10.1 -2.92) (layer "B.SilkS") (width 0.12) (tstamp 61591e23-4729-456b-aaff-7d2dc122f5cd))
    (fp_line (start 4.1 -4.7) (end 10.1 -4.7) (layer "B.SilkS") (width 0.12) (tstamp 79f9f748-7633-4669-a1b5-b831d0e58631))
    (fp_line (start 10.1 -7.24) (end 10.1 -8) (layer "B.SilkS") (width 0.12) (tstamp 7e0f6357-6b68-4e57-80a1-ea66220f3465))
    (fp_line (start 4.1 0.08) (end 10.1 0.08) (layer "B.SilkS") (width 0.12) (tstamp 81f369e0-d0b2-4129-8e0c-0f8a34bc4e72))
    (fp_line (start 1.11 0.38) (end 1.44 0.38) (layer "B.SilkS") (width 0.12) (tstamp 8596072d-718f-46f0-a04b-43a9a90b52dd))
    (fp_line (start 1.042929 -2.92) (end 1.44 -2.92) (layer "B.SilkS") (width 0.12) (tstamp 8f2139ea-0417-4adb-b16c-cdf9ba9be46e))
    (fp_line (start 10.1 -14.86) (end 10.1 -15.62) (layer "B.SilkS") (width 0.12) (tstamp 8f9d730e-099c-4b94-835b-e141ff851c36))
    (fp_line (start 4.1 0.2) (end 10.1 0.2) (layer "B.SilkS") (width 0.12) (tstamp 90e243e4-f847-4926-b831-3042d04fe845))
    (fp_line (start 4.1 0.32) (end 10.1 0.32) (layer "B.SilkS") (width 0.12) (tstamp 919cac58-a4a2-473d-8f0e-5caec8df7924))
    (fp_line (start 4.1 -7.24) (end 10.1 -7.24) (layer "B.SilkS") (width 0.12) (tstamp 97423597-6949-45ee-9bd7-5df5ece02ec2))
    (fp_line (start 1.042929 -4.7) (end 1.44 -4.7) (layer "B.SilkS") (width 0.12) (tstamp 97fdbaec-36ab-443f-b925-6f34f42398b9))
    (fp_line (start -1.27 1.27) (end 0 1.27) (layer "B.SilkS") (width 0.12) (tstamp 9c5a3f41-39c3-44be-b0cc-d76819035a8a))
    (fp_line (start 10.1 0.38) (end 10.1 -0.38) (layer "B.SilkS") (width 0.12) (tstamp a005e4e9-f987-47fd-a91a-8071e700f31e))
    (fp_line (start 10.1 -13.08) (end 4.1 -13.08) (layer "B.SilkS") (width 0.12) (tstamp a056b3fe-2c7d-42e4-825c-fdd5e1977494))
    (fp_line (start 4.1 1.33) (end 1.44 1.33) (layer "B.SilkS") (width 0.12) (tstamp a463ec68-c360-494b-96ea-5ecb3a9c23a2))
    (fp_line (start 10.1 -0.38) (end 4.1 -0.38) (layer "B.SilkS") (width 0.12) (tstamp a633d8a0-ab3e-484b-b3ec-d187418819df))
    (fp_line (start 1.042929 -13.08) (end 1.44 -13.08) (layer "B.SilkS") (width 0.12) (tstamp a6b17535-40c6-4869-8ea6-03e70e8e5320))
    (fp_line (start 1.042929 -15.62) (end 1.44 -15.62) (layer "B.SilkS") (width 0.12) (tstamp abe3c2b1-5bb0-4c46-891d-71b0a7811ac9))
    (fp_line (start 10.1 -2.92) (end 4.1 -2.92) (layer "B.SilkS") (width 0.12) (tstamp ad3abc83-25db-46c6-b995-c4be3e2600d1))
    (fp_line (start 1.44 -1.27) (end 4.1 -1.27) (layer "B.SilkS") (width 0.12) (tstamp b025b06e-3d12-45de-8525-d7925dac1d47))
    (fp_line (start -1.27 0) (end -1.27 1.27) (layer "B.SilkS") (width 0.12) (tstamp b16f4a17-8678-475c-8ed9-a911c530d6fa))
    (fp_line (start 4.1 -12.32) (end 10.1 -12.32) (layer "B.SilkS") (width 0.12) (tstamp b61dd8a7-a6a6-46a0-a9e5-b9f1dfa904e0))
    (fp_line (start 1.44 -6.35) (end 4.1 -6.35) (layer "B.SilkS") (width 0.12) (tstamp b622cec3-5752-436d-bff9-0ca6a3c8f425))
    (fp_line (start 10.1 -10.54) (end 4.1 -10.54) (layer "B.SilkS") (width 0.12) (tstamp b6af4563-9ec0-4abe-9ea1-d8ec542d0a40))
    (fp_line (start 4.1 -0.04) (end 10.1 -0.04) (layer "B.SilkS") (width 0.12) (tstamp bc56d688-7103-4ee3-bb06-dd5f8e03da33))
    (fp_line (start 1.042929 -9.78) (end 1.44 -9.78) (layer "B.SilkS") (width 0.12) (tstamp bd3edec3-558a-4cd8-85dc-43e7fa4149a8))
    (fp_line (start 10.1 -8) (end 4.1 -8) (layer "B.SilkS") (width 0.12) (tstamp ce1f8d99-03e0-459c-acf9-a3fc96330a01))
    (fp_line (start 10.1 -4.7) (end 10.1 -5.46) (layer "B.SilkS") (width 0.12) (tstamp db37684b-f0db-4a08-a5ac-a68c44a25225))
    (fp_line (start 4.1 -0.16) (end 10.1 -0.16) (layer "B.SilkS") (width 0.12) (tstamp df3f1b3f-384f-48ac-908a-30c22aa0ce9c))
    (fp_line (start 1.11 -0.38) (end 1.44 -0.38) (layer "B.SilkS") (width 0.12) (tstamp e40cfcb3-75c3-4e35-ba38-0a3eedd87cd4))
    (fp_line (start 4.1 0.38) (end 10.1 0.38) (layer "B.SilkS") (width 0.12) (tstamp e482aaa2-1b6b-4ac7-94da-72668d808f15))
    (fp_line (start 1.44 -8.89) (end 4.1 -8.89) (layer "B.SilkS") (width 0.12) (tstamp e6efc9f6-a9a5-4dc1-b3bd-8ad20117c719))
    (fp_line (start 1.042929 -14.86) (end 1.44 -14.86) (layer "B.SilkS") (width 0.12) (tstamp ec75dda0-3a17-4a98-bdbd-3075a105bb76))
    (fp_line (start 10.1 -9.78) (end 10.1 -10.54) (layer "B.SilkS") (width 0.12) (tstamp f56837b2-77d3-46de-bb53-2be0c1cfa8c9))
    (fp_line (start 4.1 -2.16) (end 10.1 -2.16) (layer "B.SilkS") (width 0.12) (tstamp f858fa2e-3f58-42b9-9d14-928c1837f98c))
    (fp_line (start 4.1 -14.86) (end 10.1 -14.86) (layer "B.SilkS") (width 0.12) (tstamp fea7d153-5878-43d7-ad3f-05ffea2d980e))
    (fp_line (start 10.55 1.8) (end -1.8 1.8) (layer "B.CrtYd") (width 0.05) (tstamp 041d2c1c-0489-4e93-a89b-27afb53729ab))
    (fp_line (start -1.8 1.8) (end -1.8 -17.05) (layer "B.CrtYd") (width 0.05) (tstamp 91e6ea0f-0e4b-49e5-9dcc-8c8c9eb1e092))
    (fp_line (start -1.8 -17.05) (end 10.55 -17.05) (layer "B.CrtYd") (width 0.05) (tstamp 96b06921-0ab1-428b-8dcd-19a57c118beb))
    (fp_line (start 10.55 -17.05) (end 10.55 1.8) (layer "B.CrtYd") (width 0.05) (tstamp b78f97b9-1dce-4060-9015-032438080133))
    (fp_line (start -0.32 -0.32) (end 1.5 -0.32) (layer "B.Fab") (width 0.1) (tstamp 00644f41-8d4f-43f4-ab67-2d12bc9cd754))
    (fp_line (start -0.32 -12.38) (end -0.32 -13.02) (layer "B.Fab") (width 0.1) (tstamp 01960743-b67a-4e29-be78-6e8fe67c18c3))
    (fp_line (start 10.04 -4.76) (end 10.04 -5.4) (layer "B.Fab") (width 0.1) (tstamp 020f4900-3ab1-45fa-afda-b80493eaf81f))
    (fp_line (start 4.04 -16.51) (end 1.5 -16.51) (layer "B.Fab") (width 0.1) (tstamp 0490c683-4362-47b6-a1be-3f519e745daa))
    (fp_line (start -0.32 -7.3) (end 1.5 -7.3) (layer "B.Fab") (width 0.1) (tstamp 0a25e67a-8879-4d95-bd1e-6c7835c4a988))
    (fp_line (start 1.5 -16.51) (end 1.5 0.635) (layer "B.Fab") (width 0.1) (tstamp 1683bfcc-4bae-4d7a-96d8-f549d20d145b))
    (fp_line (start 4.04 -12.38) (end 10.04 -12.38) (layer "B.Fab") (width 0.1) (tstamp 18b6d4f0-1b6e-4a60-abe9-89f3a09f0b35))
    (fp_line (start 4.04 1.27) (end 4.04 -16.51) (layer "B.Fab") (width 0.1) (tstamp 2ebdb667-faf1-46c0-94e7-5fca23e4d3b1))
    (fp_line (start 4.04 -2.86) (end 10.04 -2.86) (layer "B.Fab") (width 0.1) (tstamp 30a57bc7-c670-462b-b5e5-52d9d0fa5906))
    (fp_line (start 4.04 -7.94) (end 10.04 -7.94) (layer "B.Fab") (width 0.1) (tstamp 32a3c7e2-7abe-4171-bc31-a772475e8342))
    (fp_line (start -0.32 -14.92) (end -0.32 -15.56) (layer "B.Fab") (width 0.1) (tstamp 398d7128-deb6-45a4-890d-40cd1b68a08d))
    (fp_line (start 4.04 -5.4) (end 10.04 -5.4) (layer "B.Fab") (width 0.1) (tstamp 3c1c105b-a09f-47c0-9257-2af050ed5aed))
    (fp_line (start 2.135 1.27) (end 4.04 1.27) (layer "B.Fab") (width 0.1) (tstamp 4561b13d-5add-4716-9feb-f2f4a7abf28b))
    (fp_line (start -0.32 -14.92) (end 1.5 -14.92) (layer "B.Fab") (width 0.1) (tstamp 478391e7-8f5e-465d-bd14-24e2f94157f4))
    (fp_line (start -0.32 -4.76) (end -0.32 -5.4) (layer "B.Fab") (width 0.1) (tstamp 490d8f37-92e9-496d-b7dc-7467eaeef9b1))
    (fp_line (start 4.04 -14.92) (end 10.04 -14.92) (layer "B.Fab") (width 0.1) (tstamp 4c096f0d-526e-4d2c-947e-56cb580e6f88))
    (fp_line (start 4.04 -4.76) (end 10.04 -4.76) (layer "B.Fab") (width 0.1) (tstamp 6163649c-ac9d-4fe6-8e24-27a571b97a08))
    (fp_line (start 4.04 -10.48) (end 10.04 -10.48) (layer "B.Fab") (width 0.1) (tstamp 63fe2bfa-95ee-4143-ab38-a8efd69517c2))
    (fp_line (start -0.32 -5.4) (end 1.5 -5.4) (layer "B.Fab") (width 0.1) (tstamp 75b19f0a-61d1-4cb8-8e39-62c0009573fb))
    (fp_line (start 4.04 -0.32) (end 10.04 -0.32) (layer "B.Fab") (width 0.1) (tstamp 825e2145-1407-4e0b-af86-08d67a63b279))
    (fp_line (start 4.04 0.32) (end 10.04 0.32) (layer "B.Fab") (width 0.1) (tstamp 8c82fd94-b7ef-4f15-92c0-a00faea28203))
    (fp_line (start -0.32 -15.56) (end 1.5 -15.56) (layer "B.Fab") (width 0.1) (tstamp 932d4fcb-002a-4eff-a343-73157ade6d52))
    (fp_line (start 10.04 -14.92) (end 10.04 -15.56) (layer "B.Fab") (width 0.1) (tstamp a0f7e36b-90db-4cda-86a3-6967679226b1))
    (fp_line (start 10.04 -2.22) (end 10.04 -2.86) (layer "B.Fab") (width 0.1) (tstamp a44bb56f-3650-4a75-a430-c313def4bc4b))
    (fp_line (start -0.32 -9.84) (end 1.5 -9.84) (layer "B.Fab") (width 0.1) (tstamp a784d571-3b67-4e19-8a5d-4759fdc6631c))
    (fp_line (start -0.32 -10.48) (end 1.5 -10.48) (layer "B.Fab") (width 0.1) (tstamp b18613fd-0e31-485e-8616-8b8b2deccb77))
    (fp_line (start 1.5 0.635) (end 2.135 1.27) (layer "B.Fab") (width 0.1) (tstamp b2f6c2eb-2dcc-42ec-b181-107a11f31743))
    (fp_line (start -0.32 -2.22) (end 1.5 -2.22) (layer "B.Fab") (width 0.1) (tstamp b333767d-c0f7-4b6e-af54-18bc91801c40))
    (fp_line (start 4.04 -2.22) (end 10.04 -2.22) (layer "B.Fab") (width 0.1) (tstamp b5be8585-e702-4b08-b7b5-8e02cb84821a))
    (fp_line (start 10.04 0.32) (end 10.04 -0.32) (layer "B.Fab") (width 0.1) (tstamp b8d1532c-4a5d-421a-85ec-1a264ee19d97))
    (fp_line (start 4.04 -9.84) (end 10.04 -9.84) (layer "B.Fab") (width 0.1) (tstamp be7da014-1769-4461-b87f-2006356ee3b2))
    (fp_line (start 4.04 -7.3) (end 10.04 -7.3) (layer "B.Fab") (width 0.1) (tstamp bfe40aab-68ad-4cf1-bc19-680b2d5834c3))
    (fp_line (start -0.32 -2.22) (end -0.32 -2.86) (layer "B.Fab") (width 0.1) (tstamp c1d8a03c-662d-46bd-8cb6-76a94d88bd66))
    (fp_line (start 4.04 -15.56) (end 10.04 -15.56) (layer "B.Fab") (width 0.1) (tstamp c338e6ee-6bcd-4855-9f5b-80b5825a2c3c))
    (fp_line (start -0.32 -7.3) (end -0.32 -7.94) (layer "B.Fab") (width 0.1) (tstamp c7e87bf4-4935-4bca-8aca-88b6d03e5a3d))
    (fp_line (start 10.04 -12.38) (end 10.04 -13.02) (layer "B.Fab") (width 0.1) (tstamp d0d38f03-a07f-430c-b4e4-6daabb499043))
    (fp_line (start -0.32 -12.38) (end 1.5 -12.38) (layer "B.Fab") (width 0.1) (tstamp d0dabccf-a27f-44ab-be7a-5ffc44019491))
    (fp_line (start -0.32 -2.86) (end 1.5 -2.86) (layer "B.Fab") (width 0.1) (tstamp dbcbc366-a8b5-49e4-ace3-3c5af9701cab))
    (fp_line (start -0.32 -7.94) (end 1.5 -7.94) (layer "B.Fab") (width 0.1) (tstamp e1f1830e-344b-49cf-84b9-18ac1f4b2dd9))
    (fp_line (start -0.32 -13.02) (end 1.5 -13.02) (layer "B.Fab") (width 0.1) (tstamp e31139c7-e54a-4b0f-9c08-3acf003ba3b4))
    (fp_line (start 4.04 -13.02) (end 10.04 -13.02) (layer "B.Fab") (width 0.1) (tstamp e77262b5-f62f-4329-9725-55d6964855d2))
    (fp_line (start 10.04 -7.3) (end 10.04 -7.94) (layer "B.Fab") (width 0.1) (tstamp ec2e4705-97c0-4454-ab3e-2278832ffc4c))
    (fp_line (start -0.32 0.32) (end 1.5 0.32) (layer "B.Fab") (width 0.1) (tstamp ec3b3849-ca42-4083-886d-a0f7beecb6ee))
    (fp_line (start -0.32 -9.84) (end -0.32 -10.48) (layer "B.Fab") (width 0.1) (tstamp f0d1cc5e-30fc-460a-b5a2-9cb40c84257b))
    (fp_line (start 10.04 -9.84) (end 10.04 -10.48) (layer "B.Fab") (width 0.1) (tstamp f47599b7-7c3b-4034-a3f4-b659b1d499ed))
    (fp_line (start -0.32 -4.76) (end 1.5 -4.76) (layer "B.Fab") (width 0.1) (tstamp feb0d451-96e2-46e0-bedd-c6b1240f9c5e))
    (fp_line (start -0.32 0.32) (end -0.32 -0.32) (layer "B.Fab") (width 0.1) (tstamp ffef85ad-caff-4437-bc4d-19a26b83dda5))
    (pad "1" thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 "/CHANNEL_1") (pinfunction "Pin_1") (pintype "passive") (tstamp bf1f5498-c5bc-4efc-aeb9-c4a052500934))
    (pad "2" thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_2") (pintype "passive") (tstamp adefae8a-afa2-47ac-89ba-da2a1df4a29b))
    (pad "3" thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 "/CHANNEL_2") (pinfunction "Pin_3") (pintype "passive") (tstamp 567698c2-fa68-4df7-b7cb-398042d5fc8f))
    (pad "4" thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_4") (pintype "passive") (tstamp ff62d321-595c-4d6b-8dd3-0eea3159a2ab))
    (pad "5" thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 "/CHANNEL_3") (pinfunction "Pin_5") (pintype "passive") (tstamp 48dbdb81-72a2-45a1-a144-e0e4bccac0ea))
    (pad "6" thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_6") (pintype "passive") (tstamp beb0224f-b9d6-41be-a1a0-4413b887154a))
    (pad "7" thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 "/CHANNEL_4") (pinfunction "Pin_7") (pintype "passive") (tstamp 900650b7-6371-417a-a2de-d1b464867765))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x07_P2.54mm_Horizontal.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp e79a998b-2423-403e-8608-efd042b1c562)
    (at 188.9625 45.7 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 1")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/cf56bf59-5fd6-463f-93f9-e9a134220c27/00e46d39-6f2c-40ca-b6ce-62f43b6eea38")
    (attr smd)
    (fp_text reference "C401" (at 4.5 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp d1d8c4a6-cc53-4298-8d80-3ebd3f3a01eb)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 2eba2666-e204-4ad8-a3df-f77e08f0f6e5)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp b353e84a-1906-40c3-8d19-bd78eaa97e81)
    )
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp 1d25a92b-904c-4456-a367-66e7f27885d9))
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp c878705a-2e70-4564-9181-f30be78ff5ac))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 4b2b77a6-01ee-4b49-be1b-c2d7fbf7f061))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 5e0ef9ff-cdff-4a0d-8510-118405195ae5))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 62eab441-92d3-4f77-940e-afebe1401f13))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 861700cd-4dd3-4777-9eb8-4283de08a1b8))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp a08df4b6-716d-4e02-92b6-5a89ece3bc40))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp b2382298-42d4-4b0c-88bf-28a46d86da49))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp e08fecd5-5a71-4f2a-9569-5311885ba7f2))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp f3679c87-2c0a-4611-8c0c-c6ac01d44698))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp addc31ac-b5f7-4571-ae54-5c6ff0f3be4f))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp bb629a80-45b5-44d7-8956-dfbe9a5650f4))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp e803fa13-3241-4a86-8e5b-e6af94949246)
    (at 188.5 62.4)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/8ffbe9b4-2e1e-43a7-b489-5a21c5a8afad")
    (attr smd)
    (fp_text reference "C602" (at -4.3 0) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 17271c8e-224c-4136-b989-8425f8ef956c)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 041e2a56-138c-4a6a-9b2a-4f6fbec2cca0)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp b91209ec-9ce4-4ef0-b2ad-f316505158c5)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 70d41397-46d8-4a87-a443-be213930a748))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp f58ba63a-76e0-4c5a-bdde-fcfbbdd90912))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 4bdced50-21a2-413c-8a52-413ae61c1e8a))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 5f1c2fd4-c05a-4761-8f38-283cdf480526))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp d037da72-d1d0-42b1-a9fa-97a7fc0eceb7))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp fa426e7c-21bc-4213-9fc8-6077d4fe0955))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 1ffe3d05-ee69-4521-abab-048d6fbbcdd0))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 45e93c48-c095-4d80-acc5-0c1e81371d19))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp dcf41804-4a92-47a7-9151-f9f9810c37ec))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp f9015449-aac4-46e7-ada0-f39a42942775))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 34 "/samplers/ADC 1/+3V3") (pintype "passive") (tstamp e678a37b-1244-4d5a-8f0e-36e9d2c9dcc7))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp a33106d5-3287-45d0-99bb-c7dbe6a0c473))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp e9d3ae0a-050e-4595-af77-f078a7ab2fb8)
    (at 195.2 66.5 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1764-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL21B106KPQNNNE")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 2")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/c3cb661d-127f-4a40-9047-4c9b7d9d2e58/9c65710d-18cb-411f-a58b-3d0a7fb65668")
    (attr smd)
    (fp_text reference "C616" (at -4.4 0.1) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 20082c1d-fa28-47ab-b2ee-664c67212de7)
    )
    (fp_text value "10u" (at 0 -1.68) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 6e8989a3-02d7-4100-9dfb-7b659fd0ac09)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.5 0.5) (thickness 0.08)) (justify mirror))
      (tstamp 995c2a7d-a338-49f2-b4f1-a1958793999f)
    )
    (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "B.SilkS") (width 0.12) (tstamp 9cb36eb0-a79f-42c4-b41e-e76883ad34f5))
    (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "B.SilkS") (width 0.12) (tstamp bc72d52d-309e-4823-9a2e-c6d575c64a69))
    (fp_line (start 1.88 0.98) (end 1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 28657a41-4031-4941-9574-7f0fb815c855))
    (fp_line (start 1.88 -0.98) (end -1.88 -0.98) (layer "B.CrtYd") (width 0.05) (tstamp 33ebf051-3102-42fc-a276-2101f9049302))
    (fp_line (start -1.88 0.98) (end 1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp 870a7e6d-2993-4dbf-be56-223f9417bf9c))
    (fp_line (start -1.88 -0.98) (end -1.88 0.98) (layer "B.CrtYd") (width 0.05) (tstamp c6c7ba88-eb78-4f74-9926-4e37fcd17bbf))
    (fp_line (start -1 -0.625) (end -1 0.625) (layer "B.Fab") (width 0.1) (tstamp 1e8f97d5-4f46-4427-8eab-b54ad724bbff))
    (fp_line (start 1 -0.625) (end -1 -0.625) (layer "B.Fab") (width 0.1) (tstamp 24181387-399e-4808-9b48-69928fcad593))
    (fp_line (start -1 0.625) (end 1 0.625) (layer "B.Fab") (width 0.1) (tstamp 7a9c7940-0226-4a91-9194-272a5b2edf28))
    (fp_line (start 1 0.625) (end 1 -0.625) (layer "B.Fab") (width 0.1) (tstamp c9d7b301-402e-43b3-ab94-bd38779d7bb6))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp 2546ac23-eb51-4b20-9d5b-edc69f9f2954))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 41 "/samplers/LVDS Serializer 2/+3V3_A") (pintype "passive") (tstamp bac8ace3-244a-412a-965a-dd59de086e88))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF) (tstamp fc6f231d-2371-4228-b13f-2e5c7f671e98)
    (at 196.5 81.5)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "DPN" "1276-1946-1-ND")
    (property "Distributor" "DigiKey")
    (property "MPN" "CL10B105KP8NNNC")
    (property "Manufacturer" "Samsung Electro-Mechanics")
    (property "Sheetfile" "lvds.kicad_sch")
    (property "Sheetname" "LVDS Serializer 3")
    (path "/c9d86e08-b59b-4ddb-a383-7fc843f9e0bb/a2932248-2ce5-4c43-85ef-26fbd339d7a6/b8173e5b-3247-4073-b968-f97dff8e75a6")
    (attr smd)
    (fp_text reference "C817" (at 4.7 -0.2) (layer "B.SilkS")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp 9681e152-b4ca-403f-9acf-21319f32ffae)
    )
    (fp_text value "1u" (at 0 -1.43) (layer "B.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
      (tstamp aeb39950-e5b1-4845-b017-85d65792e70f)
    )
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab")
      (effects (font (size 0.4 0.4) (thickness 0.06)) (justify mirror))
      (tstamp 39ee46c8-bd11-4a9e-8661-48d3e797ada6)
    )
    (fp_line (start -0.146267 0.51) (end 0.146267 0.51) (layer "B.SilkS") (width 0.12) (tstamp 09f2a618-8dbe-4c98-9687-37521047e47f))
    (fp_line (start -0.146267 -0.51) (end 0.146267 -0.51) (layer "B.SilkS") (width 0.12) (tstamp fa9d7454-beea-4118-b214-2397ea353595))
    (fp_line (start 1.65 -0.73) (end -1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 24256900-1a8f-49dd-8407-8904e4a18c69))
    (fp_line (start 1.65 0.73) (end 1.65 -0.73) (layer "B.CrtYd") (width 0.05) (tstamp 5468430c-2cdf-4195-a6b5-f40d2da118cf))
    (fp_line (start -1.65 -0.73) (end -1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp 8f966756-3cc8-49ac-9014-3459cf87e1d5))
    (fp_line (start -1.65 0.73) (end 1.65 0.73) (layer "B.CrtYd") (width 0.05) (tstamp c9f9cec1-99cb-43ca-b3a4-dd1b99dfc67e))
    (fp_line (start 0.8 0.4) (end 0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp 3ad04a51-4f6d-4c94-a175-0d316dfe477b))
    (fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 75abbf6f-b5de-452d-9eb1-8651ddbee425))
    (fp_line (start -0.8 0.4) (end 0.8 0.4) (layer "B.Fab") (width 0.1) (tstamp 7b8c110e-745d-46fe-b9f2-e4b8de73b415))
    (fp_line (start 0.8 -0.4) (end -0.8 -0.4) (layer "B.Fab") (width 0.1) (tstamp f4e0f825-ef9a-4d54-a28f-6e938fc08977))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 46 "/samplers/LVDS Serializer 3/+3V3_A") (pintype "passive") (tstamp 8de68c22-5894-46b6-9bd1-d9b66abbfae2))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 32 "/samplers/GND") (pintype "passive") (tstamp c0bd756b-7896-4266-8405-b89cd28b5fe3))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (via (at 218.7 60.2) (size 0.8) (drill 0.4) (layers "F.Cu" "B.Cu") (free) (net 1) (tstamp 3bf19d8d-21c1-40c9-95b7-0cabe844fd86))
  (via (at 217.4 62.1) (size 0.8) (drill 0.4) (layers "F.Cu" "B.Cu") (free) (net 1) (tstamp c1f50a1d-ec1b-4c89-b922-64b2088198b2))
  (segment (start 197.912501 64.375) (end 208.3068 64.375) (width 0.2) (layer "F.Cu") (net 20) (tstamp 36afbf78-5d32-431f-9851-32d898f43240))
  (segment (start 197.812501 64.275) (end 197.912501 64.375) (width 0.2) (layer "F.Cu") (net 20) (tstamp 619b4938-f788-4559-ac11-54cb8c421dc8))
  (segment (start 196.5 64.275) (end 197.812501 64.275) (width 0.2) (layer "F.Cu") (net 20) (tstamp 8e3304e0-3ae8-4f82-8913-632f2a101fa0))
  (segment (start 218.965 60.875) (end 220.32 62.23) (width 0.2) (layer "F.Cu") (net 20) (tstamp c213f706-498d-417c-a6c5-b164cc945f8a))
  (segment (start 211.8068 60.875) (end 218.965 60.875) (width 0.2) (layer "F.Cu") (net 20) (tstamp cbfc6b42-a671-4204-8116-1f15276d857c))
  (segment (start 208.3068 64.375) (end 211.8068 60.875) (width 0.2) (layer "F.Cu") (net 20) (tstamp f96bbedb-2586-4f52-b55a-710bb88e2b89))
  (segment (start 208.4932 64.825) (end 197.912501 64.825) (width 0.2) (layer "F.Cu") (net 21) (tstamp 01852053-2f0b-45e7-a730-2d2b296ce53c))
  (segment (start 197.912501 64.825) (end 197.812501 64.925) (width 0.2) (layer "F.Cu") (net 21) (tstamp 16ec98e7-700d-4bd0-9bc6-7bb40826de97))
  (segment (start 218.5 61.325) (end 211.9932 61.325) (width 0.2) (layer "F.Cu") (net 21) (tstamp b5512614-0ccf-471a-a4f2-af1839415b66))
  (segment (start 197.812501 64.925) (end 196.5 64.925) (width 0.2) (layer "F.Cu") (net 21) (tstamp c016cdca-f21a-4bbe-b40a-ca14f1b5b8d9))
  (segment (start 211.9932 61.325) (end 208.4932 64.825) (width 0.2) (layer "F.Cu") (net 21) (tstamp cef52d9d-6f82-457b-9540-da833fd180c8))
  (segment (start 218.630885 61.7) (end 218.5 61.569115) (width 0.2) (layer "F.Cu") (net 21) (tstamp de046875-7db6-49ec-840e-5bb74183beb2))
  (segment (start 218.5 61.569115) (end 218.5 61.325) (width 0.2) (layer "F.Cu") (net 21) (tstamp df842c44-5392-4bde-aa8e-51be85364c25))
  (via (at 218.630885 61.7) (size 0.8) (drill 0.4) (layers "F.Cu" "B.Cu") (net 21) (tstamp 733dc672-2c3c-4c91-9440-c9364fcf7b8f))
  (segment (start 218.630885 61.379115) (end 220.32 59.69) (width 0.2) (layer "B.Cu") (net 21) (tstamp 26c27be0-a35e-471d-b848-eb31369912bf))
  (segment (start 218.630885 61.7) (end 218.630885 61.379115) (width 0.2) (layer "B.Cu") (net 21) (tstamp 467623d1-d041-40c2-bf3c-a2b40ca6779b))
  (segment (start 223.4932 47.475) (end 225.225 49.2068) (width 0.2) (layer "F.Cu") (net 24) (tstamp 12395a78-8aef-4abc-916a-5d3d5f8e7963))
  (segment (start 204.1932 43.675) (end 207.9932 47.475) (width 0.2) (layer "F.Cu") (net 24) (tstamp 24993458-30a8-47aa-80cc-4e3d563d9d4c))
  (segment (start 198.175001 43.675) (end 204.1932 43.675) (width 0.2) (layer "F.Cu") (net 24) (tstamp 54cd306b-3255-403a-95a0-078b0a66bcb7))
  (segment (start 196.7625 43.575) (end 198.075001 43.575) (width 0.2) (layer "F.Cu") (net 24) (tstamp 617701f6-8b38-4a74-abcc-cc5b6b5f4f07))
  (segment (start 225.225 49.2068) (end 225.225 59.865) (width 0.2) (layer "F.Cu") (net 24) (tstamp 70ac9bd3-780f-453d-86c0-936154bf8dc3))
  (segment (start 198.075001 43.575) (end 198.175001 43.675) (width 0.2) (layer "F.Cu") (net 24) (tstamp 828a2ae4-7146-4f6a-931d-c963ab35129b))
  (segment (start 207.9932 47.475) (end 223.4932 47.475) (width 0.2) (layer "F.Cu") (net 24) (tstamp 8b227c7b-3514-4add-919c-5d97058cb91f))
  (segment (start 225.225 59.865) (end 222.86 62.23) (width 0.2) (layer "F.Cu") (net 24) (tstamp a7d3cc52-3ecd-4200-9f7a-e889d758f09e))
  (segment (start 198.075001 44.225) (end 198.175001 44.125) (width 0.2) (layer "F.Cu") (net 25) (tstamp 021ff2f2-c088-4563-85b5-ac7f5be691ef))
  (segment (start 198.175001 44.125) (end 204.0068 44.125) (width 0.2) (layer "F.Cu") (net 25) (tstamp 13bcbca8-f257-46fa-9e5f-56e600a2ef74))
  (segment (start 196.7625 44.225) (end 198.075001 44.225) (width 0.2) (layer "F.Cu") (net 25) (tstamp 1fa8788a-b6a8-4784-888a-d5b9aa810344))
  (segment (start 224.775 59.678603) (end 224.763603 59.69) (width 0.2) (layer "F.Cu") (net 25) (tstamp 32b259f3-d507-429b-87e3-f3830c521955))
  (segment (start 224.763603 59.69) (end 222.86 59.69) (width 0.2) (layer "F.Cu") (net 25) (tstamp 5cb8b497-7794-4452-b76b-fee10560efce))
  (segment (start 207.8068 47.925) (end 223.3068 47.925) (width 0.2) (layer "F.Cu") (net 25) (tstamp 7c284344-23a6-4d0f-a0b1-ce1dca4208ef))
  (segment (start 224.775 49.3932) (end 224.775 59.678603) (width 0.2) (layer "F.Cu") (net 25) (tstamp 95df3338-a602-4856-91c6-7f9bf62f67a2))
  (segment (start 223.3068 47.925) (end 224.775 49.3932) (width 0.2) (layer "F.Cu") (net 25) (tstamp a815d5e1-0fb3-4a7e-a18e-7537d9a47f7d))
  (segment (start 204.0068 44.125) (end 207.8068 47.925) (width 0.2) (layer "F.Cu") (net 25) (tstamp b8c95903-592c-4dac-b4ae-c3ee906d01aa))

  (group "" (id ec5b919c-4a29-4969-887f-efe556a3073d)
    (members
      7f65c0b9-8d71-427d-869f-269b2c93f1dc
      a4fe9f30-ba88-43ef-bd67-2da9ad171359
    )
  )
)
